DE112021007463B4 - Leiterplatte - Google Patents

Leiterplatte Download PDF

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Publication number
DE112021007463B4
DE112021007463B4 DE112021007463.6T DE112021007463T DE112021007463B4 DE 112021007463 B4 DE112021007463 B4 DE 112021007463B4 DE 112021007463 T DE112021007463 T DE 112021007463T DE 112021007463 B4 DE112021007463 B4 DE 112021007463B4
Authority
DE
Germany
Prior art keywords
grounding structure
grounding
circuit board
main surface
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112021007463.6T
Other languages
German (de)
English (en)
Other versions
DE112021007463T5 (de
Inventor
Yusuke Yamakaji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112021007463T5 publication Critical patent/DE112021007463T5/de
Application granted granted Critical
Publication of DE112021007463B4 publication Critical patent/DE112021007463B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/75—Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Geometry (AREA)
DE112021007463.6T 2021-04-06 2021-04-06 Leiterplatte Active DE112021007463B4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/014662 WO2022215176A1 (ja) 2021-04-06 2021-04-06 プリント回路基板

Publications (2)

Publication Number Publication Date
DE112021007463T5 DE112021007463T5 (de) 2024-01-25
DE112021007463B4 true DE112021007463B4 (de) 2025-02-13

Family

ID=83545223

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021007463.6T Active DE112021007463B4 (de) 2021-04-06 2021-04-06 Leiterplatte

Country Status (5)

Country Link
US (1) US12057414B2 (https=)
JP (1) JP7395057B2 (https=)
CN (1) CN117063618B (https=)
DE (1) DE112021007463B4 (https=)
WO (1) WO2022215176A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022209843A1 (ja) * 2021-03-30 2022-10-06 株式会社オートネットワーク技術研究所 通信器及び通信装置
TWI873532B (zh) * 2023-02-09 2025-02-21 朋程科技股份有限公司 電路基板與電子裝置
CN119024935A (zh) * 2024-08-12 2024-11-26 深圳昂湃技术股份有限公司 一种具有导引漏电流的水冷头结构及其水冷装置
JP7747251B1 (ja) * 2025-03-19 2025-10-01 三菱電機株式会社 ファクトリーオートメーション機器、ファクトリーオートメーションシステム、正常モデル生成方法およびプログラム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016219553A (ja) 2015-05-18 2016-12-22 三菱電機株式会社 回路基板
JP2020053491A (ja) 2018-09-25 2020-04-02 日立オートモティブシステムズ株式会社 電子制御装置
JP6843312B1 (ja) 2020-03-25 2021-03-17 三菱電機株式会社 回路基板及び電子機器

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2845210B2 (ja) * 1996-08-27 1999-01-13 日本電気株式会社 電磁放射を低減するグランド構成
JP3055136B2 (ja) 1998-03-16 2000-06-26 日本電気株式会社 プリント回路基板
JP3482882B2 (ja) * 1998-08-12 2004-01-06 松下電工株式会社 高周波電源回路
JP4860990B2 (ja) * 2005-11-29 2012-01-25 キヤノン株式会社 回路接続構造およびプリント回路板
JP5437558B2 (ja) * 2006-11-16 2014-03-12 三菱電機株式会社 プリント基板の電磁ノイズ対策構造
JP5060422B2 (ja) 2008-08-05 2012-10-31 キヤノン株式会社 プリント配線基板及び該プリント配線基板を有する装置
JP5063529B2 (ja) 2008-08-22 2012-10-31 キヤノン株式会社 プリント回路板
JP5609329B2 (ja) 2010-03-12 2014-10-22 富士電機株式会社 プリント基板
JP2012253054A (ja) 2011-05-31 2012-12-20 Renesas Electronics Corp 光伝送モジュール
JP2013012528A (ja) 2011-06-28 2013-01-17 Mitsubishi Electric Corp プリント基板
JP5348259B2 (ja) * 2012-02-02 2013-11-20 横河電機株式会社 絶縁回路及び通信機器
JP6075834B2 (ja) * 2012-08-16 2017-02-08 キヤノン株式会社 プリント回路板
JP5740427B2 (ja) 2013-03-29 2015-06-24 本田技研工業株式会社 回路基板を備える制御装置
US9433083B2 (en) * 2014-04-04 2016-08-30 Macom Technology Solutions Holdings, Inc. Edge mount connector arrangement with improved characteristic impedance
JP6373912B2 (ja) 2016-08-24 2018-08-15 本田技研工業株式会社 ノイズフィルタ、及び当該ノイズフィルタが形成された回路基板
JP6765640B2 (ja) * 2017-01-30 2020-10-07 日立金属株式会社 コネクタ及びコネクタ付きケーブル
KR101999509B1 (ko) * 2017-03-24 2019-07-11 미쓰비시덴키 가부시키가이샤 회로 기판
WO2019089903A1 (en) * 2017-11-01 2019-05-09 Finisar Corporation Communication modules
JP6867036B2 (ja) 2018-03-26 2021-04-28 Ｎｅｃプラットフォームズ株式会社 無線通信装置およびノイズ抑制方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016219553A (ja) 2015-05-18 2016-12-22 三菱電機株式会社 回路基板
JP2020053491A (ja) 2018-09-25 2020-04-02 日立オートモティブシステムズ株式会社 電子制御装置
JP6843312B1 (ja) 2020-03-25 2021-03-17 三菱電機株式会社 回路基板及び電子機器

Also Published As

Publication number Publication date
CN117063618A (zh) 2023-11-14
US20240194617A1 (en) 2024-06-13
JP7395057B2 (ja) 2023-12-08
CN117063618B (zh) 2024-05-17
JPWO2022215176A1 (https=) 2022-10-13
WO2022215176A1 (ja) 2022-10-13
US12057414B2 (en) 2024-08-06
DE112021007463T5 (de) 2024-01-25

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