WO2022244033A1 - 部品移載装置 - Google Patents

部品移載装置 Download PDF

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Publication number
WO2022244033A1
WO2022244033A1 PCT/JP2021/018530 JP2021018530W WO2022244033A1 WO 2022244033 A1 WO2022244033 A1 WO 2022244033A1 JP 2021018530 W JP2021018530 W JP 2021018530W WO 2022244033 A1 WO2022244033 A1 WO 2022244033A1
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WO
WIPO (PCT)
Prior art keywords
component
beam member
component transfer
transfer device
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/018530
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English (en)
French (fr)
Japanese (ja)
Inventor
洋平 岸本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to PCT/JP2021/018530 priority Critical patent/WO2022244033A1/ja
Priority to JP2023521983A priority patent/JP7503712B2/ja
Priority to KR1020237035651A priority patent/KR102828117B1/ko
Priority to DE112021007670.1T priority patent/DE112021007670T5/de
Publication of WO2022244033A1 publication Critical patent/WO2022244033A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

Definitions

  • the present invention relates to a component transfer device that includes a component transfer unit that picks a component from a component placement area and a camera unit that captures an image of the component in the component area.
  • a component mounting apparatus that picks up a die (bare chip) from a diced wafer and mounts it on a substrate is known.
  • a wafer camera takes an image of a wafer carried into a predetermined position (component placement area) inside the machine by a wafer feeder to recognize the wafer, and then the die is picked by a head equipped with a die holding function. The action of doing is repeated. That is, both the wafer camera and the head perform their respective required operations above the wafer carried into the machine.
  • the wafer camera and head are each driven by an orthogonal coordinate type drive mechanism. That is, the wafer camera is movably supported by the camera beam member, and the camera beam member moves in a direction orthogonal to the moving direction of the wafer camera.
  • a head unit having the head is movably supported by a head beam member parallel to the camera beam member, and the head beam member moves in the same direction as the camera beam member.
  • the component mounting apparatus mentioned above is no exception. If the wafer camera and the head unit interfere with each other, or if the beam members interfere with each other, they will not only be damaged, but also rails (guides) that movably support components of the drive mechanism, such as the wafer camera and the head unit. etc., and the smooth movement and positional accuracy of the wafer camera and head unit are impaired. In this case, recovery may require excessive time and cost.
  • Patent Document 1 discloses a technique of providing an impact absorbing mechanism in a mechanical structural portion of a component mounting apparatus to suppress damage when a moving body collides with the structural portion. However, this Patent Document 1 does not contain any description regarding the suppression of damage due to interference between moving bodies as described above.
  • the present invention has been made in view of the above-described problems, and its object is to avoid interference between a component transfer unit that picks components from a component placement area and a camera unit that captures images of components in the component area. In addition, it is intended to prevent each part of the drive mechanism from being damaged when an unintended drive force acts.
  • a component transfer apparatus picks a component from a component supply unit having a component arrangement area in which a plurality of components are arranged, and transfers the component to a predetermined component transfer unit.
  • a first beam member horizontally movable along at least one first movement axis extending in a first direction; a component transfer unit that moves in an upper space between the component placement area and the component transfer section; and a beam member supported by the second beam member so as to be movable along the second movement axis in an upper space between the component arrangement area and a predetermined standby position together with the second beam member, and a camera unit for imaging the component in the component arrangement area; and a camera unit provided on each of the first beam member and the second beam member. and a stopper member that collides with each other and absorbs the collision load when approaching up to.
  • FIG. 1 is a top plan view showing the overall configuration of a component mounting apparatus according to an embodiment of the present invention (a component mounting apparatus provided with a component transfer apparatus of the present invention).
  • FIG. 2 is a side view of the component mounting apparatus;
  • FIGS. 3A and 3B are side views of the component mounting apparatus for explaining the movement areas of the head unit and camera unit in the Y direction.
  • FIG. 4 is a side view of the stopper member.
  • FIG. 5 is a perspective view of the stopper member.
  • FIGS. 6A to 6E are schematic diagrams showing a series of steps from imaging a wafer by a camera unit to picking and mounting dies by a head unit.
