JPWO2022219721A1 - - Google Patents

Info

Publication number
JPWO2022219721A1
JPWO2022219721A1 JP2023514226A JP2023514226A JPWO2022219721A1 JP WO2022219721 A1 JPWO2022219721 A1 JP WO2022219721A1 JP 2023514226 A JP2023514226 A JP 2023514226A JP 2023514226 A JP2023514226 A JP 2023514226A JP WO2022219721 A1 JPWO2022219721 A1 JP WO2022219721A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023514226A
Other languages
Japanese (ja)
Other versions
JP7525732B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022219721A1 publication Critical patent/JPWO2022219721A1/ja
Application granted granted Critical
Publication of JP7525732B2 publication Critical patent/JP7525732B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/1418—Card guides, e.g. grooves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1452—Mounting of connectors; Switching; Reinforcing of back panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP2023514226A 2021-04-13 2021-04-13 フェイスプレートおよび電子装置 Active JP7525732B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/015335 WO2022219721A1 (ja) 2021-04-13 2021-04-13 フェイスプレートおよび電子装置

Publications (2)

Publication Number Publication Date
JPWO2022219721A1 true JPWO2022219721A1 (https=) 2022-10-20
JP7525732B2 JP7525732B2 (ja) 2024-07-30

Family

ID=83639921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023514226A Active JP7525732B2 (ja) 2021-04-13 2021-04-13 フェイスプレートおよび電子装置

Country Status (5)

Country Link
US (1) US20240206101A1 (https=)
JP (1) JP7525732B2 (https=)
CN (1) CN117158118A (https=)
DE (1) DE112021007067T5 (https=)
WO (1) WO2022219721A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06105080A (ja) * 1992-09-16 1994-04-15 Seiko Epson Corp 画像読取装置
JP2003198162A (ja) * 2001-12-28 2003-07-11 Toshiba Tec Corp 積み上げ配線基板構造
US20090168341A1 (en) * 2007-12-27 2009-07-02 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Mounting apparatus for expansion card
JP2019186373A (ja) * 2018-04-10 2019-10-24 ファナック株式会社 電子装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02120889U (https=) * 1989-03-15 1990-09-28

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06105080A (ja) * 1992-09-16 1994-04-15 Seiko Epson Corp 画像読取装置
JP2003198162A (ja) * 2001-12-28 2003-07-11 Toshiba Tec Corp 積み上げ配線基板構造
US20090168341A1 (en) * 2007-12-27 2009-07-02 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Mounting apparatus for expansion card
JP2019186373A (ja) * 2018-04-10 2019-10-24 ファナック株式会社 電子装置

Also Published As

Publication number Publication date
DE112021007067T5 (de) 2023-11-23
WO2022219721A1 (ja) 2022-10-20
US20240206101A1 (en) 2024-06-20
JP7525732B2 (ja) 2024-07-30
CN117158118A (zh) 2023-12-01

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