WO2023127006A1 - 実装装置および曲がり判定方法 - Google Patents

実装装置および曲がり判定方法 Download PDF

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Publication number
WO2023127006A1
WO2023127006A1 PCT/JP2021/048547 JP2021048547W WO2023127006A1 WO 2023127006 A1 WO2023127006 A1 WO 2023127006A1 JP 2021048547 W JP2021048547 W JP 2021048547W WO 2023127006 A1 WO2023127006 A1 WO 2023127006A1
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WO
WIPO (PCT)
Prior art keywords
syringe
mounting
determination
nozzle
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/048547
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English (en)
French (fr)
Japanese (ja)
Inventor
晶太 清水
寿明 水野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Priority to US18/718,740 priority Critical patent/US20250056778A1/en
Priority to CN202180104245.7A priority patent/CN118176840A/zh
Priority to DE112021008563.8T priority patent/DE112021008563T5/de
Priority to JP2023570503A priority patent/JP7833485B2/ja
Priority to PCT/JP2021/048547 priority patent/WO2023127006A1/ja
Publication of WO2023127006A1 publication Critical patent/WO2023127006A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

Definitions

  • This specification discloses a mounting device and a curve determination method.
  • Patent Literature 1 describes a device that processes an image of a nozzle taken from the lateral direction, detects the amount of misalignment of the tip of the nozzle, and controls a nozzle moving device so as to correct the amount of misalignment. ing.
  • a suction nozzle for component mounting is attached to the lower end of a syringe that can be raised and lowered, and the syringe may bend due to collisions during production or maintenance.
  • the apparatus described above corrects the amount of positional deviation of the tip of the nozzle, it does not consider the determination of the bending of the syringe.
  • the sliding resistance of the syringe increases, and the accuracy of component mounting by the suction nozzle is affected. If such an effect is detected as a defect in the inspection, it will be possible to grasp the bending of the syringe, but this is not preferable because defects will continue to occur until then.
  • the main purpose of the present disclosure is to appropriately determine the bending of a syringe to which a suction nozzle is attached.
  • the mounting device of the present disclosure is A mounting device that sucks a component with a suction nozzle attached to a syringe and mounts it on a substrate, a camera that captures an image of an object from below; a horizontally movable head on which the syringe is provided so as to be able to move up and down; The head and the camera are controlled so that a jig nozzle is attached to the syringe at predetermined determination timing, and the jig nozzle is imaged from below while the syringe is lowered at a predetermined position in the horizontal direction.
  • a control unit a determination unit that processes the captured image and determines bending of the syringe based on the position of the jig nozzle with respect to the predetermined position;
  • the gist is to provide
  • the syringe attached with the jig nozzle is lowered at a predetermined position in the horizontal direction, and an image of the jig nozzle is captured from below. Bending of the syringe is determined based on the position of the tool nozzle. Therefore, it is possible to determine the bending of the syringe at a predetermined determination timing without waiting for the inspection result of the mounted component. In addition, by using the jig nozzle, it is possible to appropriately determine the bending of the syringe by eliminating the influence of the bending of the suction nozzle.
  • FIG. 1 is a configuration diagram showing an outline of the configuration of a mounting system 10;
  • FIG. FIG. 2 is a configuration diagram showing an outline of the configuration of the mounting apparatus 20;
  • FIG. 2 is a block diagram showing a configuration related to control of the mounting device 20 and the management device 40;
  • 4 is a perspective view showing a part of the configuration of the head 30;
  • 4 is a flowchart showing an example of syringe bending determination processing.
  • 4 is a perspective view showing an example of the configuration of a jig nozzle 36;
  • FIG. 4 is an explanatory diagram showing an example of correction values ⁇ X and ⁇ Y for each rotation angle of each syringe 32;
  • FIG. 4 is an explanatory diagram showing an example of distance A;
  • FIG. 1 is a configuration diagram showing an outline of the configuration of the mounting system 10.
  • FIG. 2 is a configuration diagram showing an outline of the configuration of the mounting apparatus 20.
