JPWO2022219721A1 - - Google Patents
Info
- Publication number
- JPWO2022219721A1 JPWO2022219721A1 JP2023514226A JP2023514226A JPWO2022219721A1 JP WO2022219721 A1 JPWO2022219721 A1 JP WO2022219721A1 JP 2023514226 A JP2023514226 A JP 2023514226A JP 2023514226 A JP2023514226 A JP 2023514226A JP WO2022219721 A1 JPWO2022219721 A1 JP WO2022219721A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/1418—Card guides, e.g. grooves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1452—Mounting of connectors; Switching; Reinforcing of back panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/015335 WO2022219721A1 (ja) | 2021-04-13 | 2021-04-13 | フェイスプレートおよび電子装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022219721A1 true JPWO2022219721A1 (ja) | 2022-10-20 |
Family
ID=83639921
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023514226A Pending JPWO2022219721A1 (ja) | 2021-04-13 | 2021-04-13 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20240206101A1 (ja) |
JP (1) | JPWO2022219721A1 (ja) |
CN (1) | CN117158118A (ja) |
DE (1) | DE112021007067T5 (ja) |
WO (1) | WO2022219721A1 (ja) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02120889U (ja) * | 1989-03-15 | 1990-09-28 | ||
JP6705859B2 (ja) | 2018-04-10 | 2020-06-03 | ファナック株式会社 | 電子装置 |
-
2021
- 2021-04-13 US US18/286,647 patent/US20240206101A1/en active Pending
- 2021-04-13 JP JP2023514226A patent/JPWO2022219721A1/ja active Pending
- 2021-04-13 CN CN202180096788.9A patent/CN117158118A/zh active Pending
- 2021-04-13 DE DE112021007067.3T patent/DE112021007067T5/de active Pending
- 2021-04-13 WO PCT/JP2021/015335 patent/WO2022219721A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
DE112021007067T5 (de) | 2023-11-23 |
WO2022219721A1 (ja) | 2022-10-20 |
US20240206101A1 (en) | 2024-06-20 |
CN117158118A (zh) | 2023-12-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231108 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240618 |