  • FIG. 7 is a perspective view of a second stopper member according to a modification.
  • FIG. 1 is a top plan view showing the overall configuration of a component mounting apparatus 1 (a component mounting apparatus provided with a component transfer apparatus according to the present invention) according to an embodiment of the present invention.
  • 2 is a side view (partially omitted) of the component mounting apparatus 1.
  • FIG. The component mounting apparatus 1 is an apparatus that mounts a die 7a (component) diced from a wafer 7 on a substrate P.
  • FIG. The component mounting apparatus 1 includes a base 2, a conveyor 3, a head unit 4 (component transfer unit), a component supply unit 5 (component placement area), a wafer supply unit 6, a camera unit 20, and a push-up unit (not shown).
  • the base 2 is a mounting base for various devices provided in the component mounting apparatus 1 .
  • the conveyor 3 is a transport line for the substrate P installed on the base 2 so as to extend in the X direction.
  • the conveyor 3 carries the board P from the outside to a predetermined mounting work position (component transfer section/board placement section), and carries the board P out of the machine from the mounting work position after the mounting work.
  • the conveyor 3 has a clamping mechanism (not shown) that holds the substrate P at the mounting position.
  • the position of the substrate P shown in FIG. 1 is the mounting work position.
  • the component supply unit 5 supplies a plurality of dies 7a arranged by dicing from the wafer 7 .
  • the head unit 4 picks the die 7a in the component supply unit 5, moves to the mounting work position, and mounts the die 7a on the board P.
  • the head unit 4 includes a plurality of heads 4a for sucking and holding the die 7a during the picking and releasing the held die 7a during the mounting.
  • the head 4a can move back and forth (up and down) in the Z direction with respect to the head unit 4 and can rotate about its axis.
  • the component mounting apparatus 1 can move the head unit 4 in at least the upper space between the component supply unit 5 and the board P held at the mounting position in the horizontal direction (X and Y directions).
  • a drive mechanism D1 is provided.
  • the first drive mechanism D1 is an orthogonal coordinate drive mechanism including a Y-direction drive mechanism that moves the head unit 4 in the Y-direction and an X-direction drive mechanism that moves the head unit 4 in the X-direction.
  • a pair of Y-axis fixed rails 11, a first Y-axis servo motor 13 and a ball screw shaft 12 are provided on the +X side and -X side, respectively.
  • a first elevated frame 2H extending in the Y direction is provided at both ends of the base 2 in the X direction, and a pair of Y-axis fixed rails 11 are fixed on the first elevated frame 2H and It extends in parallel in the Y direction.
  • the ball screw shaft 12 is arranged to extend in the Y direction at a position close to the Y-axis fixed rail 11 on the first elevated frame 2H.
  • the pair of ball screw shafts 12 are arranged outside the pair of Y-axis fixed rails 11 in the X direction.
  • a first Y-axis servomotor 13 rotationally drives the ball screw shaft 12 .
  • a first beam member 10 that supports the head unit 4 is installed between the pair of Y-axis fixed rails 11 .
  • a nut 10a with which each ball screw shaft 12 is screwed is assembled to the +X side end and the -X side end of the first beam member 10 .
  • an X-axis fixed rail 14 mounted on the first beam member 10, a first X-axis servomotor 16 and a ball screw shaft 15 are provided.
  • the X-axis fixed rail 14 is a member that guides movement of the head unit 4 in the X direction, and is fixed to the -Y side surface of the first beam member 10 so as to extend in the X direction.
  • the ball screw shaft 15 is arranged close to the X-axis fixed rail 14 so as to extend in the X direction.
  • a first X-axis servomotor 16 rotationally drives the ball screw shaft 15 .
  • a nut (not shown) is attached to the head unit 4, and the ball screw shaft 15 is screwed to the nut.
  • the head unit 4 moves in the horizontal direction (X and Y directions). That is, when the ball screw shaft 12 is rotationally driven by the first Y-axis servomotor 13, the head unit 4 moves together with the first beam member 10 in the Y direction. Further, the head unit 4 moves in the X direction with respect to the first beam member 10 by rotationally driving the ball screw shaft 15 by the first X-axis servomotor 16 .