  • FIG. 3 is a block diagram showing a control configuration of the mounting device 20 and the management device 40.
  • the horizontal direction is the X direction
  • the front-rear direction is the Y direction
  • the vertical direction is the Z direction.
  • the mounting system 10 includes a printing device 12, a printing inspection device 14, a plurality of mounting devices 20, a mounting inspection device 16, and a management device 40, which are connected to a LAN 18 as a network. It is connected.
  • the printing device 12 prints on the substrate S (see FIG. 2) by forcing solder into the pattern holes formed in the screen mask.
  • the print inspection device 14 inspects the state of solder printed by the printer 12 .
  • a plurality of mounting apparatuses 20 are arranged along the transport direction (X direction) of the board S, and mount components on the board S.
  • the mounting inspection device 16 inspects the mounting state of the components mounted on the board S by the mounting device 20 .
  • the management device 40 manages various information and the entire mounting system 10 .
  • the printing device 12, the print inspection device 14, the plurality of mounting devices 20, and the mounting inspection device 16 are arranged in this order in the transport direction of the board S to form a production line.
  • the production line may also include a reflow device for reflowing the board S on which components are mounted, and the mounting inspection device 16 may be arranged downstream of the reflow device. .
  • the mounting apparatus 20 includes a component supply device 21 that supplies components, a substrate transport device 22 that transports the board S, and one or more suction nozzles 31 that pick up components and place them on the board S.
  • a mounting head 30 and a moving device 23 for moving the head 30 in the XY direction (horizontal direction) are provided.
  • the component supply device 21 is, for example, a tape feeder that supplies components by feeding out a tape containing components at a predetermined pitch, and is set in the mounting device 20 so as to supply a plurality of types of components.
  • a tray feeder for supplying components may be set using a tray containing components.
  • the substrate conveying device 22 has conveyor belts that are spaced apart in the front and rear of FIG.
  • the moving device 23 includes a Y-axis slider 23b that is movable along a guide rail provided in the Y direction on the mounting device 20, and a guide rail that is provided on the lower surface of the Y-axis slider 23b in the X direction. and an X-axis slider 23a.
  • the head 30 is detachably attached to the X-axis slider 23 a of the moving device 23 .
  • the head 30 is removed from the X-axis slider 23a, for example, when inspection or maintenance is performed. Further, when the head 30 is mounted on the X-axis slider 23a, the power is turned on and the head 30 becomes operable.
  • FIG. 4 is a perspective view showing a part of the configuration of the head 30.
  • the head 30 is configured as a rotary head in which a plurality of cylindrical syringes 32 each holding a plurality of suction nozzles 31 (not shown in FIG. 4) are arranged at predetermined angular intervals in the circumferential direction. .
  • the suction nozzle 31 sucks the component by a negative pressure supplied from a negative pressure source (not shown) to the suction port at the tip.
  • Each syringe 32 has a detachable adsorption nozzle 31 at its lower end, and a syringe suitable for adsorption is attached according to the type of component to be adsorbed.
  • the head 30 also includes an R-axis motor 33, a Q-axis motor 34, and a Z-axis motor 35 (see FIG. 3).
  • the head 30 rotates (revolves) each syringe 32 in the circumferential direction around the central axis of the head 30 by driving the R-axis motor 33 . Further, the head 30 rotates (rotates) each syringe 32 (each suction nozzle 31) around its central axis by driving the Q-axis motor 34 . Further, the head 30 raises and lowers the syringe 32 (suction nozzle 31) at a predetermined turning position (rotating position) in the Z direction by driving the Z-axis motor 35 .
  • the mounting device 20 also includes a mark camera 25, a parts camera 26, a nozzle station 27, an operation panel 28 (see FIG. 1), a mounting control device 29 (see FIG. 3), and the like.
  • the mark camera 25 is attached to the head 30 and captures an image of the reference mark, the board ID, and the like attached to the board S from above.
