DE112022004444T5 - Halbleitervorrichtung und Speichervorrichtung - Google Patents

Halbleitervorrichtung und Speichervorrichtung Download PDF

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Publication number
DE112022004444T5
DE112022004444T5 DE112022004444.6T DE112022004444T DE112022004444T5 DE 112022004444 T5 DE112022004444 T5 DE 112022004444T5 DE 112022004444 T DE112022004444 T DE 112022004444T DE 112022004444 T5 DE112022004444 T5 DE 112022004444T5
Authority
DE
Germany
Prior art keywords
conductor
insulator
oxide
transistor
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022004444.6T
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German (de)
English (en)
Inventor
Hidekazu Miyairi
Motoki Nakashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of DE112022004444T5 publication Critical patent/DE112022004444T5/de
Pending legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/01Manufacture or treatment
    • H10B12/02Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/05Making the transistor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/50Peripheral circuit region structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • H10D1/692Electrodes
    • H10D1/711Electrodes having non-planar surfaces, e.g. formed by texturisation
    • H10D1/716Electrodes having non-planar surfaces, e.g. formed by texturisation having vertical extensions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/01Manufacture or treatment
    • H10B12/02Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03Making the capacitor or connections thereto
    • H10B12/036Making the capacitor or connections thereto the capacitor extending under the transistor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/33DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor extending under the transistor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6728Vertical TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Semiconductor Memories (AREA)
DE112022004444.6T 2021-09-17 2022-09-02 Halbleitervorrichtung und Speichervorrichtung Pending DE112022004444T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021151971 2021-09-17
JP2021-151971 2021-09-17
PCT/IB2022/058239 WO2023042022A1 (ja) 2021-09-17 2022-09-02 半導体装置、記憶装置

Publications (1)

Publication Number Publication Date
DE112022004444T5 true DE112022004444T5 (de) 2024-07-25

Family

ID=85602489

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022004444.6T Pending DE112022004444T5 (de) 2021-09-17 2022-09-02 Halbleitervorrichtung und Speichervorrichtung

Country Status (8)

Country Link
US (1) US20240298435A1 (https=)
EP (1) EP4404275A4 (https=)
JP (1) JPWO2023042022A1 (https=)
KR (1) KR20240056760A (https=)
CN (1) CN117941078A (https=)
DE (1) DE112022004444T5 (https=)
TW (1) TW202320239A (https=)
WO (1) WO2023042022A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024025325A (ja) * 2022-08-12 2024-02-26 キオクシア株式会社 半導体装置
WO2024252246A1 (ja) * 2023-06-09 2024-12-12 株式会社半導体エネルギー研究所 半導体装置、半導体装置の作製方法
WO2025163448A1 (ja) * 2024-01-31 2025-08-07 株式会社半導体エネルギー研究所 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021108331A (ja) 2019-12-27 2021-07-29 キオクシア株式会社 半導体記憶装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG165252A1 (en) * 2009-03-25 2010-10-28 Unisantis Electronics Jp Ltd Semiconductor device and production method therefor
TWI435448B (zh) * 2010-12-22 2014-04-21 Chunghwa Picture Tubes Ltd 垂直式電晶體結構
WO2012121265A1 (en) * 2011-03-10 2012-09-13 Semiconductor Energy Laboratory Co., Ltd. Memory device and method for manufacturing the same
JP2015026782A (ja) * 2013-07-29 2015-02-05 マイクロン テクノロジー, インク. 半導体装置及びその製造方法
JP6509514B2 (ja) * 2014-09-17 2019-05-08 東芝メモリ株式会社 不揮発性半導体記憶装置及びその製造方法
JP7109928B2 (ja) * 2018-01-31 2022-08-01 キオクシア株式会社 トランジスタ及び半導体記憶装置並びにトランジスタの製造方法
CN112005350A (zh) * 2018-04-27 2020-11-27 株式会社半导体能源研究所 半导体装置
JP2021114563A (ja) * 2020-01-20 2021-08-05 キオクシア株式会社 半導体記憶装置
US12089412B2 (en) * 2020-03-26 2024-09-10 Intel NDTM US LLC Vertical string driver with extended gate junction structure

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021108331A (ja) 2019-12-27 2021-07-29 キオクシア株式会社 半導体記憶装置

Also Published As

Publication number Publication date
EP4404275A4 (en) 2025-09-17
WO2023042022A1 (ja) 2023-03-23
TW202320239A (zh) 2023-05-16
KR20240056760A (ko) 2024-04-30
JPWO2023042022A1 (https=) 2023-03-23
CN117941078A (zh) 2024-04-26
EP4404275A1 (en) 2024-07-24
US20240298435A1 (en) 2024-09-05

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