DE1444514B2 - Verfahren zur herstellung eines epitaktisch auf ein einkristallines substrat aufgewachsenen filmes aus halbleiterverbindungen - Google Patents

Verfahren zur herstellung eines epitaktisch auf ein einkristallines substrat aufgewachsenen filmes aus halbleiterverbindungen

Info

Publication number
DE1444514B2
DE1444514B2 DE19631444514 DE1444514A DE1444514B2 DE 1444514 B2 DE1444514 B2 DE 1444514B2 DE 19631444514 DE19631444514 DE 19631444514 DE 1444514 A DE1444514 A DE 1444514A DE 1444514 B2 DE1444514 B2 DE 1444514B2
Authority
DE
Germany
Prior art keywords
hydrogen
film
gallium
grown
reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19631444514
Other languages
German (de)
English (en)
Other versions
DE1444514A1 (de
Inventor
Forrest Vaughan Ballwin Mo Williams (V St A )
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Monsanto Co
Original Assignee
Monsanto Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monsanto Co filed Critical Monsanto Co
Publication of DE1444514A1 publication Critical patent/DE1444514A1/de
Publication of DE1444514B2 publication Critical patent/DE1444514B2/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40—Crystalline structures
    • H10D62/405—Orientations of crystalline planes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2907—Materials being Group IIIA-VA materials
    • H10P14/2909—Phosphides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2907—Materials being Group IIIA-VA materials
    • H10P14/2911—Arsenides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2926—Crystal orientations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3418—Phosphides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3421—Arsenides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H10P14/3444—P-type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3466—Crystal orientation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/056—Gallium arsenide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/057—Gas flow control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/065—Gp III-V generic compounds-processing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/067—Graded energy gap
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/072—Heterojunctions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/115—Orientation

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
DE19631444514 1962-07-13 1963-07-13 Verfahren zur herstellung eines epitaktisch auf ein einkristallines substrat aufgewachsenen filmes aus halbleiterverbindungen Pending DE1444514B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US209776A US3146137A (en) 1962-07-13 1962-07-13 Smooth epitaxial compound films having a uniform thickness by vapor depositing on the (100) crystallographic plane of the substrate

Publications (2)

Publication Number Publication Date
DE1444514A1 DE1444514A1 (de) 1970-02-19
DE1444514B2 true DE1444514B2 (de) 1971-03-11

Family

ID=22780224

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19631444514 Pending DE1444514B2 (de) 1962-07-13 1963-07-13 Verfahren zur herstellung eines epitaktisch auf ein einkristallines substrat aufgewachsenen filmes aus halbleiterverbindungen

Country Status (4)

Country Link
US (1) US3146137A (enExample)
DE (1) DE1444514B2 (enExample)
GB (1) GB1038946A (enExample)
NL (1) NL295293A (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1060474A (en) * 1963-03-27 1967-03-01 Siemens Ag The production of monocrystalline semiconductor bodies of silicon or germanium
GB1094831A (en) * 1965-07-21 1967-12-13 Standard Telephones Cables Ltd Semiconductor junction devices
FR1489613A (enExample) * 1965-08-19 1967-11-13
US3421952A (en) * 1966-02-02 1969-01-14 Texas Instruments Inc Method of making high resistivity group iii-v compounds and alloys doped with iron from an iron-arsenide source
US4404265A (en) * 1969-10-01 1983-09-13 Rockwell International Corporation Epitaxial composite and method of making
US4368098A (en) * 1969-10-01 1983-01-11 Rockwell International Corporation Epitaxial composite and method of making
DE2100692A1 (de) * 1970-01-09 1971-07-15 Hitachi Ltd Verfahren zum Herstellen einer epitaxisch gewachsenen Schicht eines GaAs tief 1 χ P tief χ Halbleitermaterial
JPS5027480B1 (enExample) * 1971-07-28 1975-09-08
US4284467A (en) * 1972-02-14 1981-08-18 Hewlett-Packard Company Method for making semiconductor material
US3888705A (en) * 1973-12-19 1975-06-10 Nasa Vapor phase growth of groups iii-v compounds by hydrogen chloride transport of the elements
US4050964A (en) * 1975-12-01 1977-09-27 Bell Telephone Laboratories, Incorporated Growing smooth epitaxial layers on misoriented substrates
US4214926A (en) * 1976-07-02 1980-07-29 Tdk Electronics Co., Ltd. Method of doping IIb or VIb group elements into a boron phosphide semiconductor
US4147571A (en) * 1977-07-11 1979-04-03 Hewlett-Packard Company Method for vapor epitaxial deposition of III/V materials utilizing organometallic compounds and a halogen or halide in a hot wall system
US4407694A (en) * 1981-06-22 1983-10-04 Hughes Aircraft Company Multi-range doping of epitaxial III-V layers from a single source
US4908074A (en) * 1986-02-28 1990-03-13 Kyocera Corporation Gallium arsenide on sapphire heterostructure
DE3885436T2 (de) * 1987-12-29 1994-05-19 Nippon Electric Co Halbleiterkristallstruktur und deren Herstellungsverfahren.
US4935383A (en) * 1988-09-23 1990-06-19 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Preparation of dilute magnetic semiconductor films by metalorganic chemical vapor deposition
NL9000973A (nl) * 1990-04-24 1991-11-18 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting.
US5169485A (en) * 1991-03-07 1992-12-08 Bell Communications Research, Inc. Method for the preparation of epitaxial ferromagnetic manganese aluminum magnetic memory element
US5532511A (en) * 1992-10-23 1996-07-02 Research Development Corp. Of Japan Semiconductor device comprising a highspeed static induction transistor
US7851916B2 (en) * 2005-03-17 2010-12-14 Taiwan Semiconductor Manufacturing Co., Ltd. Strain silicon wafer with a crystal orientation (100) in flip chip BGA package
JP2007150097A (ja) * 2005-11-29 2007-06-14 Toshiba Corp 半導体素子およびその製造方法
WO2008064080A1 (en) * 2006-11-22 2008-05-29 S.O.I.Tec Silicon On Insulator Technologies High volume delivery system for gallium trichloride
US9481943B2 (en) 2006-11-22 2016-11-01 Soitec Gallium trichloride injection scheme
WO2008127425A2 (en) 2006-11-22 2008-10-23 S.O.I.Tec Silicon On Insulator Technologies Abatement of reaction gases from gallium nitride deposition
US9580836B2 (en) * 2006-11-22 2017-02-28 Soitec Equipment for high volume manufacture of group III-V semiconductor materials
WO2008130448A2 (en) 2006-11-22 2008-10-30 S.O.I.Tec Silicon On Insulator Technologies Temperature-controlled purge gate valve for chemical vapor deposition chamber
US9481944B2 (en) 2006-11-22 2016-11-01 Soitec Gas injectors including a funnel- or wedge-shaped channel for chemical vapor deposition (CVD) systems and CVD systems with the same
US8382898B2 (en) 2006-11-22 2013-02-26 Soitec Methods for high volume manufacture of group III-V semiconductor materials
EP2084304B1 (en) * 2006-11-22 2013-06-26 Soitec Method and apparatus for the epitaxial deposition of monocrystalline group iii-v semiconductor material using gallium trichloride
US8486192B2 (en) 2010-09-30 2013-07-16 Soitec Thermalizing gas injectors for generating increased precursor gas, material deposition systems including such injectors, and related methods
US8133806B1 (en) 2010-09-30 2012-03-13 S.O.I.Tec Silicon On Insulator Technologies Systems and methods for forming semiconductor materials by atomic layer deposition
CN103370782A (zh) * 2010-10-28 2013-10-23 犹他大学研究基金会 用于增强III-V半导体膜中的p-型掺杂的方法
US9557378B2 (en) * 2012-07-20 2017-01-31 Globalfoundries Inc. Method and structure for multi-core chip product test and selective voltage binning disposition

