DE112018006724T5 - Polierzusammensetzung - Google Patents

Polierzusammensetzung Download PDF

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Publication number
DE112018006724T5
DE112018006724T5 DE112018006724.6T DE112018006724T DE112018006724T5 DE 112018006724 T5 DE112018006724 T5 DE 112018006724T5 DE 112018006724 T DE112018006724 T DE 112018006724T DE 112018006724 T5 DE112018006724 T5 DE 112018006724T5
Authority
DE
Germany
Prior art keywords
vibration damping
damping agent
polishing
polishing composition
average molecular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112018006724.6T
Other languages
German (de)
English (en)
Inventor
Tomoki Yamasaki
Hiroshi Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitta DuPont Inc
Original Assignee
Nitta DuPont Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=67067368&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE112018006724(T5) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nitta DuPont Inc filed Critical Nitta DuPont Inc
Publication of DE112018006724T5 publication Critical patent/DE112018006724T5/de
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DE112018006724.6T 2017-12-27 2018-12-20 Polierzusammensetzung Pending DE112018006724T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017252313A JP6891107B2 (ja) 2017-12-27 2017-12-27 研磨用組成物
JP2017-252313 2017-12-27
PCT/JP2018/047029 WO2019131450A1 (ja) 2017-12-27 2018-12-20 研磨用組成物

Publications (1)

Publication Number Publication Date
DE112018006724T5 true DE112018006724T5 (de) 2020-09-10

Family

ID=67067368

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112018006724.6T Pending DE112018006724T5 (de) 2017-12-27 2018-12-20 Polierzusammensetzung

Country Status (7)

Country Link
JP (1) JP6891107B2 (zh)
KR (1) KR20200093607A (zh)
CN (1) CN111512419B (zh)
DE (1) DE112018006724T5 (zh)
SG (1) SG11202004613WA (zh)
TW (1) TWI783105B (zh)
WO (1) WO2019131450A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7433042B2 (ja) * 2019-12-24 2024-02-19 ニッタ・デュポン株式会社 研磨用組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4668528B2 (ja) * 2003-09-05 2011-04-13 株式会社フジミインコーポレーテッド 研磨用組成物
JP4606733B2 (ja) * 2003-12-22 2011-01-05 東洋ゴム工業株式会社 研磨パッドおよび半導体ウエハの研磨方法
JP2007214205A (ja) * 2006-02-07 2007-08-23 Fujimi Inc 研磨用組成物
JP5492603B2 (ja) * 2010-03-02 2014-05-14 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP6360694B2 (ja) * 2014-03-14 2018-07-18 ニッタ・ハース株式会社 研磨用組成物
JP6817186B6 (ja) * 2014-07-15 2021-02-10 ビーエイエスエフ・ソシエタス・エウロパエアＢａｓｆ Ｓｅ 化学機械研磨（ｃｍｐ）組成物
JP2016124943A (ja) * 2014-12-26 2016-07-11 ニッタ・ハース株式会社 研磨用組成物
JP6669331B2 (ja) * 2015-05-19 2020-03-18 昭和電工株式会社 研磨組成物、及びその研磨組成物を用いた研磨方法
EP3425016B1 (en) * 2016-02-29 2021-01-27 Fujimi Incorporated Polishing composition and polishing method using same

Also Published As

Publication number Publication date
WO2019131450A1 (ja) 2019-07-04
CN111512419B (zh) 2024-05-28
TW201930541A (zh) 2019-08-01
JP6891107B2 (ja) 2021-06-18
TWI783105B (zh) 2022-11-11
JP2019117907A (ja) 2019-07-18
CN111512419A (zh) 2020-08-07
SG11202004613WA (en) 2020-06-29
KR20200093607A (ko) 2020-08-05

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