  • the parts camera 26 is installed between the component supply device 21 and the substrate transfer device 22, and images an object such as a component sucked by the suction nozzle 31 from below.
  • the nozzle station 27 accommodates a plurality of replacement suction nozzles 31 and one or more jig nozzles 36 used for the bending determination process of the syringe 32 .
  • the operation panel 28 is configured as a touch panel having functions of a display section for displaying a screen and an operation section for receiving various input operations from the operator, and displays the operation state and various states of the mounting apparatus 20 on the screen.
  • the mounting control device 29 is composed of a well-known CPU, ROM, RAM, and the like.
  • the mounting control device 29 outputs drive signals to the component supply device 21, the substrate transfer device 22, the head 30, the moving device 23, the nozzle station 27, and the like. Images from the mark camera 25 and the parts camera 26 are input to the mounting control device 29 .
  • the mounting control device 29 processes the image of the board S captured by the mark camera 25 to obtain the board ID, and recognizes the position of the board S by recognizing the reference mark.
  • the mounting control device 29 also processes the image captured by the parts camera 26 to determine the suction attitude of the component sucked by the suction nozzle 31 .
  • the management device 40 is a general-purpose computer, and, as shown in FIGS. Prepare.
  • the management control device 42 is composed of a well-known CPU, ROM, RAM, etc., receives an input signal from the input device 44 and outputs an image signal to the display 46 .
  • the storage device 48 stores a production plan for the board S.
  • FIG. The production plan for the board S is a plan that determines which components are to be mounted at which positions on the board S in the mounting apparatus 20 and in what order, how many boards S on which the components are mounted are to be produced, and the like.
  • the management control device 42 is communicably connected to the mounting control device 29 via the LAN 18, receives information on the mounting status from the mounting control device 29, and sends the mounting control device 29 production information such as jobs based on the production plan. send instructions.
  • the management control device 42 is also communicably connected to each control device (not shown) of the printing device 12, the print inspection device 14, and the mounting inspection device 16 via the LAN 18, and receives information about the work status from each control device. receive and send work instructions to each control device.
  • FIG. 5 is a flowchart showing an example of production processing. This processing is executed by the mounting control device 29 .
  • the mounting control device 29 first determines whether it is the timing when the head 30 is powered on, that is, the timing when the head 30, which has been removed for maintenance or the like, is attached to the X-axis slider 23a. It is determined whether or not (S100).
  • S105 syringe bending determination processing
  • the mounting control device 29 first attaches the jig nozzle 36 to the target syringe 32 and moves it above the parts camera 26 (S200). In S200, the presence or absence of bending is determined for the plurality of syringes 32 provided in the head 30 in order.
  • FIG. 7 is a perspective view showing an example of the configuration of the jig nozzle 36.
  • the jig nozzle 36 is a nozzle-shaped jig member, and includes a base end portion 37 to be inserted into the syringe 32, a tip portion 38 having a larger diameter than the base end portion 37, and a base end portion 38 having a larger diameter than the base end portion 37. 37 and a flange portion 39 provided between the tip portion 38 are coaxially formed.
  • the jig nozzle 36 has a first cylindrical portion (central cylindrical portion) 38a that indicates the reference position (axis center position) of the jig nozzle 36 on the lower surface (tip surface) of the tip portion 38.
  • a second cylindrical portion 38b having a smaller diameter than the first cylindrical portion 38a is provided on a concentric circle with the first cylindrical portion 38a.
  • the second columnar portions 38b are provided at intervals of 90° so as to divide the concentric circle into four. Therefore, the mounting control device 29 detects the center position of the jig nozzle 36 from the position of the first cylindrical portion 38a in the image by processing the image of the lower surface of the jig nozzle 36 captured by the parts camera 26. can do. Further, the mounting control device 29 can detect the rotational angle of the jig nozzle 36 (syringe 32) around the axis from the position of each second cylindrical portion 38b in the image.
  • the jig nozzle 36 is housed with the flange portion 39 supported by the edge of the housing portion of the nozzle station 27 .
