CN1106905C - 焊料金属粉末的封装方法和按此方法制得的焊料金属粉末 - Google Patents

焊料金属粉末的封装方法和按此方法制得的焊料金属粉末 Download PDF

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Publication number
CN1106905C
CN1106905C CN99807440A CN99807440A CN1106905C CN 1106905 C CN1106905 C CN 1106905C CN 99807440 A CN99807440 A CN 99807440A CN 99807440 A CN99807440 A CN 99807440A CN 1106905 C CN1106905 C CN 1106905C
Authority
CN
China
Prior art keywords
solder metal
metal powder
powder
layer
hydrophobic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN99807440A
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English (en)
Chinese (zh)
Other versions
CN1305403A (zh
Inventor
于尔根·舒尔策
沃尔特·普罗奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Will Kome Ltd
WC Heraus GmbH and Co KG
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CN1305403A publication Critical patent/CN1305403A/zh
Application granted granted Critical
Publication of CN1106905C publication Critical patent/CN1106905C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2984—Microcapsule with fluid core [includes liposome]
    • Y10T428/2985—Solid-walled microcapsule from synthetic polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Polymerisation Methods In General (AREA)
  • Image Analysis (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
CN99807440A 1998-06-15 1999-06-15 焊料金属粉末的封装方法和按此方法制得的焊料金属粉末 Expired - Fee Related CN1106905C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19826756.8 1998-06-15
DE19826756A DE19826756C2 (de) 1998-06-15 1998-06-15 Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver

Publications (2)

Publication Number Publication Date
CN1305403A CN1305403A (zh) 2001-07-25
CN1106905C true CN1106905C (zh) 2003-04-30

Family

ID=7871020

Family Applications (1)

Application Number Title Priority Date Filing Date
CN99807440A Expired - Fee Related CN1106905C (zh) 1998-06-15 1999-06-15 焊料金属粉末的封装方法和按此方法制得的焊料金属粉末

Country Status (14)

Country Link
US (1) US6416863B1 (enExample)
EP (1) EP1094915B1 (enExample)
JP (1) JP3783031B2 (enExample)
KR (1) KR100549612B1 (enExample)
CN (1) CN1106905C (enExample)
AT (1) ATE249308T1 (enExample)
BR (1) BR9911173A (enExample)
CA (1) CA2335002C (enExample)
DE (2) DE19826756C2 (enExample)
DK (1) DK1094915T3 (enExample)
ID (1) ID27425A (enExample)
IL (2) IL140053A0 (enExample)
NZ (1) NZ508383A (enExample)
WO (1) WO1999065640A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3888573B2 (ja) * 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
WO2006074809A2 (en) 2005-01-13 2006-07-20 Cinvention Ag Composite materials containing carbon nanoparticles
PL2370219T3 (pl) 2008-11-21 2015-03-31 Henkel US IP LLC Powlekane ulegającym rozkładowi termicznemu polimerem proszki metali
KR20120099001A (ko) 2009-10-15 2012-09-06 도레이 카부시키가이샤 코어 쉘 입자의 제조 방법, 코어 쉘 입자 및 그것을 사용한 페이스트 조성물 및 시트 조성물
US9682447B2 (en) 2010-08-20 2017-06-20 Henkel IP & Holding GmbH Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes
GB2491387A (en) * 2011-06-02 2012-12-05 Magnequench Ltd Rare earth material capsule used in making a magnet
CN102220550B (zh) * 2011-06-13 2012-07-04 苏州国通科技有限公司 一种锡熔液保护剂
KR101879018B1 (ko) 2011-09-06 2018-07-16 헨켈 아이피 앤드 홀딩 게엠베하 솔더 페이스트용 이- 또는 다-관능성 전자 결핍 올레핀 코팅된 금속 분말
JP5947238B2 (ja) * 2013-03-25 2016-07-06 株式会社日立製作所 ペースト、アルミニウム電線体、アルミニウム電線体の製造方法、モータ及びモータの製造方法
CN106211763B (zh) 2014-03-25 2019-08-27 住友金属矿山株式会社 包覆焊料材料及其制造方法
US9878039B1 (en) 2016-09-01 2018-01-30 International Business Machines Corporation Microcapsule having a microcapsule shell material that is rupturable via a retro-dimerization reaction
US10328535B2 (en) 2016-11-07 2019-06-25 International Business Machines Corporation Self-heating solder flux material
CN108722000B (zh) * 2018-05-25 2020-09-29 中国人民解放军63908部队 十二烷基三甲基溴化铵在固-液云爆剂组分分离中的应用及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4944326A (en) * 1989-09-08 1990-07-31 Su Yueh Hsieh Inlet valve for water tanks
WO1997033713A1 (en) * 1996-03-12 1997-09-18 Berhan Tecle Method for isolating ultrafine and fine particles and resulting particles

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3736653A (en) * 1970-05-07 1973-06-05 Ncr Co Process for soldering using pre-fluxed solder powder
JP2564152B2 (ja) * 1987-10-27 1996-12-18 タムラ化研株式会社 はんだペースト
US5272007A (en) * 1992-02-21 1993-12-21 Union Carbide Chemicals & Plastics Technology Corporation Solder powder coated with parylene
DE4402042A1 (de) * 1994-01-25 1994-06-09 Kunststoff Maschinen Handelsge Mikropartikulierte Reflow-Lötmittel und Verfahren zu deren Herstellung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4944326A (en) * 1989-09-08 1990-07-31 Su Yueh Hsieh Inlet valve for water tanks
WO1997033713A1 (en) * 1996-03-12 1997-09-18 Berhan Tecle Method for isolating ultrafine and fine particles and resulting particles

Also Published As

Publication number Publication date
CN1305403A (zh) 2001-07-25
DE19826756C2 (de) 2002-04-18
DE59906970D1 (de) 2003-10-16
WO1999065640A1 (de) 1999-12-23
CA2335002A1 (en) 1999-12-23
CA2335002C (en) 2004-12-07
JP3783031B2 (ja) 2006-06-07
IL140053A (en) 2006-04-10
US6416863B1 (en) 2002-07-09
KR20010071362A (ko) 2001-07-28
ATE249308T1 (de) 2003-09-15
EP1094915B1 (de) 2003-09-10
DE19826756A1 (de) 2000-01-13
IL140053A0 (en) 2002-02-10
JP2002518182A (ja) 2002-06-25
EP1094915A1 (de) 2001-05-02
ID27425A (id) 2001-04-05
DK1094915T3 (da) 2004-01-05
NZ508383A (en) 2003-03-28
KR100549612B1 (ko) 2006-02-03
BR9911173A (pt) 2001-03-20

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: WILLCOM CO., LTD.

Free format text: FORMER OWNER: JERGEN SCHULZE; WALTER PROTSCH

Effective date: 20060106

Owner name: W.C. HERAEUS LTD.

Free format text: FORMER OWNER: WILLCOM CO., LTD.

Effective date: 20060106

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20060106

Address after: Hanau

Patentee after: W. C. Heraeus GmbH

Address before: Hanau

Patentee before: Will Kome Ltd.

Effective date of registration: 20060106

Address after: Hanau

Patentee after: Will Kome Ltd.

Address before: postdam

Co-patentee before: Protsch Walter

Patentee before: Jergen Schulze

C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee