DK1094915T3 - Fremgangsmåde til indkapsling af loddemetalpulvere og loddemetalpulvere fremstillet verd denne fremgangsmåde - Google Patents

Fremgangsmåde til indkapsling af loddemetalpulvere og loddemetalpulvere fremstillet verd denne fremgangsmåde

Info

Publication number
DK1094915T3
DK1094915T3 DK99939356T DK99939356T DK1094915T3 DK 1094915 T3 DK1094915 T3 DK 1094915T3 DK 99939356 T DK99939356 T DK 99939356T DK 99939356 T DK99939356 T DK 99939356T DK 1094915 T3 DK1094915 T3 DK 1094915T3
Authority
DK
Denmark
Prior art keywords
solder powders
encapsulating
solder
prepared
metal
Prior art date
Application number
DK99939356T
Other languages
Danish (da)
English (en)
Inventor
Juergen Schulze
Walter Protsch
Original Assignee
Juergen Schulze
Walter Protsch
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juergen Schulze, Walter Protsch filed Critical Juergen Schulze
Application granted granted Critical
Publication of DK1094915T3 publication Critical patent/DK1094915T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2984—Microcapsule with fluid core [includes liposome]
    • Y10T428/2985—Solid-walled microcapsule from synthetic polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Powder Metallurgy (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Image Analysis (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Polymerisation Methods In General (AREA)
DK99939356T 1998-06-15 1999-06-15 Fremgangsmåde til indkapsling af loddemetalpulvere og loddemetalpulvere fremstillet verd denne fremgangsmåde DK1094915T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19826756A DE19826756C2 (de) 1998-06-15 1998-06-15 Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver
PCT/DE1999/001777 WO1999065640A1 (de) 1998-06-15 1999-06-15 Verfahren zum verkapseln von lotmetallpulver und danach hergestellte lotmetallpulver

Publications (1)

Publication Number Publication Date
DK1094915T3 true DK1094915T3 (da) 2004-01-05

Family

ID=7871020

Family Applications (1)

Application Number Title Priority Date Filing Date
DK99939356T DK1094915T3 (da) 1998-06-15 1999-06-15 Fremgangsmåde til indkapsling af loddemetalpulvere og loddemetalpulvere fremstillet verd denne fremgangsmåde

Country Status (14)

Country Link
US (1) US6416863B1 (enExample)
EP (1) EP1094915B1 (enExample)
JP (1) JP3783031B2 (enExample)
KR (1) KR100549612B1 (enExample)
CN (1) CN1106905C (enExample)
AT (1) ATE249308T1 (enExample)
BR (1) BR9911173A (enExample)
CA (1) CA2335002C (enExample)
DE (2) DE19826756C2 (enExample)
DK (1) DK1094915T3 (enExample)
ID (1) ID27425A (enExample)
IL (2) IL140053A0 (enExample)
NZ (1) NZ508383A (enExample)
WO (1) WO1999065640A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3888573B2 (ja) * 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
ATE412691T1 (de) 2005-01-13 2008-11-15 Cinv Ag Kohlenstoffnanopartikel enthaltende verbundwerkstoffe
WO2010059924A2 (en) 2008-11-21 2010-05-27 Henkel Corporation Thermally decomposable polymer coated metal powders
JP5879686B2 (ja) 2009-10-15 2016-03-08 東レ株式会社 コアシェル粒子の製造方法、コアシェル粒子およびそれを用いたペースト組成物ならびにシート組成物
US9682447B2 (en) 2010-08-20 2017-06-20 Henkel IP & Holding GmbH Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes
GB2491387A (en) * 2011-06-02 2012-12-05 Magnequench Ltd Rare earth material capsule used in making a magnet
CN102220550B (zh) * 2011-06-13 2012-07-04 苏州国通科技有限公司 一种锡熔液保护剂
CN103945961B (zh) 2011-09-06 2017-01-18 汉高知识产权控股有限责任公司 用于焊膏的涂覆有二官能或多官能缺电子烯烃的金属粉末
JP5947238B2 (ja) 2013-03-25 2016-07-06 株式会社日立製作所 ペースト、アルミニウム電線体、アルミニウム電線体の製造方法、モータ及びモータの製造方法
WO2015146999A1 (ja) 2014-03-25 2015-10-01 住友金属鉱山株式会社 被覆はんだ材料およびその製造方法
US9878039B1 (en) 2016-09-01 2018-01-30 International Business Machines Corporation Microcapsule having a microcapsule shell material that is rupturable via a retro-dimerization reaction
US10328535B2 (en) 2016-11-07 2019-06-25 International Business Machines Corporation Self-heating solder flux material
CN108722000B (zh) * 2018-05-25 2020-09-29 中国人民解放军63908部队 十二烷基三甲基溴化铵在固-液云爆剂组分分离中的应用及方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3736653A (en) * 1970-05-07 1973-06-05 Ncr Co Process for soldering using pre-fluxed solder powder
JP2564152B2 (ja) * 1987-10-27 1996-12-18 タムラ化研株式会社 はんだペースト
US4944326A (en) * 1989-09-08 1990-07-31 Su Yueh Hsieh Inlet valve for water tanks
US5272007A (en) * 1992-02-21 1993-12-21 Union Carbide Chemicals & Plastics Technology Corporation Solder powder coated with parylene
DE4402042A1 (de) * 1994-01-25 1994-06-09 Kunststoff Maschinen Handelsge Mikropartikulierte Reflow-Lötmittel und Verfahren zu deren Herstellung
US5922403A (en) * 1996-03-12 1999-07-13 Tecle; Berhan Method for isolating ultrafine and fine particles