  • the ball screw shaft 12 and the Y-axis fixed rail 11 correspond to the "first moving shaft" of the invention.
  • the component supply unit 5 includes a wafer supply device 6 that supplies a plurality of dies 7a in the form of wafers 7 to a predetermined component extraction work position (wafer stage).
  • the position of the wafer 7 shown in FIG. 1 is the component extraction work position.
  • the wafer 7 is a disk-shaped semiconductor wafer on which circuit patterns and the like are already formed.
  • the wafer 7 is adhered to a wafer sheet in the state of an assembly of a large number of dies 7a, 7a, .
  • the wafer supply device 6 supplies the die 7a to the component extraction work position in such a manner that the wafer holding frame 8 holding the wafer sheet to which the wafer 7 is adhered is exchanged.
  • the component supply unit 5 may include a tape feeder for supplying components in the form of a component storage tape containing electronic components.
  • the wafer supply device 6 includes a wafer storage elevator (not shown) and a wafer conveyor 6a.
  • the wafer storage elevator stores the wafer sheets 8a to which the wafers 7 are adhered on the wafer holding frame 8 in multiple stages.
  • the wafer conveyor 6a moves the wafer holding frame 8 into and out of the wafer storage elevator to and from the component extraction work position.
  • the camera unit 20 is a unit that can move in the X and Y directions, and includes a wafer camera 21.
  • the wafer camera 21 captures an image of a portion of the wafer 7 positioned at the component picking work position, that is, the die 7a within the camera field of view. Based on this captured image, the position of the die 7a to be picked up is recognized.
  • the component mounting apparatus 1 includes a second drive mechanism D2 that allows the camera unit 20 to move in at least the upper space between the component supply section 5 and a predetermined standby position in the horizontal direction (X and Y directions).
  • the second drive mechanism D2 is a drive system that is separate and independent from the first drive mechanism D1 that drives the head unit 4.
  • the standby position is a position spaced apart on the +Y side from the component extraction work position (see FIG. 3(B)).
  • the second drive mechanism D2 is also an orthogonal coordinate drive mechanism similar to the first drive mechanism D1, and includes a Y-direction drive mechanism that moves the camera unit 20 in the Y direction and an X-direction drive mechanism that moves the camera unit 20 in the X direction. .
  • the Y-direction drive mechanism includes a pair of Y-axis fixed rails 23, a second Y-axis servomotor 25 and a ball screw shaft 24 on the +X side and -X side.
  • a second elevated frame 2L extending in the Y direction is provided on the base 2 and inside the pair of first elevated frames 2H. They are fixed on the elevated frame 2L and extend parallel to each other in the Y direction.
  • the ball screw shaft 24 is arranged to extend in the Y direction at a position close to the Y-axis fixed rail 23 on the second elevated frame 2L.
  • the pair of ball screw shafts 24 are arranged outside the pair of Y-axis fixed rails 23 in the X direction.
  • a second Y-axis servomotor 25 rotationally drives the ball screw shaft 24 .
  • a second beam member 22 that supports the camera unit 20 is installed between the pair of Y-axis fixed rails 23 . Nuts 22a with which the ball screw shafts 24 are screwed are assembled to the +X side end and the -X side end of the second beam member 22 .
  • the X-direction drive mechanism comprises a pair of X-axis fixed rails 26 mounted on the second beam member 22, a second X-axis servomotor 28 and a ball screw shaft 27.
  • the X-axis fixing rail 26 is a member that guides movement of the camera unit 20 in the X direction, and is fixed on the upper surface of the second beam member 22 so as to extend in the X direction.
  • the ball screw shaft 27 is arranged between the pair of X-axis fixed rails 26 so as to extend in the X direction.
  • a second X-axis servomotor 28 rotationally drives the ball screw shaft 27 .
  • a nut (not shown) is attached to the camera unit 20 , and the nut is screwed onto the ball screw shaft 27 .
  • the camera unit 20 moves in the horizontal direction (X and Y directions). That is, the ball screw shaft 24 is rotationally driven by the second Y-axis servomotor 25, so that the camera unit 20 moves together with the second beam member 22 in the Y direction. Further, the camera unit 20 moves in the X direction with respect to the second beam 22 by rotationally driving the ball screw shaft 27 by the second X-axis servomotor 28 .