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE509317A (enExample) * 1951-03-07 1900-01-01
US2858275A (en) * 1954-12-23 1958-10-28 Siemens Ag Mixed-crystal semiconductor devices
DE1029941B (de) * 1955-07-13 1958-05-14 Siemens Ag Verfahren zur Herstellung von einkristallinen Halbleiterschichten

Also Published As

Publication number Publication date
GB1038946A (en) 1966-08-17
NL295293A (enExample)
DE1444514A1 (de) 1970-02-19
US3146137A (en) 1964-08-25

Similar Documents

Publication Publication Date Title
DE69008862T2 (de) Procede de metallisation sous vide permettant le depot d'un compose organo-metallique sur un substrat.
DE2214404C3 (de) Verfahren zum Herstellen epitaktischer Dünnschichten im Molekularstrahl-Epitaxieverfahren
DE69031660T2 (de) Lichtemittierende Halbleiteranordnung und deren Herstellungsverfahren
DE1444514A1 (de) Verfahren zur Herstellung von verbesserten Epitaxialfilmen
DE3620329C2 (enExample)
DE2231926A1 (de) Verfahren zur herstellung von halbleitermaterial und zur herstellung von halbleitereinrichtungen
DE1444508A1 (de) Verfahren zum epitaktischen Aufwachsen eines Filmes
DE3743938A1 (de) Verfahren zum atomschicht-epitaxie-verfahren
DE2830081A1 (de) Verfahren zum herstellen eines halbleitermateriales der gruppen iii/v des periodischen systems
DE1965258B2 (de) Verfahren zur Herstellung einer epitaktischen Schicht
DE2840331A1 (de) Verfahren zum aufbringen einer halbleitenden verbindung von elementen der gruppen iii und v des periodensystems
DE2005271C3 (de) Epitaxialverfahren zum Aufwachsen von Halbleitermaterial auf einem dotierten Halbleitersubstrat
DE3526824C2 (enExample)
DE3781016T2 (de) Verfahren zur zuechtung eines multikomponent-kristalls.
DE2927454C2 (enExample)
DE1444505A1 (de) Verfahren zur Herstellung von Einkristallverbindungen
DE3237536C2 (de) Verfahren zur Herstellung eines p-leitenden (II/VI)-Verbindungshalbleiterkristalls
DE69011142T2 (de) Kompositmaterial.
DE69228631T2 (de) Verfahren zur Kristallzüchtung eines III-V Verbindungshalbleiters
DE19622704A1 (de) Epitaxialwafer und Verfahren zu seiner Herstellung
DE68902249T2 (de) Verfahren zur herstellung von halbleitenden einkristallen.
DE3689387T2 (de) Verfahren zur Herstellung einer Dünnschicht aus GaAs.
DE1719498A1 (de) Epitaxialwachstum von Galliumarsenid
DE2522921A1 (de) Molekularstrahl-epitaxie
DE1667604B1 (de) Verfahren zur herstellung von kristallinem cadmiumtellurid