JP7503712B2 - 部品移載装置 - Google Patents

部品移載装置 Download PDF

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Publication number
JP7503712B2
JP7503712B2 JP2023521983A JP2023521983A JP7503712B2 JP 7503712 B2 JP7503712 B2 JP 7503712B2 JP 2023521983 A JP2023521983 A JP 2023521983A JP 2023521983 A JP2023521983 A JP 2023521983A JP 7503712 B2 JP7503712 B2 JP 7503712B2
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JP
Japan
Prior art keywords
beam member
component
transfer device
stopper
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023521983A
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English (en)
Japanese (ja)
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JPWO2022244033A1 (https=
JPWO2022244033A5 (https=
Inventor
洋平 岸本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Publication of JPWO2022244033A1 publication Critical patent/JPWO2022244033A1/ja
Publication of JPWO2022244033A5 publication Critical patent/JPWO2022244033A5/ja
Application granted granted Critical
Publication of JP7503712B2 publication Critical patent/JP7503712B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023521983A 2021-05-17 2021-05-17 部品移載装置 Active JP7503712B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/018530 WO2022244033A1 (ja) 2021-05-17 2021-05-17 部品移載装置

Publications (3)

Publication Number Publication Date
JPWO2022244033A1 JPWO2022244033A1 (https=) 2022-11-24
JPWO2022244033A5 JPWO2022244033A5 (https=) 2024-01-31
JP7503712B2 true JP7503712B2 (ja) 2024-06-20

Family

ID=84141285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023521983A Active JP7503712B2 (ja) 2021-05-17 2021-05-17 部品移載装置

Country Status (4)

Country Link
JP (1) JP7503712B2 (https=)
KR (1) KR102828117B1 (https=)
DE (1) DE112021007670T5 (https=)
WO (1) WO2022244033A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050045914A1 (en) 2003-07-09 2005-03-03 Newport Corporation Flip chip device assembly machine
JP2009295741A (ja) 2008-06-04 2009-12-17 Yamaha Motor Co Ltd 部品移載方法及び部品移載装置
JP2013117291A (ja) 2011-12-05 2013-06-13 Hiroshima Aluminum Industry Co Ltd 衝撃吸収部材
WO2015125646A1 (ja) 2014-02-24 2015-08-27 帝人株式会社 樹脂製衝撃吸収部材
JP2018206843A (ja) 2017-05-31 2018-12-27 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3097511B2 (ja) * 1995-09-22 2000-10-10 松下電器産業株式会社 チップの搭載装置
JP2007040468A (ja) * 2005-08-04 2007-02-15 Matsushita Electric Ind Co Ltd 衝撃吸収機構、及び該機構を備えた機械装置
JP4824641B2 (ja) * 2007-07-06 2011-11-30 ヤマハ発動機株式会社 部品移載装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050045914A1 (en) 2003-07-09 2005-03-03 Newport Corporation Flip chip device assembly machine
JP2009295741A (ja) 2008-06-04 2009-12-17 Yamaha Motor Co Ltd 部品移載方法及び部品移載装置
JP2013117291A (ja) 2011-12-05 2013-06-13 Hiroshima Aluminum Industry Co Ltd 衝撃吸収部材
WO2015125646A1 (ja) 2014-02-24 2015-08-27 帝人株式会社 樹脂製衝撃吸収部材
JP2018206843A (ja) 2017-05-31 2018-12-27 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法

Also Published As

Publication number Publication date
KR102828117B1 (ko) 2025-07-03
WO2022244033A1 (ja) 2022-11-24
DE112021007670T5 (de) 2024-03-07
KR20230158097A (ko) 2023-11-17
JPWO2022244033A1 (https=) 2022-11-24

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