NZ508383A - Method for encapsulating fine solder metal powders - Google Patents
Method for encapsulating fine solder metal powdersInfo
- Publication number
- NZ508383A NZ508383A NZ508383A NZ50838399A NZ508383A NZ 508383 A NZ508383 A NZ 508383A NZ 508383 A NZ508383 A NZ 508383A NZ 50838399 A NZ50838399 A NZ 50838399A NZ 508383 A NZ508383 A NZ 508383A
- Authority
- NZ
- New Zealand
- Prior art keywords
- powder
- solder
- metal
- temperature
- polymerization reaction
- Prior art date
Links
- 239000000843 powder Substances 0.000 title abstract 10
- 229910000679 solder Inorganic materials 0.000 title abstract 7
- 239000002184 metal Substances 0.000 title abstract 6
- 238000000034 method Methods 0.000 title abstract 3
- 230000002209 hydrophobic effect Effects 0.000 abstract 3
- 238000003756 stirring Methods 0.000 abstract 3
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 239000010410 layer Substances 0.000 abstract 2
- 238000006116 polymerization reaction Methods 0.000 abstract 2
- 238000002360 preparation method Methods 0.000 abstract 2
- 239000011241 protective layer Substances 0.000 abstract 2
- 239000000725 suspension Substances 0.000 abstract 2
- 229920001169 thermoplastic Polymers 0.000 abstract 2
- 238000012695 Interfacial polymerization Methods 0.000 abstract 1
- 239000002775 capsule Substances 0.000 abstract 1
- 125000002091 cationic group Chemical group 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 239000003995 emulsifying agent Substances 0.000 abstract 1
- 230000004907 flux Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 230000005661 hydrophobic surface Effects 0.000 abstract 1
- 238000010348 incorporation Methods 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000002923 metal particle Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 239000000178 monomer Substances 0.000 abstract 1
- 230000001590 oxidative effect Effects 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 230000006641 stabilisation Effects 0.000 abstract 1
- 238000011105 stabilization Methods 0.000 abstract 1
- 239000002344 surface layer Substances 0.000 abstract 1
- 238000005496 tempering Methods 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2984—Microcapsule with fluid core [includes liposome]
- Y10T428/2985—Solid-walled microcapsule from synthetic polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31609—Particulate metal or metal compound-containing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Polymerisation Methods In General (AREA)
- Image Analysis (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19826756A DE19826756C2 (de) | 1998-06-15 | 1998-06-15 | Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver |
| PCT/DE1999/001777 WO1999065640A1 (de) | 1998-06-15 | 1999-06-15 | Verfahren zum verkapseln von lotmetallpulver und danach hergestellte lotmetallpulver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NZ508383A true NZ508383A (en) | 2003-03-28 |
Family
ID=7871020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NZ508383A NZ508383A (en) | 1998-06-15 | 1999-06-15 | Method for encapsulating fine solder metal powders |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US6416863B1 (enExample) |
| EP (1) | EP1094915B1 (enExample) |
| JP (1) | JP3783031B2 (enExample) |
| KR (1) | KR100549612B1 (enExample) |
| CN (1) | CN1106905C (enExample) |
| AT (1) | ATE249308T1 (enExample) |
| BR (1) | BR9911173A (enExample) |
| CA (1) | CA2335002C (enExample) |
| DE (2) | DE19826756C2 (enExample) |
| DK (1) | DK1094915T3 (enExample) |
| ID (1) | ID27425A (enExample) |
| IL (2) | IL140053A0 (enExample) |
| NZ (1) | NZ508383A (enExample) |
| WO (1) | WO1999065640A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3888573B2 (ja) * | 2001-06-29 | 2007-03-07 | 富士電機ホールディングス株式会社 | ハンダ組成物 |
| WO2006074809A2 (en) | 2005-01-13 | 2006-07-20 | Cinvention Ag | Composite materials containing carbon nanoparticles |
| PL2370219T3 (pl) | 2008-11-21 | 2015-03-31 | Henkel US IP LLC | Powlekane ulegającym rozkładowi termicznemu polimerem proszki metali |
| KR20120099001A (ko) | 2009-10-15 | 2012-09-06 | 도레이 카부시키가이샤 | 코어 쉘 입자의 제조 방법, 코어 쉘 입자 및 그것을 사용한 페이스트 조성물 및 시트 조성물 |
