JP2022506168A - 半導体チップを転写するための転写ツールおよび方法 - Google Patents
半導体チップを転写するための転写ツールおよび方法 Download PDFInfo
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
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- B29C65/7841—Holding or clamping means for handling purposes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7841—Holding or clamping means for handling purposes
- B29C65/785—Holding or clamping means for handling purposes using magnetic forces to hold at least one of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7841—Holding or clamping means for handling purposes
- B29C65/7852—Holding or clamping means for handling purposes using electrostatic forces to hold at least one of the parts to be joined
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
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- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
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Abstract
Description
2 半導体チップ
3 粘着スタンプ
4 接着面
5 ボリューム領域
6 開口部
7 変形領域
8 空洞
9 金属層
10 ソース支持体
11 ターゲット支持体
12 充填材料
13 欠陥のある半導体チップ
14 チップ受容面
15 デバイス
16 光導波路
17 第1の層
18 第2の層
19 第3の層
20 ベース
D 厚さ
Claims (18)
- 半導体チップ(2)を転写するための転写ツール(1)であって、該転写ツール(1)は、
-前記半導体チップ(2)を受容するための接着面(4)を有する粘着スタンプ(3)と、
-前記接着面(4)の面積を調整するためのデバイス(15)と、を備え、
-前記粘着スタンプ(3)は、変形可能に形成されており、
-前記接着面(4)は、前記粘着スタンプ(3)の外面の一部によって形成されており、
-前記接着面(4)の面積は、前記粘着スタンプ(3)の変形によって設定調整可能であり、
-前記接着面(4)は、中断することなく形成されている、転写ツール(1)。 - 前記粘着スタンプ(3)は、変形可能なボリューム領域(5)を含み、前記接着面(4)は、前記ボリューム領域(5)の外面の一部によって形成されている、請求項1記載の転写ツール(1)。
- 前記粘着スタンプ(3)は、弾性ポリマーを有するか、または弾性ポリマーから形成されている、請求項1または2記載の転写ツール(1)。
- 前記粘着スタンプ(3)は、開口部(6)を有し、前記接着面(4)の面積を調整するための前記デバイス(15)は、前記開口部(6)のボリュームを調整するように構成されている、請求項1から3までのいずれか1項記載の転写ツール(1)。
- 前記接着面(4)の面積を調整するための前記デバイス(15)は、前記開口部(6)内への充填材料(12)の量を調整するように構成されている、請求項1から4までのいずれか1項記載の転写ツール(1)。
- 前記粘着スタンプ(3)は、前記ボリューム領域(5)に隣接する横方向に変形領域(7)を有する、請求項1から5までのいずれか1項記載の転写ツール(1)。
- 前記変形領域(7)における前記粘着スタンプ(3)の厚さ(D)は、前記ボリューム領域(5)における前記粘着スタンプ(3)の厚さに比べて薄くなっている、請求項6記載の転写ツール(1)。
- 前記変形領域(7)における前記粘着スタンプ(3)は、空洞(8)を有する、請求項6または7記載の転写ツール(1)。
- 前記接着面(4)の面積を調整するための前記デバイス(15)は、前記変形領域(7)において、前記粘着スタンプ(3)の主延在面に対して横断方向または垂直方向に配向された応力が前記粘着スタンプ(3)に加えられるように構成されている、請求項6から8までのいずれか1項記載の転写ツール(1)。
- 前記応力は、磁力または磁力または静電力である、請求項9記載の転写ツール(1)。
- 前記粘着スタンプ(3)の外面は、金属層(9)を有する、請求項1から10までのいずれか1項記載の転写ツール(1)。
- 前記金属層(9)は、前記変形領域(7)に配置されている、請求項11記載の転写ツール(1)。
- 前記接着面(4)の面積を調整するための前記デバイス(15)は、前記ボリューム領域(5)の材料の密度を変更するように構成されている、請求項1から12までのいずれか1項記載の転写ツール(1)。
- 前記ボリューム領域(5)は、光異性化可能な材料を有するか、または光異性化可能な材料からなる、請求項1から13までのいずれか1項記載の転写ツール(1)。
- 前記ボリューム領域(5)は、光異性化可能材料で形成された第2の層を有し、前記第2の層の、前記接着面(4)に面する側には光異性化可能材料を含まない第1の層が被着されている、請求項14記載の転写ツール(1)。
- 前記接着面(4)の面積を調整するための前記デバイス(15)は、電磁ビームをボリューム領域に案内するように構成されている、請求項15記載の転写ツール(1)。
- 前記ボリューム領域(5)の変形により、前記接着面(4)の面積が調整可能である、請求項1から16までのいずれか1項記載の転写ツール(1)。
- 半導体チップ(2)を転写するための方法であって、
-請求項1から17までのいずれか1項記載の転写ツール(1)を提供するステップと、
-複数の半導体チップ(2)を、規則的な配列でソース支持体(10)上に提供するステップと、
-前記転写ツール(1)を、前記ソース支持体(10)に接近させるステップであって、ボリューム領域(5)の接着面(4)が半導体チップ(2)と接触を開始するステップと、
-前記半導体チップ(2)を、ファンデルワールス力を介して前記ボリューム領域(5)の前記接着面(4)に接着するステップと、
-前記転写ツール(1)を、前記ソース支持体(10)から持ち上げるステップと、
-前記転写ツール(1)を、ターゲット支持体(11)に接近させるステップであって、前記転写ツール(1)上に配置された前記半導体チップ(2)が前記ターゲット支持体(11)と接触を開始するステップと、
-前記半導体チップ(2)を、前記ボリューム領域(5)の前記接着面(4)の面積の低減によって剥離するステップと、を含む、方法。
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DE102018127123.9A DE102018127123A1 (de) | 2018-10-30 | 2018-10-30 | Transferwerkzeug und Verfahren zum Transferieren von Halbleiterchips |
PCT/EP2019/079071 WO2020089036A1 (de) | 2018-10-30 | 2019-10-24 | Transferwerkzeug und verfahren zum transferieren von halbleiterchips |
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US20220199450A1 (en) * | 2020-12-23 | 2022-06-23 | Intel Corporation | Carrier for microelectronic assemblies having direct bonding |
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KR102678261B1 (ko) * | 2021-11-30 | 2024-06-26 | 한국생산기술연구원 | 다이 웨이퍼 사이의 다이렉트 본딩헤드, 이를 구비한 본딩장치, 시스템 및 그 방법 |
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