  • the ball screw shaft 24 and the Y-axis fixed rail 23 correspond to the "second moving shaft" of the invention.
  • the height of the surface on which the second driving mechanism D2 is arranged in the second elevated frame 2L is lower than the height H1 of the surface on which the first driving mechanism D1 is arranged in the first elevated frame 2H. . That is, the second beam member 22 is offset downward with respect to the first beam member 10 so as not to interfere with the first beam member 10 . Also, the top surface of the camera unit 20 is set lower than the bottom surface of the first beam member 10 so that the camera unit 20 does not interfere with the first beam member 10 .
  • the push-up unit is arranged below the component supply unit 5 and is not shown.
  • the push-up unit pushes up the die 7a to be picked up by the head 4a from the lower surface side of the wafer sheet 8a.
  • the push-up unit is arranged on the base 2 so as to be movable in the XY directions over a range corresponding to the component picking work position (wafer stage).
  • the push-up unit has a push-up pin that moves up and down by a pin lifting motor. When the die 7a is sucked by the head 4a, the push-up pin is lifted to push up the die 7a through the wafer sheet 8a.
  • FIG. 3 is a side view of the component mounting apparatus 1 for explaining the moving areas of the head unit 4 and the camera unit 20 in the Y direction.
  • FIG. 3A shows a state in which the head unit 4 and camera unit 20 are arranged on the most -Y side of the movable area, and FIG. It shows the state placed on the side.
  • the head unit 4 and the first beam member 10 have a head unit movement area A1 corresponding to the installation range of the ball screw shaft 12 extending in the Y direction.
  • the camera unit 20 and the second beam member 22 have a camera unit movement area A2 corresponding to the installation range of the ball screw shaft 24 extending in the Y direction.
  • the head unit movement area A1 has a size that extends from the space above the component supply unit 5 (wafer stage) to the space above the component recognition camera (not shown) through the conveyor 3 . This is because the head unit 4 picks the die 7a from the wafer 7 on the wafer stage, recognizes the component with the component recognition camera, and then mounts the die 7a on the board P on the conveyor 3. .
  • the camera unit movement area A2 has a size extending from the upper space of the component supply section 5 to the upper space in front of the wafer storage elevator (not shown) on the +Y side. This is because the wafer camera 21 performs an operation of imaging the wafer 7 on the wafer stage and an operation of retracting from the wafer stage to the +Y side.
  • both the head unit 4 and the camera unit 20 work on the wafer 7 of the component supply section 5 (wafer stage).
  • 5 includes interference areas CA that overlap each other in the Y direction.
  • the interference area CA is an area where interference occurs between the head unit 4 and the camera unit 20 when they coexist. Therefore, the movements of the first beam member 10 and the second beam member 22 are controlled so that the head unit 4 and the camera unit 20 do not interfere with each other in the interference area CA.
  • the first beam member 10 or the second beam member 22 may run out of control, causing the head unit 4 and the camera to become out of control. Interference with unit 20 may occur. Therefore, in the component mounting apparatus 1, as shown in FIGS. 1 and 2, the first beam member 10 and the second beam member 22 are each provided with a stopper member 30. As shown in FIGS.
  • the stopper member 30 is composed of a first stopper member 32 provided on the first beam member 10 and a second stopper member 34 provided on the second beam member 22 .
  • the first stopper member 32 and the second stopper member 34 collide with each other when the Y-direction distance (interval) In between the head unit 4 and the camera unit 20 approaches a predetermined interference limit distance InL (InL>0). It is designed to
  • the camera unit 20 and the second beam member 22 are offset downward with respect to the first beam member 10, and the camera unit 20 and the second beam member 22 and the first beam member 10 are basically do not interfere with
  • the interference limit distance InL is set to a distance in the Y direction at which the head unit 4 and the camera unit 20 do not interfere with each other and at which the head unit 4 and the camera unit 20 can approach each other as much as possible.
  • this interference limit distance InL is set to the position of the head unit 4 and the camera unit 20 in the Y direction so that interference can be avoided regardless of the positional relationship between the head unit 4 and the camera unit 20 in the X direction. Set based on relationships only.
  • the second stopper members 34 are arranged at symmetrical positions on both ends in the X direction on the second beam member 22 and at the ends on the -Y side.
  • the pair of second stopper members 34 are arranged in the X direction between or near the Y-axis fixed rail 11 that guides the first beam member 10 and the Y-axis fixed rail 23 that guides the second beam member 22. , and is located above the pair of ball screw shafts 24 in this example. That is, the second stopper member 34 collides with the first stopper member 32 between the Y-axis fixed rail 11 and the Y-axis fixed rail 23 in the X direction.
  • the second stopper member 34 is provided to extend upward from the second beam member 22, as shown in FIGS.
  • the second stopper member 34 includes a stopper body 35 and a shock absorber 36 (also called a damper) attached thereto.
  • the stopper main body 35 is a sheet metal press-molded part, and is fixed to the upper surface of the second beam member 22 in an upright posture.
  • the stopper body 35 includes a collision surface portion 35a extending vertically (in the Z direction) facing the -Y side, side portions 35b extending in the +Y direction from both ends of the collision surface portion 35a in the X direction, and X direction portions extending from the lower ends of the side portions 35b. and an inwardly extending leg 35c.
  • Each leg portion 35c is fastened to the second beam member 22 with a screw or the like. Thereby, the second stopper member 34 is fixed to the second beam member 22 .
  • the shock absorber 36 is one of the cushioning members.
  • the shock absorber 36 is a cylindrical metal member assembled to the collision surface portion 35a of the stopper body 35 so as to protrude in the -Y direction. deformation) to absorb the impact load.
  • Such a type of shock absorber that absorbs a collision load only once by plastic deformation is called a one-shot type.
  • the first stopper member 32 is provided below the first beam member 10 so as to extend downward.
  • the first stopper member 32 is a sheet metal press-molded part similar to the stopper main body 35 and has a shape similar to that of the stopper main body 35 . That is, the first stopper member 32 includes a collision surface portion 36a facing the collision surface portion 35a of the second stopper member 34, side portions 36b extending in the -Y direction from both ends of the collision surface portion 36a in the X direction, and side portions 36b. and leg portions 36c extending outward in the X direction from the lower ends of the respective members, and the leg portions 36c are fastened to the first beam member 10 with screws or the like.
  • the total weight of the head unit 4 and the first beam member 10 supporting it is heavier than the total weight of the camera unit 20 and the second beam member 22 supporting it.
  • the precision is higher than the positional precision required for the camera unit 20 . Therefore, the moment load (moment load around the X axis) acting on the head unit 4 and the first beam member 10 at the time of collision is reduced, and the second stopper member 34 on the camera unit 20 side is actively deformed to reduce the collision load. should be absorbed.
  • the vertical length (Z-direction length) of the first stopper member 32 is set shorter than the vertical length (Z-direction length) of the second stopper member 34, and the first stopper member 32 and the second stopper member 34 (shock absorber 36) collide with each other at positions deviated from the first beam member 10 in the vertical direction (Z direction). That is, as shown in FIG. 4, when the distance from the lower surface of the first beam member 10 to the collision position (the position indicated by the dashed line) is H1, and the distance from the upper surface of the second beam member 22 to the collision position is H2. , H1 ⁇ H2.
  • FIG. 6A to 6E show basic operations of the component mounting apparatus 1 described above, that is, basic operations from imaging of the wafer 7 by the camera unit 20 to picking and mounting of the dies 7a by the head unit 4. It is a schematic diagram.
  • FIG. 6A shows a state in which the head unit 4 is located on the most ⁇ Y side of the head unit movement area A1 (the state of FIG. 3A), and the camera unit 20 is located on the most +Y side of the camera unit movement area A2. (state of FIG. 3B).
  • FIG. 6(B) shows a state in which the camera unit 20 picks up an image of the wafer 7 within the interference area CA and the head 4a of the head unit 4 mounts the die 7a on the substrate P.
  • the imaging by the camera unit 20 here is for recognizing the group of dies 7a to be picked up by the head 4a in the next picking operation.
  • the mounting operation by the head 4a here is an operation for mounting the die 7a sucked by the picking operation this time on the substrate P. As shown in FIG.
  • FIG. 6(C) shows a state in which the camera unit 20 is moving to retreat from the interference area CA, while the head unit 4 is moving to enter the interference area CA.
  • the entering movement of the head unit 4 is movement for picking the die 7a group recognized by the imaging by the camera unit 20 immediately before from the wafer 7.
  • FIG. The retraction movement of the camera unit 20 is movement for avoiding interference with the head unit 4 .
  • FIG. 6D shows a state in which the head 4a is picking the die 7a.
  • FIG. 6(E) shows a state in which the head unit 4 moves away from the interference area CA while the camera unit 20 moves into the interference area CA.
  • the retraction movement of the head unit 4 is an operation for mounting the group of dies 7a sucked by the picking operation shown in FIG.
  • the incoming movement of the camera unit 20 is a movement for picking up an image of the group of dies 7a to be picked up by the head 4a in the next picking operation.
  • the die 7a recognition-picking-mounting cycle is executed such that the head unit 4 and the camera unit 20 are sequentially switched in the interference area CA.
  • interference between the head unit 4 and the camera unit 20 is reliably avoided.
  • the head unit 4 and the camera unit 20 approach each other in the interference area CA, if the distance (interval) In between them reaches the interference limit distance InL, the first stopper member 32 and the second The head unit 4 and the camera unit 20 are prevented from interfering with each other. Therefore, even if the first beam member 10 or the second beam member 22 runs out of control in the interference area CA due to a software problem or the like, interference between the head unit 4 and the camera unit 20 is avoided.
  • the shock absorber 36 shrinks (plastically deforms) according to the magnitude of the collision load, thereby absorbing the collision load. Therefore, the collision between the first stopper member 32 and the second stopper member 34 may damage the head unit 4, the camera unit 20, and the drive mechanisms D1 and D2 including the first and second beam members 10 and 22. Suppressed.
  • the stopper members 30 are arranged in the vicinity of both ends of the beam members 10, 22 in the X direction, the collision load is dispersed and absorbed by the shock absorber 36. Therefore, the collision load is effectively reduced.
  • the vertical length of the first stopper member 32 is set shorter than the vertical length of the second stopper member 34, and both stopper members 32 collide with each other at positions biased toward the first beam member 10, 34 are provided (H1 ⁇ H2 in FIG. 4). Therefore, the moment load acting on the head unit 4 and the first beam member 10 at the time of collision can be reduced, and the second stopper member 34 is further deformed to absorb the collision load. Therefore, damage to the head unit 4, which requires higher positional accuracy than the camera unit 20, is effectively suppressed.
  • the stopper members 30 are positioned in the middle or in the vicinity of the Y-axis fixed rail 11 that guides the first beam member 10 and the Y-axis fixed rail 23 that guides the second beam member 22.
  • the distance from the first stopper member 32 to which the collision load is input to the Y-axis fixed rail 11 is shortened, and with respect to the second beam member 22, , the distance from the first stopper member 32 to which the collision load is input to the Y-axis fixed rail 11 (position of the slider) is shortened.
  • both the moment load about the vertical axis of the first beam member 10 and the moment load about the vertical axis of the second beam member 22 are kept relatively small. Therefore, deformation (distortion) of the Y-axis fixed rails 11, 23 and the like due to the collision of the stopper members 30 (32, 34) is suppressed.
  • the stopper members 30 (32, 34) are arranged at mutually symmetrical positions near both ends of the beam members 10, 22 in the X direction. Behavior of the first and second beam members 10 and 22 is less likely to become unstable at the time of collision. Therefore, in this respect as well, deformation (distortion) of the Y-axis fixed rails 11, 23 and the like is suppressed.
  • the component mounting apparatus 1 described above is an example of a preferred embodiment of a component mounting apparatus equipped with a component transfer device according to the present invention, and its specific configuration may be changed as appropriate without departing from the gist of the present invention. Can be changed. For example, it is possible to employ the following configuration.
  • the first stopper member 32 on the second beam member 22 side is provided with the shock absorber 36, but the shock absorber 36 may be provided on the first stopper member 32 side. good.
  • the head unit 4 is required to move at high speed and with high precision compared to the camera unit 20, it is preferable to be provided in the second stopper member 34 from the viewpoint of weight reduction.
  • the shock absorber 36 may be a shock absorber capable of repeatedly absorbing a collision load using a spring, rubber, air pressure, or the like, other than a one-shot type shock absorber that absorbs a collision load by plastic deformation.
  • a cushioning member instead of the shock absorber 36, a molding such as foamed resin may be provided.
  • a second stopper member 34 having a rectangular parallelepiped cushioning member 37 made of urethane or the like on the collision surface portion 35a may be used.
  • the stopper member 30 is arranged in the X direction between or near the Y-axis fixed rail 11 that guides the first beam member 10 and the Y-axis fixed rail 23 that guides the second beam member 22 .
  • the stopper member 30 (32, 34) may be provided at only one location, or may be provided at three or more locations in the X direction.
  • the stopper members 32 and 34 are made of sheet metal press-molded parts, but may be made of, for example, metal or resin block-shaped structures.
  • the stopper member 30 (32, 34) can be provided at a low cost, and the deformation of the stopper member 30 (32, 34) itself at the time of collision can absorb the impact. It has the advantage of being able to
  • a component transfer apparatus picks a component from a component supply unit having a component arrangement area in which a plurality of components are arranged, and transfers the component to a predetermined component transfer unit.
  • This component transfer device includes a first beam member horizontally movable along at least one first movement axis extending in a first direction; a component transfer unit that moves together with the member in an upper space between the component placement area and the component transfer unit; and horizontally movable along at least one second movement axis parallel to the first movement axis.
  • a second beam member supported by the second beam member so as to be movable along the second movement axis in an upper space between the component arrangement area and a predetermined standby position together with the second beam member.
  • a camera unit for capturing an image of the component in the component placement area; and a camera unit provided on each of the first beam member and the second beam member, wherein the component transfer unit and the camera unit are arranged in the first direction in a predetermined direction. and a stopper member that collides with each other and absorbs the collision load when approaching an interference limit distance.
  • the stopper members provided on the respective beam members collide with each other, causing the component transfer unit and the camera unit to collide with each other. avoids interference with In this case, the collision load is absorbed by the stopper member, thereby suppressing damage to the component transfer unit, the camera unit, the first and second beam members, the moving shaft, and the like.
  • the second beam member is offset downward with respect to the first beam member, and the stopper member includes a first stopper member provided below the first beam member; It is preferable that the second stopper member is provided on the upper portion of the second beam member.
  • the second beam member is offset downward with respect to the first beam member, so that the stopper members ( The first stopper member and the second stopper member) can collide.
  • the first stopper member extends downward from the first beam member
  • the second stopper member extends upward from the second beam member
  • this component transfer device it is possible to reduce the moment load acting on the component transfer unit at the time of collision. It is possible to prevent the mounted unit from receiving damage.
  • the first beam member moves along the pair of first movement axes parallel to each other, and the second beam member moves along the pair of second movement axes parallel to each other.
  • one of the pair of first movement shafts and the pair of second movement shafts is arranged outside the pair of movement shafts on the other side; In view, it is preferably arranged inside the moving shaft pair on the one side.
  • the stopper member is arranged inside the pair of moving shafts on one side in a plan view, the stopper member is arranged outside the pair of moving shafts on one side. Contributes to the compactness of the entire device.
  • both the first beam member and the second beam member extend in a direction intersecting with the first direction, and the stopper member, in plan view, Preferably, they are located near both ends of the member and the second beam member, respectively.
  • the collision load when the stopper members collide with each other is distributed to two locations. Therefore, the behavior of the first and second beam members when the stopper members collide with each other can be stabilized, and deformation of the first moving shaft and the second moving shaft can be suppressed.
  • the stopper members are arranged so as to collide with each other between the pair of moving shafts on the one side and the pair of moving shafts on the other side in a plan view. .
