DE1253008B - Verfahren zum AEtzen von Kupferfolien fuer die Herstellung von gedruckten Schaltungen - Google Patents
Verfahren zum AEtzen von Kupferfolien fuer die Herstellung von gedruckten SchaltungenInfo
- Publication number
- DE1253008B DE1253008B DED45263A DED0045263A DE1253008B DE 1253008 B DE1253008 B DE 1253008B DE D45263 A DED45263 A DE D45263A DE D0045263 A DED0045263 A DE D0045263A DE 1253008 B DE1253008 B DE 1253008B
- Authority
- DE
- Germany
- Prior art keywords
- bath
- etching
- percent
- weight
- solutions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 title claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 18
- 238000000034 method Methods 0.000 title claims description 15
- 239000011889 copper foil Substances 0.000 title claims description 4
- 238000004519 manufacturing process Methods 0.000 title description 3
- 239000010949 copper Substances 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 14
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 7
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims description 5
- 239000012190 activator Substances 0.000 claims description 4
- 239000004160 Ammonium persulphate Substances 0.000 claims description 3
- 235000019395 ammonium persulphate Nutrition 0.000 claims description 3
- -1 ferrous metals Chemical class 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 5
- 229910001385 heavy metal Inorganic materials 0.000 claims 3
- LWJROJCJINYWOX-UHFFFAOYSA-L mercury dichloride Chemical compound Cl[Hg]Cl LWJROJCJINYWOX-UHFFFAOYSA-L 0.000 claims 3
- 235000011007 phosphoric acid Nutrition 0.000 claims 3
- 150000003839 salts Chemical class 0.000 claims 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 2
- 150000001768 cations Chemical class 0.000 claims 2
- 239000003381 stabilizer Substances 0.000 claims 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims 1
- 238000000354 decomposition reaction Methods 0.000 claims 1
- 238000007654 immersion Methods 0.000 claims 1
- 235000011149 sulphuric acid Nutrition 0.000 claims 1
- 239000002253 acid Substances 0.000 description 5
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 5
- 150000007513 acids Chemical class 0.000 description 4
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 4
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 4
- 229910052500 inorganic mineral Inorganic materials 0.000 description 4
- 239000011707 mineral Substances 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- AQLJVWUFPCUVLO-UHFFFAOYSA-N urea hydrogen peroxide Chemical compound OO.NC(N)=O AQLJVWUFPCUVLO-UHFFFAOYSA-N 0.000 description 1
- 230000035899 viability Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DED45263A DE1253008B (de) | 1964-08-22 | 1964-08-22 | Verfahren zum AEtzen von Kupferfolien fuer die Herstellung von gedruckten Schaltungen |
| FR26820A FR1442848A (fr) | 1964-08-22 | 1965-07-31 | Procédé de préparation de bain gravant, notamment pour la gravure de circuits imprimés ainsi que les bains et les circuits imprimés conformes à ceux obtenus par le présent procédé ou procédé similaire |
| GB33405/65A GB1063007A (en) | 1964-08-22 | 1965-08-04 | A process for etching printed circuits |
| BE668423D BE668423A (OSRAM) | 1964-08-22 | 1965-08-17 | |
| US480750A US3373113A (en) | 1964-08-22 | 1965-08-18 | Process for etching copper printed circuits |
| NL6510928A NL6510928A (OSRAM) | 1964-08-22 | 1965-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DED45263A DE1253008B (de) | 1964-08-22 | 1964-08-22 | Verfahren zum AEtzen von Kupferfolien fuer die Herstellung von gedruckten Schaltungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1253008B true DE1253008B (de) | 1967-10-26 |
Family
