DE112019005434A5 - Transferwerkzeug und verfahren zum transferieren von halbleiterchips - Google Patents

Transferwerkzeug und verfahren zum transferieren von halbleiterchips Download PDF

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Publication number
DE112019005434A5
DE112019005434A5 DE112019005434.1T DE112019005434T DE112019005434A5 DE 112019005434 A5 DE112019005434 A5 DE 112019005434A5 DE 112019005434 T DE112019005434 T DE 112019005434T DE 112019005434 A5 DE112019005434 A5 DE 112019005434A5
Authority
DE
Germany
Prior art keywords
semiconductor chips
transfer tool
transferring semiconductor
transferring
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112019005434.1T
Other languages
English (en)
Inventor
Andreas Plössl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112019005434A5 publication Critical patent/DE112019005434A5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841—Holding or clamping means for handling purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841—Holding or clamping means for handling purposes
    • B29C65/785—Holding or clamping means for handling purposes using magnetic forces to hold at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841—Holding or clamping means for handling purposes
    • B29C65/7852—Holding or clamping means for handling purposes using electrostatic forces to hold at least one of the parts to be joined
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7565—Means for transporting the components to be connected

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE112019005434.1T 2018-10-30 2019-10-24 Transferwerkzeug und verfahren zum transferieren von halbleiterchips Pending DE112019005434A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018127123.9 2018-10-30
DE102018127123.9A DE102018127123A1 (de) 2018-10-30 2018-10-30 Transferwerkzeug und Verfahren zum Transferieren von Halbleiterchips
PCT/EP2019/079071 WO2020089036A1 (de) 2018-10-30 2019-10-24 Transferwerkzeug und verfahren zum transferieren von halbleiterchips

Publications (1)

Publication Number Publication Date
DE112019005434A5 true DE112019005434A5 (de) 2021-07-15

Family

ID=68382444

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102018127123.9A Withdrawn DE102018127123A1 (de) 2018-10-30 2018-10-30 Transferwerkzeug und Verfahren zum Transferieren von Halbleiterchips
DE112019005434.1T Pending DE112019005434A5 (de) 2018-10-30 2019-10-24 Transferwerkzeug und verfahren zum transferieren von halbleiterchips

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102018127123.9A Withdrawn DE102018127123A1 (de) 2018-10-30 2018-10-30 Transferwerkzeug und Verfahren zum Transferieren von Halbleiterchips

Country Status (6)

Country Link
US (1) US12020973B2 (de)
JP (1) JP7254920B2 (de)
KR (1) KR102585657B1 (de)
CN (1) CN112970097B (de)
DE (2) DE102018127123A1 (de)
WO (1) WO2020089036A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220199450A1 (en) * 2020-12-23 2022-06-23 Intel Corporation Carrier for microelectronic assemblies having direct bonding
US20220199449A1 (en) * 2020-12-23 2022-06-23 Intel Corporation Carrier for microelectronic assemblies having direct bonding
CN113206034A (zh) * 2021-04-30 2021-08-03 成都辰显光电有限公司 转移头、转移装置和转移方法
KR102678261B1 (ko) * 2021-11-30 2024-06-26 한국생산기술연구원 다이 웨이퍼 사이의 다이렉트 본딩헤드, 이를 구비한 본딩장치, 시스템 및 그 방법
CN117012696B (zh) * 2023-10-07 2024-01-30 深圳明阳电路科技股份有限公司 一种利用电磁力转移的mini-LED芯板制作方法

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KR100533748B1 (ko) * 2003-05-14 2005-12-06 앰코 테크놀로지 코리아 주식회사 반도체 다이 접착용 픽업 툴
JP4405211B2 (ja) 2003-09-08 2010-01-27 パナソニック株式会社 半導体チップの剥離装置、剥離方法、及び半導体チップの供給装置
KR100603709B1 (ko) 2005-04-25 2006-07-20 앰코 테크놀로지 코리아 주식회사 반도체 패키지 제조용 칩 어태치 툴 구조
KR100666919B1 (ko) 2005-12-20 2007-01-10 삼성전자주식회사 반도체 패키지용 접착 시트, 이를 포함하는 반도체 소자,이를 포함하는 멀티 스택 패키지, 반도체 소자의 제조 방법및 멀티 스택 패키지의 제조 방법
JP2007180104A (ja) * 2005-12-27 2007-07-12 Tsubaki Seiko:Kk 搬送治具
JP2008141068A (ja) * 2006-12-04 2008-06-19 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
US8037918B2 (en) * 2006-12-04 2011-10-18 Stats Chippac, Inc. Pick-up heads and systems for die bonding and related applications
KR100876965B1 (ko) 2007-08-10 2009-01-07 앰코 테크놀로지 코리아 주식회사 반도체패키지 제조용 칩 픽업툴
JP4535295B2 (ja) 2008-03-03 2010-09-01 セイコーエプソン株式会社 半導体モジュール及びその製造方法
US8506867B2 (en) 2008-11-19 2013-08-13 Semprius, Inc. Printing semiconductor elements by shear-assisted elastomeric stamp transfer
JP5558073B2 (ja) * 2009-10-14 2014-07-23 キヤノンマシナリー株式会社 ボンディング装置
KR101397750B1 (ko) * 2012-07-25 2014-05-21 삼성전기주식회사 칩 이젝터 및 이를 이용한 칩 탈착 방법
KR101596461B1 (ko) * 2014-04-01 2016-02-23 주식회사 프로텍 칩 디테칭 장치 및 칩 디테칭 방법
TWI581355B (zh) 2015-11-06 2017-05-01 友達光電股份有限公司 轉置微元件的方法
CN107437523B (zh) * 2016-05-26 2020-01-31 群创光电股份有限公司 拾取与放置装置及其作动方法
KR20170138794A (ko) * 2016-06-08 2017-12-18 (주)아이펜 스탬프를 구비한 웨이퍼 칩 전사장치
DE102016115186A1 (de) * 2016-08-16 2018-02-22 Osram Opto Semiconductors Gmbh Verfahren zum Montieren von Halbleiterchips und Vorrichtung zum Übertragen von Halbleiterchips
CN109789630B (zh) * 2016-10-10 2021-05-28 惠普发展公司，有限责任合伙企业 微结构转移系统
DE102016221281A1 (de) 2016-10-28 2018-05-03 Osram Opto Semiconductors Gmbh Verfahren zum transferieren von halbleiterchips und transferwerkzeug
KR20180117004A (ko) 2017-04-18 2018-10-26 광주과학기술원 액체를 이용한 마이크로 소자의 이송방법
KR102572669B1 (ko) 2017-08-14 2023-08-31 삼성전자주식회사 전기 소자 이송 장치
CN108389825A (zh) 2018-02-06 2018-08-10 中华映管股份有限公司 转置装置
US11328942B1 (en) * 2019-09-10 2022-05-10 Facebook Technologies, Llc Liquid crystalline elastomer for pick and place of semiconductor devices

Also Published As

Publication number Publication date
DE102018127123A1 (de) 2020-04-30
US12020973B2 (en) 2024-06-25
KR102585657B1 (ko) 2023-10-05
WO2020089036A1 (de) 2020-05-07
CN112970097B (zh) 2024-04-09
JP7254920B2 (ja) 2023-04-10
KR20210080540A (ko) 2021-06-30
JP2022506168A (ja) 2022-01-17
CN112970097A (zh) 2021-06-15
US20210384062A1 (en) 2021-12-09

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