| US9682447B2 (en) | 2010-08-20 | 2017-06-20 | Henkel IP & Holding GmbH | Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes |
| GB2491387A (en) * | 2011-06-02 | 2012-12-05 | Magnequench Ltd | Rare earth material capsule used in making a magnet |
| CN102220550B (zh) * | 2011-06-13 | 2012-07-04 | 苏州国通科技有限公司 | 一种锡熔液保护剂 |
| KR101879018B1 (ko) | 2011-09-06 | 2018-07-16 | 헨켈 아이피 앤드 홀딩 게엠베하 | 솔더 페이스트용 이- 또는 다-관능성 전자 결핍 올레핀 코팅된 금속 분말 |
| JP5947238B2 (ja) * | 2013-03-25 | 2016-07-06 | 株式会社日立製作所 | ペースト、アルミニウム電線体、アルミニウム電線体の製造方法、モータ及びモータの製造方法 |
| CN106211763B (zh) | 2014-03-25 | 2019-08-27 | 住友金属矿山株式会社 | 包覆焊料材料及其制造方法 |
| US9878039B1 (en) | 2016-09-01 | 2018-01-30 | International Business Machines Corporation | Microcapsule having a microcapsule shell material that is rupturable via a retro-dimerization reaction |
| US10328535B2 (en) | 2016-11-07 | 2019-06-25 | International Business Machines Corporation | Self-heating solder flux material |
| CN108722000B (zh) * | 2018-05-25 | 2020-09-29 | 中国人民解放军63908部队 | 十二烷基三甲基溴化铵在固-液云爆剂组分分离中的应用及方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3736653A (en) * | 1970-05-07 | 1973-06-05 | Ncr Co | Process for soldering using pre-fluxed solder powder |
| JP2564152B2 (ja) * | 1987-10-27 | 1996-12-18 | タムラ化研株式会社 | はんだペースト |
| US4944326A (en) * | 1989-09-08 | 1990-07-31 | Su Yueh Hsieh | Inlet valve for water tanks |
| US5272007A (en) * | 1992-02-21 | 1993-12-21 | Union Carbide Chemicals & Plastics Technology Corporation | Solder powder coated with parylene |
| DE4402042A1 (de) * | 1994-01-25 | 1994-06-09 | Kunststoff Maschinen Handelsge | Mikropartikulierte Reflow-Lötmittel und Verfahren zu deren Herstellung |
| US5922403A (en) * | 1996-03-12 | 1999-07-13 | Tecle; Berhan | Method for isolating ultrafine and fine particles |
-
1998
- 1998-06-15 DE DE19826756A patent/DE19826756C2/de not_active Expired - Fee Related
-
1999
- 1999-06-15 BR BR9911173-0A patent/BR9911173A/pt not_active IP Right Cessation
- 1999-06-15 DK DK99939356T patent/DK1094915T3/da active
- 1999-06-15 US US09/719,281 patent/US6416863B1/en not_active Expired - Lifetime
- 1999-06-15 DE DE59906970T patent/DE59906970D1/de not_active Expired - Fee Related
- 1999-06-15 EP EP99939356A patent/EP1094915B1/de not_active Expired - Lifetime
- 1999-06-15 WO PCT/DE1999/001777 patent/WO1999065640A1/de not_active Ceased
- 1999-06-15 JP JP2000554502A patent/JP3783031B2/ja not_active Expired - Fee Related
- 1999-06-15 CN CN99807440A patent/CN1106905C/zh not_active Expired - Fee Related
- 1999-06-15 NZ NZ508383A patent/NZ508383A/xx unknown
- 1999-06-15 CA CA002335002A patent/CA2335002C/en not_active Expired - Fee Related
- 1999-06-15 AT AT99939356T patent/ATE249308T1/de not_active IP Right Cessation
- 1999-06-15 IL IL14005399A patent/IL140053A0/xx active IP Right Grant
- 1999-06-15 ID IDW20002606A patent/ID27425A/id unknown
- 1999-06-15 KR KR1020007013564A patent/KR100549612B1/ko not_active Expired - Fee Related
-
2000
- 2000-12-03 IL IL140053A patent/IL140053A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1305403A (zh) | 2001-07-25 |
| DE19826756C2 (de) | 2002-04-18 |
| DE59906970D1 (de) | 2003-10-16 |
| WO1999065640A1 (de) | 1999-12-23 |
| CA2335002A1 (en) | 1999-12-23 |
| CA2335002C (en) | 2004-12-07 |
| JP3783031B2 (ja) | 2006-06-07 |
| CN1106905C (zh) | 2003-04-30 |
| IL140053A (en) | 2006-04-10 |
| US6416863B1 (en) | 2002-07-09 |
| KR20010071362A (ko) | 2001-07-28 |
| ATE249308T1 (de) | 2003-09-15 |
| EP1094915B1 (de) | 2003-09-10 |
| DE19826756A1 (de) | 2000-01-13 |
| IL140053A0 (en) | 2002-02-10 |
| JP2002518182A (ja) | 2002-06-25 |
| EP1094915A1 (de) | 2001-05-02 |
| ID27425A (id) | 2001-04-05 |
| DK1094915T3 (da) | 2004-01-05 |
| KR100549612B1 (ko) | 2006-02-03 |
| BR9911173A (pt) | 2001-03-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PSEA | Patent sealed | ||
| RENW | Renewal (renewal fees accepted) | ||
| ASS | Change of ownership |
Owner name: W.C. HERAEUS GMBH, DE Free format text: OLD OWNER(S): JURGEN SCHULZE; WALTER PROTSCH |
|
| RENW | Renewal (renewal fees accepted) |