  • the mounting control device 29 sets the position where the correction values ⁇ X and ⁇ Y of the target syringe 32 are reflected with respect to the center position of the parts camera 26 as the target position in the horizontal direction, and the jig nozzle 36 moves to a predetermined position in the Z direction.
  • the head 30 and moving device 23 are controlled so as to descend to the height position (S205).
  • the predetermined height position in the Z direction may be a position that falls within the depth of field of the parts camera 26, for example, a position slightly higher than the height position when the components are mounted on the board S.
  • FIG. 8 is an explanatory diagram showing an example of the correction values ⁇ X and ⁇ Y for each rotation angle of each syringe 32.
  • FIG. 8 an X-direction correction value ⁇ X and a Y-direction correction value ⁇ Y are set for each rotation angle of each syringe 32 (for example, 0°, 90°, 180°, and 270°). These correction values ⁇ X and ⁇ Y are set by performing calibration in advance.
  • the mounting control device 29 reads the correction values ⁇ X and ⁇ Y according to the rotation angle of the syringe 32 for aligning the component to be mounted in a predetermined mounting direction, and applies the correction values ⁇ X and ⁇ Y to the mounting position (X, Y) of the job.
  • the component is mounted at the target position (X+ ⁇ X, Y+ ⁇ Y) reflecting the .
  • the mounting control device 29 reflects the correction values ⁇ X and ⁇ Y at the rotation angle of 0° (reference angle) among the correction values ⁇ X and ⁇ Y of the target syringe 32 .
  • the mounting control device 29 captures an image of the jig nozzle 36 from below with the parts camera 26 (S210), and determines whether or not the image of the jig nozzle 36 is captured at each determination angle (rotation angle) (S215). .
  • rotation angle rotation angle
  • four angles of 0°, 90°, 180°, and 270° are used as the determination angles.
  • the mounting control device 29 determines that the image is not captured at each determination angle, the syringe 32 is rotated to the next determination angle, and the horizontal position of the syringe 32 reflects the correction values ⁇ X and ⁇ Y of the next determination angle. It is adjusted to the position where it was moved (S220).
  • the mounting control device 29 then returns to S ⁇ b>210 and images the jig nozzle 36 .
  • the mounting control device 29 may once raise the syringe 32 and then adjust the position of the syringe 32 in the horizontal direction and lower it again. Adjustments may be made.
  • the mounting control device 29 processes the image of each determination angle to determine the center position of the image and the center position of the jig nozzle 36.
  • Each distance A is calculated (S225, see FIG. 9), and it is determined whether or not there is a distance A that is equal to or greater than a threshold (S230).
  • the center position of the jig nozzle 36 can be detected from the position of the first cylindrical portion 38a (not shown in FIG. 9) in the image as described above.
  • the mounting control device 29 determines that all of the distances A of each determination image are less than the threshold, it determines that the target syringe 32 is not bent (S235).
  • the mounting control device 29 determines that any one of the distances A in each determination image is equal to or greater than the threshold, it determines that the target syringe 32 is bent (S240).
  • the mounting control device 29 determines whether or not the processing of each syringe 32 is completed (S245), and if it is determined that the processing is not completed, returns to S200 and performs the processing. That is, the mounting control device 29 repeats the process of sequentially attaching the jig nozzle 36 to each syringe 32, taking an image with the parts camera 26, and determining the presence or absence of bending.
  • the mounting control device 29 determines that the processing is completed in S245, it determines whether or not each syringe 32 processed this time is bent (S250). finish.
  • the mounting control device 29 determines that any syringe 32 is bent, the mounting device 20 is stopped due to an error (S255).
  • the mounting control device 29 transmits the error stop to the management device 40 or displays it on the operation panel 28 .
  • the mounting control device 29 also turns on a warning light of the mounting device 20 .
  • the operation panel 28 displays a message indicating that a bending error of the syringe 32 has occurred and a message indicating that the mounting process can be performed by instructing to skip the syringe 32 .
