DE112021007670T5 - Bauteilüberführungsvorrichtung - Google Patents

Bauteilüberführungsvorrichtung Download PDF

Info

Publication number
DE112021007670T5
DE112021007670T5 DE112021007670.1T DE112021007670T DE112021007670T5 DE 112021007670 T5 DE112021007670 T5 DE 112021007670T5 DE 112021007670 T DE112021007670 T DE 112021007670T DE 112021007670 T5 DE112021007670 T5 DE 112021007670T5
Authority
DE
Germany
Prior art keywords
support member
component
component transfer
stop
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021007670.1T
Other languages
German (de)
English (en)
Inventor
Youhei KISHIMOTO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Publication of DE112021007670T5 publication Critical patent/DE112021007670T5/de
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE112021007670.1T 2021-05-17 2021-05-17 Bauteilüberführungsvorrichtung Pending DE112021007670T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/018530 WO2022244033A1 (ja) 2021-05-17 2021-05-17 部品移載装置

Publications (1)

Publication Number Publication Date
DE112021007670T5 true DE112021007670T5 (de) 2024-03-07

Family

ID=84141285

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021007670.1T Pending DE112021007670T5 (de) 2021-05-17 2021-05-17 Bauteilüberführungsvorrichtung

Country Status (4)

Country Link
JP (1) JP7503712B2 (https=)
KR (1) KR102828117B1 (https=)
DE (1) DE112021007670T5 (https=)
WO (1) WO2022244033A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007040468A (ja) 2005-08-04 2007-02-15 Matsushita Electric Ind Co Ltd 衝撃吸収機構、及び該機構を備えた機械装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3097511B2 (ja) * 1995-09-22 2000-10-10 松下電器産業株式会社 チップの搭載装置
WO2005008726A2 (en) * 2003-07-09 2005-01-27 Newport Corporation Flip chip device assembly machine
JP4824641B2 (ja) * 2007-07-06 2011-11-30 ヤマハ発動機株式会社 部品移載装置
JP2009295741A (ja) 2008-06-04 2009-12-17 Yamaha Motor Co Ltd 部品移載方法及び部品移載装置
JP2013117291A (ja) 2011-12-05 2013-06-13 Hiroshima Aluminum Industry Co Ltd 衝撃吸収部材
US11137044B2 (en) 2014-02-24 2021-10-05 Teijin Limited Resin-made impact absorption member
JP6889614B2 (ja) * 2017-05-31 2021-06-18 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007040468A (ja) 2005-08-04 2007-02-15 Matsushita Electric Ind Co Ltd 衝撃吸収機構、及び該機構を備えた機械装置

Also Published As

Publication number Publication date
KR102828117B1 (ko) 2025-07-03
WO2022244033A1 (ja) 2022-11-24
JP7503712B2 (ja) 2024-06-20
KR20230158097A (ko) 2023-11-17
JPWO2022244033A1 (https=) 2022-11-24

Similar Documents

Publication Publication Date Title
DE69706515T2 (de) Vorrichtung zum Montieren von elektronischen Bauteilen
DE102008038319A1 (de) Montagevorrichtung für elektronische Bauelemente und Montageverfahren für elektronische Bauelemente
DE60026728T2 (de) Bauteilbestückungseinrichtung und verfahren
DE19615919C2 (de) Bauelement-Lade/Entladevorrichtung für Halbleiterbauelement-Handhabungseinrichtung
DE4301585A1 (en) Mounting device for plugging electronic components into PCB - has mounting stations to position PCB in Y direction and mounting head movable in X direction and component stores at each station
DE102008039566A1 (de) Montagevorrichtung für elektronische Bauelemente und Montageverfahren für elektronische Bauelemente
DE112012000523T5 (de) Bauteilmontageeinrichtung und Bauteilmontageverfahren
EP0962125B1 (de) Vorrichtung zum herstellen von elektrischen baugruppen
DE112012000528T5 (de) Bauteilmontageeinrichtung und Bauteilmontageverfahren
DE60019596T2 (de) Hebevorrichtung mit saugdüse zum greifen von werkstücken
DE60207466T2 (de) Mehrachsige Stanzvorrichtung
DE112012000532T5 (de) Bauteilmontageeinrichtung und Bauteilmontageverfahren
DE112021007626T5 (de) Übertragungsvorrichtung und Arbeitsvorrichtung
DE10019231A1 (de) Vorrichtung zum Kompensieren der Niveauebene einer Leiterplatte für eine Flächenmontagevorrichtung
DE112021007670T5 (de) Bauteilüberführungsvorrichtung
DE102023120168A1 (de) Saugdüse und Komponentenmontagevorrichtung
DE112017004286T5 (de) Pressvorrichtung und verfahren zur steuerung der pressvorrichtung
DE102018122593B3 (de) Bestückkopf mit ineinander eingreifenden Rotoren, Bestückautomat, Verfahren zum Bestücken eines Bauelementeträgers
DE112021007673T5 (de) Waferzufuhrvorrichtung und Bauteiltransfervorrichtung
DE112017007298B4 (de) Bauteilmontagevorrichtung, verfahren zur steuerung einer düsenhöhe
DE10031933A1 (de) Bauteilmontagevorrichtung und Montageverfahren
EP2755462A2 (en) Electronic component mounting apparatus
DE102024138315A1 (de) Transportvorrichtung und Transportverfahren
DE3829930A1 (de) Verbundmaschine
DE19962099A1 (de) Halbleitervorrichtung

Legal Events

Date Code Title Description
R012 Request for examination validly filed