CN118176840A - 安装装置以及弯曲判定方法 - Google Patents

安装装置以及弯曲判定方法 Download PDF

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Publication number
CN118176840A
CN118176840A CN202180104245.7A CN202180104245A CN118176840A CN 118176840 A CN118176840 A CN 118176840A CN 202180104245 A CN202180104245 A CN 202180104245A CN 118176840 A CN118176840 A CN 118176840A
Authority
CN
China
Prior art keywords
suction pipe
mounting
suction
bending
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180104245.7A
Other languages
English (en)
Chinese (zh)
Inventor
清水晶太
水野寿明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Publication of CN118176840A publication Critical patent/CN118176840A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/041Incorporating a pick-up tool having multiple pick-up tools
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813Controlling of single components prior to mounting, e.g. orientation, component geometry

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN202180104245.7A 2021-12-27 2021-12-27 安装装置以及弯曲判定方法 Pending CN118176840A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/048547 WO2023127006A1 (ja) 2021-12-27 2021-12-27 実装装置および曲がり判定方法

Publications (1)

Publication Number Publication Date
CN118176840A true CN118176840A (zh) 2024-06-11

Family

ID=86998308

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180104245.7A Pending CN118176840A (zh) 2021-12-27 2021-12-27 安装装置以及弯曲判定方法

Country Status (5)

Country Link
US (1) US20250056778A1 (https=)
JP (1) JP7833485B2 (https=)
CN (1) CN118176840A (https=)
DE (1) DE112021008563T5 (https=)
WO (1) WO2023127006A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4109754B2 (ja) 1998-06-24 2008-07-02 芝浦メカトロニクス株式会社 塗布装置および電子部品実装装置
JP2002094296A (ja) * 2000-09-13 2002-03-29 Fuji Mach Mfg Co Ltd 吸着ノズル,電気部品の保持位置検出方法,吸着管曲がり検出方法,吸着ノズルの回転位置特定方法,電気部品取扱装置
JP2008205424A (ja) * 2007-01-26 2008-09-04 Juki Corp 部品実装方法及び装置

Also Published As

Publication number Publication date
DE112021008563T5 (de) 2024-10-10
JPWO2023127006A1 (https=) 2023-07-06
US20250056778A1 (en) 2025-02-13
WO2023127006A1 (ja) 2023-07-06
JP7833485B2 (ja) 2026-03-19

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