Also Published As

Publication number Publication date
DE59906970D1 (de) 2003-10-16
EP1094915A1 (de) 2001-05-02
DE19826756A1 (de) 2000-01-13
CA2335002C (en) 2004-12-07
DE19826756C2 (de) 2002-04-18
WO1999065640A1 (de) 1999-12-23
ID27425A (id) 2001-04-05
IL140053A (en) 2006-04-10
IL140053A0 (en) 2002-02-10
JP2002518182A (ja) 2002-06-25
KR100549612B1 (ko) 2006-02-03
NZ508383A (en) 2003-03-28
CN1106905C (zh) 2003-04-30
JP3783031B2 (ja) 2006-06-07
US6416863B1 (en) 2002-07-09
ATE249308T1 (de) 2003-09-15
BR9911173A (pt) 2001-03-20
KR20010071362A (ko) 2001-07-28
EP1094915B1 (de) 2003-09-10
CN1305403A (zh) 2001-07-25
CA2335002A1 (en) 1999-12-23

Similar Documents

Publication Publication Date Title
DK1094915T3 (da) Fremgangsmåde til indkapsling af loddemetalpulvere og loddemetalpulvere fremstillet verd denne fremgangsmåde
AU4164999A (en) Solder powder, flux, solder paste, method for soldering, soldered circuit board and soldered junction product
WO2004088725A3 (de) Verfahren zum mehrstufigen herstellen von diffusionslötverbindungen für leistungsbauteile mit halbleiterchips
WO2003064102A8 (en) Solder metal, soldering flux and solder paste
MX9706314A (es) Metodo para fijar partes del conductor y la caja de blindaje al tablero de circuito impreso, y metodo para fijar partes del circuito integrado, partes del conductor y la caja de blindaje al tablero de circuito impreso.
AU1107288A (en) Method of fabrication of ceramic powders and powders obtained
MY139006A (en) Lead solder indicator and method
JPS53118209A (en) Powder metallurgical method of manufacturing high-silicon containing sinteted aluminum alloy
WO2001086715A3 (de) Verfahren zum verlöten einer ersten metallschicht, die eine dicke von weniger als 5 $g(m)m aufweist, mit einer zweiten metallschicht, löteinrichtung und halbleiterchip-montagevorrichtung
JPS5782455A (en) Low expansive alloy
JPS5219105A (en) Nonoxidative sintering and forging method
JPS53124150A (en) Alloy soldering material
WO2002025698A3 (de) Kühlkörper zur kühlung insbesondere elektronischer bauelemente
JPS5435847A (en) Fixing method for metal foil
JPS5339494A (en) Jointing method between lead-covered cable and housing
JPS5394885A (en) Mount structure for semiconductor laser element
JPS5374369A (en) Semiconductor ceramic package
JPS52125378A (en) Temperature measuring method
JPS5411488A (en) Terminal soldering
JPS53118243A (en) Bond flux submerged-arc welding
JPS53132267A (en) Hermetic sealing method of semiconductor element
JPS5244566A (en) Method of alloying semiconductor pellet
JPS5235310A (en) Thermo-regulating method for melting metal in magnetic pump
JPS5326573A (en) Semiconductor uni t
JPS54101671A (en) Electronic parts