ID=7048878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DED45263A Pending DE1253008B (de) | 1964-08-22 | 1964-08-22 | Verfahren zum AEtzen von Kupferfolien fuer die Herstellung von gedruckten Schaltungen |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3373113A (OSRAM) |
| BE (1) | BE668423A (OSRAM) |
| DE (1) | DE1253008B (OSRAM) |
| FR (1) | FR1442848A (OSRAM) |
| GB (1) | GB1063007A (OSRAM) |
| NL (1) | NL6510928A (OSRAM) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT997791B (it) * | 1972-11-10 | 1975-12-30 | Matsushita Electric Industrial Co Ltd | Metodo per fabbricare una membrana selettiva per ioni |
| US3869401A (en) * | 1972-12-04 | 1975-03-04 | Du Pont | Stabilized acidic hydrogen peroxide solutions |
| US3864271A (en) * | 1972-12-04 | 1975-02-04 | Du Pont | Stabilized acidic hydrogen peroxide solutions |
| JPS526853B2 (OSRAM) * | 1972-12-22 | 1977-02-25 | ||
| US3953263A (en) * | 1973-11-26 | 1976-04-27 | Hitachi, Ltd. | Process for preventing the formation of nitrogen monoxide in treatment of metals with nitric acid or mixed acid |
| JPS5124537A (en) * | 1974-08-26 | 1976-02-27 | Hitachi Ltd | Etsuchinguyokuno saiseihoho |
| US4356069A (en) * | 1981-03-09 | 1982-10-26 | Ross Cunningham | Stripping composition and method for preparing and using same |
| US4378270A (en) * | 1981-10-29 | 1983-03-29 | Learonal, Inc. | Method of etching circuit boards and recovering copper from the spent etch solutions |
| US4401509A (en) * | 1982-09-07 | 1983-08-30 | Fmc Corporation | Composition and process for printed circuit etching using a sulfuric acid solution containing hydrogen peroxide |
| US4497687A (en) * | 1983-07-28 | 1985-02-05 | Psi Star, Inc. | Aqueous process for etching cooper and other metals |
| US4491500A (en) * | 1984-02-17 | 1985-01-01 | Rem Chemicals, Inc. | Method for refinement of metal surfaces |
| JP2909743B2 (ja) * | 1989-03-08 | 1999-06-23 | 富山日本電気株式会社 | 銅または銅合金の化学研磨方法 |
| GB8922504D0 (en) * | 1989-10-05 | 1989-11-22 | Interox Chemicals Ltd | Hydrogen peroxide solutions |
| DE4026015A1 (de) * | 1990-08-17 | 1992-02-20 | Hoechst Ag | Verfahren zur herstellung von formkoerpern aus vorstufen oxidischer hochtemperatursupraleiter |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2211400A (en) * | 1938-08-10 | 1940-08-13 | Chase Brass & Copper Co | Pickling solution for copper-base alloys |
| US2428804A (en) * | 1945-09-07 | 1947-10-14 | Esther M Terry | Copper cleaning composition |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2923608A (en) * | 1956-04-13 | 1960-02-02 | Fmc Corp | Method of improving the bonding properties of steel surfaces |
| US2978301A (en) * | 1957-01-11 | 1961-04-04 | Fmc Corp | Process and composition for the dissolution of copper |
| US2982625A (en) * | 1957-03-22 | 1961-05-02 | Sylvania Electric Prod | Etchant and method |
| GB955000A (en) * | 1961-04-13 | 1964-04-08 | Marconi Co Ltd | Improvements in or relating to copper etching solutions |
-
1964
- 1964-08-22 DE DED45263A patent/DE1253008B/de active Pending
-
1965
- 1965-07-31 FR FR26820A patent/FR1442848A/fr not_active Expired
- 1965-08-04 GB GB33405/65A patent/GB1063007A/en not_active Expired
- 1965-08-17 BE BE668423D patent/BE668423A/xx unknown
- 1965-08-18 US US480750A patent/US3373113A/en not_active Expired - Lifetime
- 1965-08-20 NL NL6510928A patent/NL6510928A/xx unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2211400A (en) * | 1938-08-10 | 1940-08-13 | Chase Brass & Copper Co | Pickling solution for copper-base alloys |
| US2428804A (en) * | 1945-09-07 | 1947-10-14 | Esther M Terry | Copper cleaning composition |
Also Published As
| Publication number | Publication date |
|---|---|
| FR1442848A (fr) | 1966-06-17 |
| GB1063007A (en) | 1967-03-22 |
| US3373113A (en) | 1968-03-12 |
| BE668423A (OSRAM) | 1965-12-16 |
| NL6510928A (OSRAM) | 1966-02-23 |
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