DE1614242A1 - Verfahren zur Herstellung von Halbleitervorrichtungen - Google Patents

Verfahren zur Herstellung von Halbleitervorrichtungen

Info

Publication number
DE1614242A1
DE1614242A1 DE19671614242 DE1614242A DE1614242A1 DE 1614242 A1 DE1614242 A1 DE 1614242A1 DE 19671614242 DE19671614242 DE 19671614242 DE 1614242 A DE1614242 A DE 1614242A DE 1614242 A1 DE1614242 A1 DE 1614242A1
Authority
DE
Germany
Prior art keywords
strip
conductors
shaped
bridge
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19671614242
Other languages
German (de)
English (en)
Inventor
Jacobus Eigeman
Van De Water Peter Wilhe Maria
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE1614242A1 publication Critical patent/DE1614242A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE19671614242 1966-04-28 1967-04-25 Verfahren zur Herstellung von Halbleitervorrichtungen Pending DE1614242A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6605674A NL6605674A (https=) 1966-04-28 1966-04-28

Publications (1)

Publication Number Publication Date
DE1614242A1 true DE1614242A1 (de) 1970-05-27

Family

ID=19796427

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19671614242 Pending DE1614242A1 (de) 1966-04-28 1967-04-25 Verfahren zur Herstellung von Halbleitervorrichtungen

Country Status (11)

Country Link
AT (1) AT268381B (https=)
BE (1) BE697849A (https=)
CH (1) CH470759A (https=)
DE (1) DE1614242A1 (https=)
DK (1) DK116949B (https=)
ES (1) ES339806A1 (https=)
FR (1) FR1550982A (https=)
GB (1) GB1125428A (https=)
NL (1) NL6605674A (https=)
NO (1) NO120123B (https=)
SE (1) SE309455B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3210623A1 (de) * 1982-03-23 1983-10-06 Siemens Ag Verfahren zum verhindern der bildung von graten bei der umhuellung von bauelementen
DE3320700A1 (de) * 1983-06-08 1984-12-13 Siemens AG, 1000 Berlin und 8000 München Verfahren zum kunststoffumhuellen von elektrischen bauelementen
DE3446647A1 (de) * 1984-02-22 1985-08-29 Kabushiki Kaisha Toshiba, Kawasaki, Kanagawa Verfahren zur herstellung von kunstharzversiegelten halbleitervorrichtungen

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3406538A1 (de) * 1984-02-23 1985-08-29 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung
FR2638594B1 (fr) * 1988-11-03 1990-12-21 Cartier Systemes G Procede de realisation d'un circuit electrique de puissance monocouche ou multicouches, et circuit obtenu par ce procede

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3210623A1 (de) * 1982-03-23 1983-10-06 Siemens Ag Verfahren zum verhindern der bildung von graten bei der umhuellung von bauelementen
DE3320700A1 (de) * 1983-06-08 1984-12-13 Siemens AG, 1000 Berlin und 8000 München Verfahren zum kunststoffumhuellen von elektrischen bauelementen
DE3446647A1 (de) * 1984-02-22 1985-08-29 Kabushiki Kaisha Toshiba, Kawasaki, Kanagawa Verfahren zur herstellung von kunstharzversiegelten halbleitervorrichtungen

Also Published As

Publication number Publication date
BE697849A (https=) 1967-10-30
GB1125428A (en) 1968-08-28
SE309455B (https=) 1969-03-24
CH470759A (de) 1969-03-31
AT268381B (de) 1969-02-10
DK116949B (da) 1970-03-02
ES339806A1 (es) 1968-05-16
NO120123B (https=) 1970-08-31
NL6605674A (https=) 1967-10-30
FR1550982A (https=) 1968-12-27

Similar Documents

Publication Publication Date Title
DE2858750C2 (https=)
DE4310288A1 (de) Metall-Widerstand
DE1564334A1 (de) Plastikgekapselter Transistor und Verfahren zu seiner Herstellung
DE2045214C3 (de) Piezoelektrische Kristallanordnung
DE1614242A1 (de) Verfahren zur Herstellung von Halbleitervorrichtungen
DE1816808A1 (de) Gedruckte Schaltung
DE8008351U1 (de) Mehradriger Verbinder
DE1912547A1 (de) Widerstandsschaltung mit auf einer isolierenden Unterschicht befindlichen Leiter- und Widerstandsbereichen
DE8715341U1 (de) Schaltungselement
DE3040676C2 (https=)
DE7146117U (de) Doppelseitiger Schalter mit Anschlüsse aufnehmenden Teilen
DE1791233B1 (de) Verfahren zur Herstellung eines Funktionsblocks,insbesondere fuer datenverarbeitende Anlagen
DE2257888A1 (de) Abschlussleiste fuer steckbare bauelemente
DE2249730C3 (de) Halbleiteranordnung mit einer mit Leiterbahnen versehenen isolierenden FoUe
DE2114075A1 (de) Trockenelektrolytkondensator und Verfahren zu seiner Herstellung
DE952911C (de) Anschlussstreifen mit einer Anzahl gegeneinander isolierter Kontaktstreifen und Verfahren zur Herstellung desselben
DE2629259C2 (de) Verfahren zur Herstellung eines Steckverbinders
DE905502C (de) Fernmeldekabelendverschluss
DE1614273B2 (de) Verfahren zur herstellung eines hochspannungsgleichrichters
DE2001312A1 (de) Biegsame isolierende Folie mit einem Muster von Leiterbahnen
DE1614524C3 (de) Halterung für ein magnetisches Bauelement
DE1465736C (de) Funktionsblock. insbesondere fur datenverarbeitende Anlagen
DE2109885A1 (de) Festwertspeicher
DE1614273C3 (de) Verfahren zur Herstellung eines Hochspannungsgleichrichters
DE2118521C3 (de) Hall-Generator und Verfahren zu seiner Herstellung