  • the mounting control device 29 waits to receive a skip instruction from the operator (S260), and when the skip instruction is received, registers the skip of the bent syringe 32 (S265), and ends the syringe bend determination process.
  • the mounting control device 29 executes the syringe bending determination process in this way, or waits until the production preparation is completed (S110) if it determines that it is not the time when the head 30 is powered on in S100. .
  • the mounting control device 29 waits for completion of preparations, such as setting feeders for the required component types and attaching the required suction nozzles 31 to the syringes 32 .
  • the substrate transport device 22 carries in the substrate S (S115), and determines whether or not there is a syringe 32 that has been skip-registered in the syringe bending determination process (S120). ).
  • the mounting control device 29 determines that there is no syringe 32 that has been skip-registered, it performs mounting processing using the suction nozzle 31 of each syringe 32 (S125). That is, the mounting process is performed such that the components are picked up by the suction nozzles 31 attached to the respective syringes 32 and mounted on the substrate S.
  • the mounting control device 29 determines that there is a skip-registered syringe 32
  • the mounting control device 29 performs mounting processing using the suction nozzle 31 of the syringe 32 other than the skip-registered syringes (S130). That is, the mounting process is carried out so that components are picked up by the suction nozzles 31 attached to the syringes 32 that are not bent and mounted on the substrate S, except for the syringes 32 that are bent.
  • the mounting control device 29 waits until the mounting of all the components on the board S is completed (S135), and when the mounting of all the components is completed, the board conveying device 22 unloads the board S (S140).
  • the mounting control device 29 updates the counter C by incrementing the counter C indicating the number of substrates S to be produced by 1 (S145), and determines whether the counter C has reached a predetermined value Cref (predetermined number). (S150).
  • the predetermined value Cref is a value for determining the determination timing for executing the syringe bending determination process during the production process based on the number of substrates S to be produced.
  • the mounting control device 29 determines that the counter C has reached the predetermined value Cref, it executes syringe bending determination processing (S155), resets the counter C to a value of 0 (S160), and proceeds to S165.
  • the syringe bend determination process in S155 is executed in the same manner as in S105 (FIG. 6) except that the syringe 32 that has already been skip-registered is not included in the determination target, and thus description thereof will be omitted.
  • the mounting control device 29 determines that the counter C has not reached the predetermined value Cref, it skips S155 and S160 and proceeds to S160. Then, the mounting control device 29 determines whether or not the production of all the boards S scheduled to be produced has been completed (S160). conduct. Further, when the mounting control device 29 determines that the production of all the substrates S has been completed, the production process ends.
  • the parts camera 26 of this embodiment corresponds to the camera
  • the head 30 corresponds to the head
  • the mounting control device 29 that executes S200 to S210 of the syringe bending determination process corresponds to the control unit
  • S225 to S240 of the same process The mounting control device 29 that executes the processing corresponds to the determination unit.
  • the mounting control device 29 and the operation panel 28 that execute S260 of the same process correspond to the reception unit.
  • an example of the bend determination method of the present disclosure is also clarified by explaining the operation of the mounting apparatus 20. FIG.
  • the syringe 32 with the jig nozzle 36 mounted thereon is lowered at the center position of the parts camera 26, and an image is taken from below by the parts camera 26.
  • the bending of the syringe 32 is determined based on the center position of the . Therefore, bending of the syringe 32 can be determined without waiting for inspection results of the mounted components.
  • the influence of the bending of the suction nozzle 31 can be eliminated and the bending of the syringe 32 can be determined appropriately.
  • the mounting control device 29 determines that the syringe 32 is bent when the distance A between the center position of the image and the center position of the jig nozzle 36 is equal to or greater than a threshold value (predetermined distance). The bending of the syringe 32 can be properly determined.
  • the mounting control device 29 executes the syringe bending determination process at the timing when the head 30 is mounted on the mounting device 20 (X-axis slider 23a), the syringe 32 may be bent before production due to maintenance of the head 30 or the like. Bending can be determined appropriately. Therefore, it is possible to prevent the deterioration of component mounting precision and the occurrence of defective component mounting due to the bending of the syringe 32 that occurs before the start of production.
