JP7833485B2 - 実装装置および曲がり判定方法 - Google Patents

実装装置および曲がり判定方法

Info

Publication number
JP7833485B2
JP7833485B2 JP2023570503A JP2023570503A JP7833485B2 JP 7833485 B2 JP7833485 B2 JP 7833485B2 JP 2023570503 A JP2023570503 A JP 2023570503A JP 2023570503 A JP2023570503 A JP 2023570503A JP 7833485 B2 JP7833485 B2 JP 7833485B2
Authority
JP
Japan
Prior art keywords
syringe
mounting
determination
bending
predetermined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023570503A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023127006A1 (https=
Inventor
晶太 清水
寿明 水野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPWO2023127006A1 publication Critical patent/JPWO2023127006A1/ja
Application granted granted Critical
Publication of JP7833485B2 publication Critical patent/JP7833485B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2023570503A 2021-12-27 2021-12-27 実装装置および曲がり判定方法 Active JP7833485B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/048547 WO2023127006A1 (ja) 2021-12-27 2021-12-27 実装装置および曲がり判定方法

Publications (2)

Publication Number Publication Date
JPWO2023127006A1 JPWO2023127006A1 (https=) 2023-07-06
JP7833485B2 true JP7833485B2 (ja) 2026-03-19

Family

ID=86998308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023570503A Active JP7833485B2 (ja) 2021-12-27 2021-12-27 実装装置および曲がり判定方法

Country Status (5)

Country Link
US (1) US20250056778A1 (https=)
JP (1) JP7833485B2 (https=)
CN (1) CN118176840A (https=)
DE (1) DE112021008563T5 (https=)
WO (1) WO2023127006A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002094296A (ja) 2000-09-13 2002-03-29 Fuji Mach Mfg Co Ltd 吸着ノズル，電気部品の保持位置検出方法，吸着管曲がり検出方法，吸着ノズルの回転位置特定方法，電気部品取扱装置
JP2008205424A (ja) 2007-01-26 2008-09-04 Juki Corp 部品実装方法及び装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4109754B2 (ja) 1998-06-24 2008-07-02 芝浦メカトロニクス株式会社 塗布装置および電子部品実装装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002094296A (ja) 2000-09-13 2002-03-29 Fuji Mach Mfg Co Ltd 吸着ノズル，電気部品の保持位置検出方法，吸着管曲がり検出方法，吸着ノズルの回転位置特定方法，電気部品取扱装置
JP2008205424A (ja) 2007-01-26 2008-09-04 Juki Corp 部品実装方法及び装置

Also Published As

Publication number Publication date
DE112021008563T5 (de) 2024-10-10
JPWO2023127006A1 (https=) 2023-07-06
US20250056778A1 (en) 2025-02-13
WO2023127006A1 (ja) 2023-07-06
CN118176840A (zh) 2024-06-11

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