JP3783031B2 - 軟ろう粉末をカプセル化する方法およびそれによって製造される軟ろう粉末 - Google Patents

軟ろう粉末をカプセル化する方法およびそれによって製造される軟ろう粉末 Download PDF

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Publication number
JP3783031B2
JP3783031B2 JP2000554502A JP2000554502A JP3783031B2 JP 3783031 B2 JP3783031 B2 JP 3783031B2 JP 2000554502 A JP2000554502 A JP 2000554502A JP 2000554502 A JP2000554502 A JP 2000554502A JP 3783031 B2 JP3783031 B2 JP 3783031B2
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JP
Japan
Prior art keywords
powder
soft
soft solder
layer
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000554502A
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English (en)
Japanese (ja)
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JP2002518182A5 (enExample
JP2002518182A (ja
Inventor
シュルツェ・ユルゲン
プロッチュ・ヴァルター
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
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WC Heraus GmbH and Co KG
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Publication date
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Publication of JP2002518182A publication Critical patent/JP2002518182A/ja
Publication of JP2002518182A5 publication Critical patent/JP2002518182A5/ja
Application granted granted Critical
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Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2984—Microcapsule with fluid core [includes liposome]
    • Y10T428/2985—Solid-walled microcapsule from synthetic polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Polymerisation Methods In General (AREA)
  • Image Analysis (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP2000554502A 1998-06-15 1999-06-15 軟ろう粉末をカプセル化する方法およびそれによって製造される軟ろう粉末 Expired - Fee Related JP3783031B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19826756.8 1998-06-15
DE19826756A DE19826756C2 (de) 1998-06-15 1998-06-15 Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver
PCT/DE1999/001777 WO1999065640A1 (de) 1998-06-15 1999-06-15 Verfahren zum verkapseln von lotmetallpulver und danach hergestellte lotmetallpulver

Publications (3)

Publication Number Publication Date
JP2002518182A JP2002518182A (ja) 2002-06-25
JP2002518182A5 JP2002518182A5 (enExample) 2006-01-05
JP3783031B2 true JP3783031B2 (ja) 2006-06-07

Family

ID=7871020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000554502A Expired - Fee Related JP3783031B2 (ja) 1998-06-15 1999-06-15 軟ろう粉末をカプセル化する方法およびそれによって製造される軟ろう粉末

Country Status (14)

Country Link
US (1) US6416863B1 (enExample)
EP (1) EP1094915B1 (enExample)
JP (1) JP3783031B2 (enExample)
KR (1) KR100549612B1 (enExample)
CN (1) CN1106905C (enExample)
AT (1) ATE249308T1 (enExample)
BR (1) BR9911173A (enExample)
CA (1) CA2335002C (enExample)
DE (2) DE19826756C2 (enExample)
DK (1) DK1094915T3 (enExample)
ID (1) ID27425A (enExample)
IL (2) IL140053A0 (enExample)
NZ (1) NZ508383A (enExample)
WO (1) WO1999065640A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3888573B2 (ja) * 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
WO2006074809A2 (en) 2005-01-13 2006-07-20 Cinvention Ag Composite materials containing carbon nanoparticles
PL2370219T3 (pl) 2008-11-21 2015-03-31 Henkel US IP LLC Powlekane ulegającym rozkładowi termicznemu polimerem proszki metali
KR20120099001A (ko) 2009-10-15 2012-09-06 도레이 카부시키가이샤 코어 쉘 입자의 제조 방법, 코어 쉘 입자 및 그것을 사용한 페이스트 조성물 및 시트 조성물
US9682447B2 (en) 2010-08-20 2017-06-20 Henkel IP & Holding GmbH Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes
GB2491387A (en) * 2011-06-02 2012-12-05 Magnequench Ltd Rare earth material capsule used in making a magnet
CN102220550B (zh) * 2011-06-13 2012-07-04 苏州国通科技有限公司 一种锡熔液保护剂
KR101879018B1 (ko) 2011-09-06 2018-07-16 헨켈 아이피 앤드 홀딩 게엠베하 솔더 페이스트용 이- 또는 다-관능성 전자 결핍 올레핀 코팅된 금속 분말
JP5947238B2 (ja) * 2013-03-25 2016-07-06 株式会社日立製作所 ペースト、アルミニウム電線体、アルミニウム電線体の製造方法、モータ及びモータの製造方法
CN106211763B (zh) 2014-03-25 2019-08-27 住友金属矿山株式会社 包覆焊料材料及其制造方法
US9878039B1 (en) 2016-09-01 2018-01-30 International Business Machines Corporation Microcapsule having a microcapsule shell material that is rupturable via a retro-dimerization reaction
US10328535B2 (en) 2016-11-07 2019-06-25 International Business Machines Corporation Self-heating solder flux material
CN108722000B (zh) * 2018-05-25 2020-09-29 中国人民解放军63908部队 十二烷基三甲基溴化铵在固-液云爆剂组分分离中的应用及方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3736653A (en) * 1970-05-07 1973-06-05 Ncr Co Process for soldering using pre-fluxed solder powder
JP2564152B2 (ja) * 1987-10-27 1996-12-18 タムラ化研株式会社 はんだペースト
US4944326A (en) * 1989-09-08 1990-07-31 Su Yueh Hsieh Inlet valve for water tanks
US5272007A (en) * 1992-02-21 1993-12-21 Union Carbide Chemicals & Plastics Technology Corporation Solder powder coated with parylene
DE4402042A1 (de) * 1994-01-25 1994-06-09 Kunststoff Maschinen Handelsge Mikropartikulierte Reflow-Lötmittel und Verfahren zu deren Herstellung
US5922403A (en) * 1996-03-12 1999-07-13 Tecle; Berhan Method for isolating ultrafine and fine particles

Also Published As

Publication number Publication date
CN1305403A (zh) 2001-07-25
DE19826756C2 (de) 2002-04-18
DE59906970D1 (de) 2003-10-16
WO1999065640A1 (de) 1999-12-23
CA2335002A1 (en) 1999-12-23
CA2335002C (en) 2004-12-07
CN1106905C (zh) 2003-04-30
IL140053A (en) 2006-04-10
US6416863B1 (en) 2002-07-09
KR20010071362A (ko) 2001-07-28
ATE249308T1 (de) 2003-09-15
EP1094915B1 (de) 2003-09-10
DE19826756A1 (de) 2000-01-13
IL140053A0 (en) 2002-02-10
JP2002518182A (ja) 2002-06-25
EP1094915A1 (de) 2001-05-02
ID27425A (id) 2001-04-05
DK1094915T3 (da) 2004-01-05
NZ508383A (en) 2003-03-28
KR100549612B1 (ko) 2006-02-03
BR9911173A (pt) 2001-03-20

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