  • the distance from the collision position between the stopper members to each movement axis is relatively short. Therefore, when the stopper members collide with each other, the deformation of the first moving shaft due to the moment load about the vertical axis of the first beam member and the deformation of the second moving shaft due to the moment load about the vertical axis of the second beam member are suppressed. be.
  • the stopper member has a shock absorber.
  • the shock absorber can effectively absorb the impact load when the stopper members collide with each other.
  • the first stopper portion and the second stopper portion are press-molded parts made of a metal plate.
  • the component placement area may be an area in which a diced wafer is placed, and the component may be a die.
  • the component transfer unit is a head unit having a head that attracts the die
  • the camera unit is a wafer camera that captures an image of the wafer
  • the component transfer unit is mounted with the die. It may be a substrate placement portion where a substrate is placed.
  • this component transfer device it is possible to enjoy the above-described effects in a component mounting device that sucks a die from a diced wafer and mounts the die on a substrate.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PCT/JP2021/018530 2021-05-17 2021-05-17 部品移載装置 Ceased WO2022244033A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2021/018530 WO2022244033A1 (ja) 2021-05-17 2021-05-17 部品移載装置
JP2023521983A JP7503712B2 (ja) 2021-05-17 2021-05-17 部品移載装置
KR1020237035651A KR102828117B1 (ko) 2021-05-17 2021-05-17 부품 이송 장치
DE112021007670.1T DE112021007670T5 (de) 2021-05-17 2021-05-17 Bauteilüberführungsvorrichtung

Applications Claiming Priority (1)

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PCT/JP2021/018530 WO2022244033A1 (ja) 2021-05-17 2021-05-17 部品移載装置

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KR (1) KR102828117B1 (https=)
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WO (1) WO2022244033A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0992664A (ja) * 1995-09-22 1997-04-04 Matsushita Electric Ind Co Ltd チップの搭載装置
US20050045914A1 (en) * 2003-07-09 2005-03-03 Newport Corporation Flip chip device assembly machine
JP2007040468A (ja) * 2005-08-04 2007-02-15 Matsushita Electric Ind Co Ltd 衝撃吸収機構、及び該機構を備えた機械装置
JP2009016673A (ja) * 2007-07-06 2009-01-22 Yamaha Motor Co Ltd 部品の吸着位置補正方法および部品移載装置
JP2009295741A (ja) * 2008-06-04 2009-12-17 Yamaha Motor Co Ltd 部品移載方法及び部品移載装置
JP2013117291A (ja) * 2011-12-05 2013-06-13 Hiroshima Aluminum Industry Co Ltd 衝撃吸収部材
WO2015125646A1 (ja) * 2014-02-24 2015-08-27 帝人株式会社 樹脂製衝撃吸収部材
JP2018206843A (ja) * 2017-05-31 2018-12-27 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0992664A (ja) * 1995-09-22 1997-04-04 Matsushita Electric Ind Co Ltd チップの搭載装置
US20050045914A1 (en) * 2003-07-09 2005-03-03 Newport Corporation Flip chip device assembly machine
JP2007040468A (ja) * 2005-08-04 2007-02-15 Matsushita Electric Ind Co Ltd 衝撃吸収機構、及び該機構を備えた機械装置
JP2009016673A (ja) * 2007-07-06 2009-01-22 Yamaha Motor Co Ltd 部品の吸着位置補正方法および部品移載装置
JP2009295741A (ja) * 2008-06-04 2009-12-17 Yamaha Motor Co Ltd 部品移載方法及び部品移載装置
JP2013117291A (ja) * 2011-12-05 2013-06-13 Hiroshima Aluminum Industry Co Ltd 衝撃吸収部材
WO2015125646A1 (ja) * 2014-02-24 2015-08-27 帝人株式会社 樹脂製衝撃吸収部材
JP2018206843A (ja) * 2017-05-31 2018-12-27 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法

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KR102828117B1 (ko) 2025-07-03
DE112021007670T5 (de) 2024-03-07
JP7503712B2 (ja) 2024-06-20
KR20230158097A (ko) 2023-11-17
JPWO2022244033A1 (https=) 2022-11-24

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