  • the mounting control device 29 executes syringe bending determination processing at the timing when the counter C indicating the number of substrates S to be produced reaches a predetermined value Cref. Further, since the counter C is reset to a value of 0 when the syringe bend determination process is executed, the syringe bend determination process can be executed each time the number of sheets to be produced reaches the predetermined value Cref. Thereby, bending of the syringe 32 caused by a collision with the substrate S or a foreign matter on the substrate S during production can be appropriately determined. Therefore, it is possible to prevent the deterioration of component mounting precision and the occurrence of defective component mounting due to the bending of the syringe 32 during production.
  • the mounting control device 29 receives an instruction to skip a curved syringe 32 and performs skip registration, even if one of the syringes 32 is bent, production can be continued while preventing the mounting accuracy from being affected. be able to. That is, it is possible to prevent production from being interrupted due to bending of the syringe 32 .
  • the head 30 is provided with a plurality of syringes 32, and the syringe 32 with a curve can be skip-registered, but the present invention is not limited to this.
  • the head 30 may be replaced, or the curved syringe 32 may be replaced with another syringe 32 prior to production processing.
  • the head 30 is not limited to a rotary head, and may include, for example, a plurality of syringes 32 arranged in parallel, or may include only one syringe 32 .
  • the determination timing before the start of production is the timing when the head 30 is attached to the mounting device 20 and the power is turned on, but it is not limited to this.
  • the determination timing may be the timing at which production is started regardless of whether or not the head 30 is attached.
  • the determination timing during production is the timing when the number of boards S to be produced (counter C) reaches a predetermined value, it is not limited to this. may be determined based on Alternatively, the determination timing may be the timing when the production time reaches a predetermined time from the start of production by the mounting apparatus 20, or the timing of the break in production such as when the board type is switched. Further, the determination timing may be the timing at which an instruction to execute the bend determination process is received from the operator.
  • both before the start of production (S100 in FIG. 5) and during production (S150 in FIG. 5) are exemplified as determination timings, but the present invention is not limited to this. good.
  • the timing at which a predetermined period of time (a predetermined number of days, a predetermined amount of time, or the like) has passed since the previous bending determination process may be used as the determination timing.
  • bending of the syringe 32 is determined using four angles as a plurality of determination angles, but the present invention is not limited to this, and bending may be determined using five or more angles or two or three angles. Alternatively, the bending may be determined by one determination angle, for example, the reference angle (0°), without being limited to a plurality of determination angles. Also, even when making a determination with one determination angle, the target position may be corrected with the correction values ⁇ X and ⁇ Y for that angle. Also, although the correction values .DELTA.X and .DELTA.Y are reflected in the target position, they may not be reflected. However, in order to appropriately determine the bending of the syringe 32, it is preferable to reflect the correction values .DELTA.X and .DELTA.Y.
  • the presence or absence of bending of the syringe 32 is determined by the distance A, but the determination is not limited to this, and may be determined based on the position of the jig nozzle 36 .
  • the inside of a predetermined circular or rectangular area centered on the center position of the image is set as a non-curved area, and the outside of the predetermined area is set as a curved area. Whether or not there is a curve may be determined based on the following.
  • the horizontal position of the syringe 32 is the center position of the parts camera 26 when the jig nozzle 36 is imaged.
  • the distance between the predetermined position in the image and the center position of the jig nozzle 36 may be calculated to determine the bending.
  • the mounting control device 29 of the mounting device 20 determines the bending of the syringe 32 in the embodiment
  • the present invention is not limited to this, and an image processing device or the like other than the mounting control device 29 may determine the bending.
  • an image captured by the parts camera 26 may be received by an external device such as the management control device 42, and the image may be processed to determine bending.
  • the mounting device of the present disclosure may be configured as follows.
