JP6891107B2 - 研磨用組成物 - Google Patents

研磨用組成物 Download PDF

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Publication number
JP6891107B2
JP6891107B2 JP2017252313A JP2017252313A JP6891107B2 JP 6891107 B2 JP6891107 B2 JP 6891107B2 JP 2017252313 A JP2017252313 A JP 2017252313A JP 2017252313 A JP2017252313 A JP 2017252313A JP 6891107 B2 JP6891107 B2 JP 6891107B2
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JP
Japan
Prior art keywords
vibration
polishing
polishing composition
inhibitor
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017252313A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019117907A (ja
Inventor
智基 山▲崎▼
智基 山▲崎▼
弘 牧野
弘 牧野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitta DuPont Inc
Original Assignee
Nitta DuPont Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=67067368&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP6891107(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nitta DuPont Inc filed Critical Nitta DuPont Inc
Priority to JP2017252313A priority Critical patent/JP6891107B2/ja
Priority to PCT/JP2018/047029 priority patent/WO2019131450A1/ja
Priority to CN201880084112.6A priority patent/CN111512419B/zh
Priority to KR1020207018424A priority patent/KR20200093607A/ko
Priority to DE112018006724.6T priority patent/DE112018006724T5/de
Priority to SG11202004613WA priority patent/SG11202004613WA/en
Priority to TW107147153A priority patent/TWI783105B/zh
Publication of JP2019117907A publication Critical patent/JP2019117907A/ja
Publication of JP6891107B2 publication Critical patent/JP6891107B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP2017252313A 2017-12-27 2017-12-27 研磨用組成物 Active JP6891107B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2017252313A JP6891107B2 (ja) 2017-12-27 2017-12-27 研磨用組成物
DE112018006724.6T DE112018006724T5 (de) 2017-12-27 2018-12-20 Polierzusammensetzung
CN201880084112.6A CN111512419B (zh) 2017-12-27 2018-12-20 研磨用组合物
KR1020207018424A KR20200093607A (ko) 2017-12-27 2018-12-20 연마용 조성물
PCT/JP2018/047029 WO2019131450A1 (ja) 2017-12-27 2018-12-20 研磨用組成物
SG11202004613WA SG11202004613WA (en) 2017-12-27 2018-12-20 Polishing composition
TW107147153A TWI783105B (zh) 2017-12-27 2018-12-26 研磨用組合物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017252313A JP6891107B2 (ja) 2017-12-27 2017-12-27 研磨用組成物

Publications (2)

Publication Number Publication Date
JP2019117907A JP2019117907A (ja) 2019-07-18
JP6891107B2 true JP6891107B2 (ja) 2021-06-18

Family

ID=67067368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017252313A Active JP6891107B2 (ja) 2017-12-27 2017-12-27 研磨用組成物

Country Status (7)

Country Link
JP (1) JP6891107B2 (zh)
KR (1) KR20200093607A (zh)
CN (1) CN111512419B (zh)
DE (1) DE112018006724T5 (zh)
SG (1) SG11202004613WA (zh)
TW (1) TWI783105B (zh)
WO (1) WO2019131450A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7433042B2 (ja) * 2019-12-24 2024-02-19 ニッタ・デュポン株式会社 研磨用組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4668528B2 (ja) * 2003-09-05 2011-04-13 株式会社フジミインコーポレーテッド 研磨用組成物
JP4606733B2 (ja) * 2003-12-22 2011-01-05 東洋ゴム工業株式会社 研磨パッドおよび半導体ウエハの研磨方法
JP2007214205A (ja) * 2006-02-07 2007-08-23 Fujimi Inc 研磨用組成物
JP5492603B2 (ja) * 2010-03-02 2014-05-14 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP6360694B2 (ja) * 2014-03-14 2018-07-18 ニッタ・ハース株式会社 研磨用組成物
EP3169737B1 (en) * 2014-07-15 2018-10-10 Basf Se A chemical mechanical polishing (cmp) composition
JP2016124943A (ja) * 2014-12-26 2016-07-11 ニッタ・ハース株式会社 研磨用組成物
JP6669331B2 (ja) * 2015-05-19 2020-03-18 昭和電工株式会社 研磨組成物、及びその研磨組成物を用いた研磨方法
US11332640B2 (en) * 2016-02-29 2022-05-17 Fujimi Incorporated Polishing composition and polishing method using same

Also Published As

Publication number Publication date
KR20200093607A (ko) 2020-08-05
CN111512419B (zh) 2024-05-28
WO2019131450A1 (ja) 2019-07-04
TW201930541A (zh) 2019-08-01
DE112018006724T5 (de) 2020-09-10
CN111512419A (zh) 2020-08-07
TWI783105B (zh) 2022-11-11
JP2019117907A (ja) 2019-07-18
SG11202004613WA (en) 2020-06-29

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