DE112021007067T5 - Abdeckplatte und elektronische vorrichtung - Google Patents
Abdeckplatte und elektronische vorrichtung Download PDFInfo
- Publication number
- DE112021007067T5 DE112021007067T5 DE112021007067.3T DE112021007067T DE112021007067T5 DE 112021007067 T5 DE112021007067 T5 DE 112021007067T5 DE 112021007067 T DE112021007067 T DE 112021007067T DE 112021007067 T5 DE112021007067 T5 DE 112021007067T5
- Authority
- DE
- Germany
- Prior art keywords
- connector
- cover plate
- opening
- circuit board
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001629 suppression Effects 0.000 claims abstract description 62
- 238000001816 cooling Methods 0.000 claims description 29
- 238000003780 insertion Methods 0.000 claims description 12
- 230000037431 insertion Effects 0.000 claims description 12
- 230000004048 modification Effects 0.000 description 18
- 238000012986 modification Methods 0.000 description 18
- 210000000078 claw Anatomy 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/1418—Card guides, e.g. grooves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1452—Mounting of connectors; Switching; Reinforcing of back panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/015335 WO2022219721A1 (ja) | 2021-04-13 | 2021-04-13 | フェイスプレートおよび電子装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112021007067T5 true DE112021007067T5 (de) | 2023-11-23 |
Family
ID=83639921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112021007067.3T Pending DE112021007067T5 (de) | 2021-04-13 | 2021-04-13 | Abdeckplatte und elektronische vorrichtung |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240206101A1 (https=) |
| JP (1) | JP7525732B2 (https=) |
| CN (1) | CN117158118A (https=) |
| DE (1) | DE112021007067T5 (https=) |
| WO (1) | WO2022219721A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019186373A (ja) | 2018-04-10 | 2019-10-24 | ファナック株式会社 | 電子装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02120889U (https=) * | 1989-03-15 | 1990-09-28 | ||
| JPH06105080A (ja) * | 1992-09-16 | 1994-04-15 | Seiko Epson Corp | 画像読取装置 |
| JP2003198162A (ja) | 2001-12-28 | 2003-07-11 | Toshiba Tec Corp | 積み上げ配線基板構造 |
| CN101470487B (zh) | 2007-12-27 | 2011-01-26 | 鸿富锦精密工业（深圳）有限公司 | 板卡固定装置 |
-
2021
- 2021-04-13 JP JP2023514226A patent/JP7525732B2/ja active Active
- 2021-04-13 CN CN202180096788.9A patent/CN117158118A/zh not_active Withdrawn
- 2021-04-13 US US18/286,647 patent/US20240206101A1/en not_active Abandoned
- 2021-04-13 WO PCT/JP2021/015335 patent/WO2022219721A1/ja not_active Ceased
- 2021-04-13 DE DE112021007067.3T patent/DE112021007067T5/de active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019186373A (ja) | 2018-04-10 | 2019-10-24 | ファナック株式会社 | 電子装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022219721A1 (ja) | 2022-10-20 |
| US20240206101A1 (en) | 2024-06-20 |
| JP7525732B2 (ja) | 2024-07-30 |
| CN117158118A (zh) | 2023-12-01 |
| JPWO2022219721A1 (https=) | 2022-10-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R012 | Request for examination validly filed |