  • the predetermined position is the imaging center position of the camera
  • the determination unit calculates the distance between the center position of the captured image and the center position of the jig nozzle, It may be determined that the syringe is bent when the calculated distance is equal to or greater than a predetermined distance. By doing so, it is possible to appropriately determine the bending of the syringe while suppressing the processing load.
  • the head is provided such that the syringe is rotatable about an axis, and the control unit sequentially rotates the syringe to a plurality of determination angles about the axis, and rotates the syringe at each of the determination angles.
  • the syringe is set at the predetermined position by reflecting the position correction value of , and the head and the camera are controlled so that the jig nozzle is imaged from below at each determination angle, and the determination unit performs the determination
  • a plurality of images captured at each angle may be processed to determine the bending of the syringe. By doing so, it is possible to determine the bending of the syringe more accurately.
  • the head may be detachably attached to the mounting apparatus, and the determination timing may include the timing when the head is attached to the mounting apparatus.
  • the determination timing may include the timing when the number of components to be mounted or the number of boards to be produced reaches a predetermined number. By doing so, it is possible to appropriately determine the bending of the syringe that occurred during production.
  • the head is provided with a plurality of the syringes, and receives an instruction from the operator to skip the syringe determined to be bent by the determination unit and mount the component. It is good also as what has the reception part which receives. In this way, even if one of the plurality of syringes is bent, the production can be continued while preventing the influence of the bending.
  • the bend determination method of the present disclosure includes: A bending determination method for determining the bending of the syringe in a mounting apparatus that picks up a component with a suction nozzle attached to the syringe and mounts it on a board, (a) attaching a jig nozzle to the syringe at predetermined determination timing; (b) imaging the jig nozzle from below while the syringe is lowered at a predetermined position in the horizontal direction; (c) processing the captured image to determine bending of the syringe based on the position of the fixture nozzle relative to the predetermined position;
  • the gist is to include
  • the bending determination method of the present disclosure can appropriately determine the bending of the syringe in the same manner as the mounting apparatus described above.
  • this bend determination method various aspects of the above-described mounting apparatus may be employed, and steps may be added to realize each function of the above-described mounting apparatus.
  • the present disclosure can be used in the technical field of component mounting processing.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
PCT/JP2021/048547 2021-12-27 2021-12-27 実装装置および曲がり判定方法 Ceased WO2023127006A1 (ja)

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US18/718,740 US20250056778A1 (en) 2021-12-27 2021-12-27 Mounting device and bending determination method
CN202180104245.7A CN118176840A (zh) 2021-12-27 2021-12-27 安装装置以及弯曲判定方法
DE112021008563.8T DE112021008563T5 (de) 2021-12-27 2021-12-27 Montagevorrichtung und Verfahren zum Bestimmen der Biegung
JP2023570503A JP7833485B2 (ja) 2021-12-27 2021-12-27 実装装置および曲がり判定方法
PCT/JP2021/048547 WO2023127006A1 (ja) 2021-12-27 2021-12-27 実装装置および曲がり判定方法

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002094296A (ja) * 2000-09-13 2002-03-29 Fuji Mach Mfg Co Ltd 吸着ノズル，電気部品の保持位置検出方法，吸着管曲がり検出方法，吸着ノズルの回転位置特定方法，電気部品取扱装置
JP2008205424A (ja) * 2007-01-26 2008-09-04 Juki Corp 部品実装方法及び装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4109754B2 (ja) 1998-06-24 2008-07-02 芝浦メカトロニクス株式会社 塗布装置および電子部品実装装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002094296A (ja) * 2000-09-13 2002-03-29 Fuji Mach Mfg Co Ltd 吸着ノズル，電気部品の保持位置検出方法，吸着管曲がり検出方法，吸着ノズルの回転位置特定方法，電気部品取扱装置
JP2008205424A (ja) * 2007-01-26 2008-09-04 Juki Corp 部品実装方法及び装置

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US20250056778A1 (en) 2025-02-13
JP7833485B2 (ja) 2026-03-19
CN118176840A (zh) 2024-06-11

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