KR100549612B1 - 땜납 금속 분말 캡슐화 방법 및 그 방법에 따라 제조된땜납 금속 분말 - Google Patents

땜납 금속 분말 캡슐화 방법 및 그 방법에 따라 제조된땜납 금속 분말 Download PDF

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Publication number
KR100549612B1
KR100549612B1 KR1020007013564A KR20007013564A KR100549612B1 KR 100549612 B1 KR100549612 B1 KR 100549612B1 KR 1020007013564 A KR1020007013564 A KR 1020007013564A KR 20007013564 A KR20007013564 A KR 20007013564A KR 100549612 B1 KR100549612 B1 KR 100549612B1
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KR
South Korea
Prior art keywords
solder
powder
polymer
solder metal
hydrophobic
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Expired - Fee Related
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KR1020007013564A
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English (en)
Korean (ko)
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KR20010071362A (ko
Inventor
발터 프로취
위르겐 슐체
Original Assignee
발터 프로취
위르겐 슐체
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Publication date
Application filed by 발터 프로취, 위르겐 슐체 filed Critical 발터 프로취
Publication of KR20010071362A publication Critical patent/KR20010071362A/ko
Application granted granted Critical
Publication of KR100549612B1 publication Critical patent/KR100549612B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2984—Microcapsule with fluid core [includes liposome]
    • Y10T428/2985—Solid-walled microcapsule from synthetic polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Image Analysis (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Polymerisation Methods In General (AREA)
KR1020007013564A 1998-06-15 1999-06-15 땜납 금속 분말 캡슐화 방법 및 그 방법에 따라 제조된땜납 금속 분말 Expired - Fee Related KR100549612B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19826756A DE19826756C2 (de) 1998-06-15 1998-06-15 Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver
DE19826756.8 1998-06-15
PCT/DE1999/001777 WO1999065640A1 (de) 1998-06-15 1999-06-15 Verfahren zum verkapseln von lotmetallpulver und danach hergestellte lotmetallpulver

Publications (2)

Publication Number Publication Date
KR20010071362A KR20010071362A (ko) 2001-07-28
KR100549612B1 true KR100549612B1 (ko) 2006-02-03

Family

ID=7871020

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007013564A Expired - Fee Related KR100549612B1 (ko) 1998-06-15 1999-06-15 땜납 금속 분말 캡슐화 방법 및 그 방법에 따라 제조된땜납 금속 분말

Country Status (14)

Country Link
US (1) US6416863B1 (enExample)
EP (1) EP1094915B1 (enExample)
JP (1) JP3783031B2 (enExample)
KR (1) KR100549612B1 (enExample)
CN (1) CN1106905C (enExample)
AT (1) ATE249308T1 (enExample)
BR (1) BR9911173A (enExample)
CA (1) CA2335002C (enExample)
DE (2) DE19826756C2 (enExample)
DK (1) DK1094915T3 (enExample)
ID (1) ID27425A (enExample)
IL (2) IL140053A0 (enExample)
NZ (1) NZ508383A (enExample)
WO (1) WO1999065640A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3888573B2 (ja) * 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
BRPI0519754A2 (pt) 2005-01-13 2009-03-10 Cinv Ag materiais compàsitos contendo nanopartÍculas de carbono
CN102264491B (zh) 2008-11-21 2014-11-26 汉高公司 可热分解聚合物涂布的金属粉末
CN102574934B (zh) 2009-10-15 2013-10-16 东丽株式会社 核壳颗粒的制造方法、核壳颗粒和使用该核壳颗粒的糊料组合物以及片材组合物
US9682447B2 (en) 2010-08-20 2017-06-20 Henkel IP & Holding GmbH Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes
GB2491387A (en) * 2011-06-02 2012-12-05 Magnequench Ltd Rare earth material capsule used in making a magnet
CN102220550B (zh) * 2011-06-13 2012-07-04 苏州国通科技有限公司 一种锡熔液保护剂
JP6050364B2 (ja) 2011-09-06 2016-12-21 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング はんだペースト用の二官能性または多官能性電子不足オレフィン被覆金属粉末
JP5947238B2 (ja) 2013-03-25 2016-07-06 株式会社日立製作所 ペースト、アルミニウム電線体、アルミニウム電線体の製造方法、モータ及びモータの製造方法
WO2015146999A1 (ja) 2014-03-25 2015-10-01 住友金属鉱山株式会社 被覆はんだ材料およびその製造方法
US9878039B1 (en) 2016-09-01 2018-01-30 International Business Machines Corporation Microcapsule having a microcapsule shell material that is rupturable via a retro-dimerization reaction
US10328535B2 (en) 2016-11-07 2019-06-25 International Business Machines Corporation Self-heating solder flux material
CN108722000B (zh) * 2018-05-25 2020-09-29 中国人民解放军63908部队 十二烷基三甲基溴化铵在固-液云爆剂组分分离中的应用及方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3736653A (en) * 1970-05-07 1973-06-05 Ncr Co Process for soldering using pre-fluxed solder powder
JP2564152B2 (ja) 1987-10-27 1996-12-18 タムラ化研株式会社 はんだペースト
US4944326A (en) * 1989-09-08 1990-07-31 Su Yueh Hsieh Inlet valve for water tanks
US5272007A (en) * 1992-02-21 1993-12-21 Union Carbide Chemicals & Plastics Technology Corporation Solder powder coated with parylene
DE4402042A1 (de) * 1994-01-25 1994-06-09 Kunststoff Maschinen Handelsge Mikropartikulierte Reflow-Lötmittel und Verfahren zu deren Herstellung
US5922403A (en) 1996-03-12 1999-07-13 Tecle; Berhan Method for isolating ultrafine and fine particles

Also Published As

Publication number Publication date
CA2335002C (en) 2004-12-07
CN1106905C (zh) 2003-04-30
ID27425A (id) 2001-04-05
WO1999065640A1 (de) 1999-12-23
ATE249308T1 (de) 2003-09-15
NZ508383A (en) 2003-03-28
IL140053A0 (en) 2002-02-10
EP1094915A1 (de) 2001-05-02
US6416863B1 (en) 2002-07-09
IL140053A (en) 2006-04-10
CN1305403A (zh) 2001-07-25
KR20010071362A (ko) 2001-07-28
EP1094915B1 (de) 2003-09-10
CA2335002A1 (en) 1999-12-23
JP2002518182A (ja) 2002-06-25
DE59906970D1 (de) 2003-10-16
BR9911173A (pt) 2001-03-20
DE19826756C2 (de) 2002-04-18
DK1094915T3 (da) 2004-01-05
JP3783031B2 (ja) 2006-06-07
DE19826756A1 (de) 2000-01-13

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