DE112021008563T5 - Montagevorrichtung und Verfahren zum Bestimmen der Biegung - Google Patents

Montagevorrichtung und Verfahren zum Bestimmen der Biegung Download PDF

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Publication number
DE112021008563T5
DE112021008563T5 DE112021008563.8T DE112021008563T DE112021008563T5 DE 112021008563 T5 DE112021008563 T5 DE 112021008563T5 DE 112021008563 T DE112021008563 T DE 112021008563T DE 112021008563 T5 DE112021008563 T5 DE 112021008563T5
Authority
DE
Germany
Prior art keywords
syringe
nozzle
determination
mounting
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021008563.8T
Other languages
German (de)
English (en)
Inventor
Shota Shimizu
Toshiaki Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Publication of DE112021008563T5 publication Critical patent/DE112021008563T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE112021008563.8T 2021-12-27 2021-12-27 Montagevorrichtung und Verfahren zum Bestimmen der Biegung Pending DE112021008563T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/048547 WO2023127006A1 (ja) 2021-12-27 2021-12-27 実装装置および曲がり判定方法

Publications (1)

Publication Number Publication Date
DE112021008563T5 true DE112021008563T5 (de) 2024-10-10

Family

ID=86998308

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021008563.8T Pending DE112021008563T5 (de) 2021-12-27 2021-12-27 Montagevorrichtung und Verfahren zum Bestimmen der Biegung

Country Status (5)

Country Link
US (1) US20250056778A1 (https=)
JP (1) JP7833485B2 (https=)
CN (1) CN118176840A (https=)
DE (1) DE112021008563T5 (https=)
WO (1) WO2023127006A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000005679A (ja) 1998-06-24 2000-01-11 Shibaura Mechatronics Corp 塗布装置および電子部品実装装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002094296A (ja) * 2000-09-13 2002-03-29 Fuji Mach Mfg Co Ltd 吸着ノズル，電気部品の保持位置検出方法，吸着管曲がり検出方法，吸着ノズルの回転位置特定方法，電気部品取扱装置
JP2008205424A (ja) * 2007-01-26 2008-09-04 Juki Corp 部品実装方法及び装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000005679A (ja) 1998-06-24 2000-01-11 Shibaura Mechatronics Corp 塗布装置および電子部品実装装置

Also Published As

Publication number Publication date
JPWO2023127006A1 (https=) 2023-07-06
US20250056778A1 (en) 2025-02-13
WO2023127006A1 (ja) 2023-07-06
JP7833485B2 (ja) 2026-03-19
CN118176840A (zh) 2024-06-11

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R012 Request for examination validly filed