DE112011104858T8 - Elektromagnetische Kopplungsstruktur, Mehrlagenübertragungsleiterplatte, Verfahren zum Herstellen einer elektromagnetischen Kopplungsstruktur, und Verfahren zum Herstellen einer Mehrlagenübertragungsleiterplatte - Google Patents

Elektromagnetische Kopplungsstruktur, Mehrlagenübertragungsleiterplatte, Verfahren zum Herstellen einer elektromagnetischen Kopplungsstruktur, und Verfahren zum Herstellen einer Mehrlagenübertragungsleiterplatte Download PDF

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Publication number
DE112011104858T8
DE112011104858T8 DE112011104858T DE112011104858T DE112011104858T8 DE 112011104858 T8 DE112011104858 T8 DE 112011104858T8 DE 112011104858 T DE112011104858 T DE 112011104858T DE 112011104858 T DE112011104858 T DE 112011104858T DE 112011104858 T8 DE112011104858 T8 DE 112011104858T8
Authority
DE
Germany
Prior art keywords
manufacturing
coupling structure
electromagnetic coupling
transmission board
multilayer transmission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE112011104858T
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English (en)
Other versions
DE112011104858T5 (de
Inventor
Yuusuke Kondou
Etsuo Mizushima
Yasushi Watanabe
Yasuyuki Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of DE112011104858T5 publication Critical patent/DE112011104858T5/de
Application granted granted Critical
Publication of DE112011104858T8 publication Critical patent/DE112011104858T8/de
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
    • H01P5/185—Edge coupled lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguide Connection Structure (AREA)
  • Structure Of Printed Boards (AREA)
DE112011104858T 2011-02-08 2011-11-04 Elektromagnetische Kopplungsstruktur, Mehrlagenübertragungsleiterplatte, Verfahren zum Herstellen einer elektromagnetischen Kopplungsstruktur, und Verfahren zum Herstellen einer Mehrlagenübertragungsleiterplatte Expired - Fee Related DE112011104858T8 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2011-025165 2011-02-08
JP2011025165 2011-02-08
JP2011-211521 2011-09-27
JP2011211521A JP5831096B2 (ja) 2011-02-08 2011-09-27 電磁結合構造、多層伝送線路板、電磁結合構造の製造方法、及び多層伝送線路板の製造方法
PCT/JP2011/075488 WO2012108084A1 (ja) 2011-02-08 2011-11-04 電磁結合構造、多層伝送線路板、電磁結合構造の製造方法、及び多層伝送線路板の製造方法

Publications (2)

Publication Number Publication Date
DE112011104858T5 DE112011104858T5 (de) 2013-11-07
DE112011104858T8 true DE112011104858T8 (de) 2013-11-28

Family

ID=46638313

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112011104858T Expired - Fee Related DE112011104858T8 (de) 2011-02-08 2011-11-04 Elektromagnetische Kopplungsstruktur, Mehrlagenübertragungsleiterplatte, Verfahren zum Herstellen einer elektromagnetischen Kopplungsstruktur, und Verfahren zum Herstellen einer Mehrlagenübertragungsleiterplatte

Country Status (6)

Country Link
US (1) US9397381B2 (de)
JP (1) JP5831096B2 (de)
KR (1) KR101505350B1 (de)
CN (1) CN103380537B (de)
DE (1) DE112011104858T8 (de)
WO (1) WO2012108084A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9490768B2 (en) 2012-06-25 2016-11-08 Knowles Cazenovia Inc. High frequency band pass filter with coupled surface mount transition
JP6136348B2 (ja) * 2013-02-21 2017-05-31 日立化成株式会社 多層伝送線路板、該多層伝送線路板を有する電磁結合モジュール、アンテナモジュール
JP6515558B2 (ja) * 2015-02-04 2019-05-22 富士通株式会社 積層型導波路、無線通信モジュール、及び、無線通信システム
JP2018536276A (ja) * 2015-08-21 2018-12-06 コーニング インコーポレイテッド 可撓性基体ウェブに特徴物を連続して作製する方法、および、それに関する生成物
GB2552836B (en) * 2016-08-12 2019-12-25 Cambium Networks Ltd Radio frequency connection arrangement
US10347961B2 (en) * 2016-10-26 2019-07-09 Raytheon Company Radio frequency interconnect systems and methods
US11043727B2 (en) * 2019-01-15 2021-06-22 Raytheon Company Substrate integrated waveguide monopulse and antenna system
CN111540995B (zh) * 2019-12-20 2022-04-08 瑞声科技(新加坡)有限公司 传输线、电子设备及传输线的制造方法
US11817613B2 (en) * 2020-02-27 2023-11-14 Boe Technology Group Co., Ltd. Coupling component, microwave device and electronic device
CN111368436B (zh) * 2020-03-06 2023-07-21 重庆邮电大学 导电板上弯曲线电磁耦合效应的时域建模分析方法
RU208172U1 (ru) * 2021-07-05 2021-12-07 Федеральное государственное автономное образовательное учреждение высшего образования «Южно-Уральский государственный университет (национальный исследовательский университет)» ФГАОУ ВО «ЮУрГУ (НИУ)» Дуплексер на основе объёмных полосково-щелевых переходов

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4130822A (en) * 1976-06-30 1978-12-19 Motorola, Inc. Slot antenna
US5093639A (en) * 1990-09-20 1992-03-03 The United States Of America As Represented By The Secretary Of The Air Force Electromagnetic stripline coupler apparatus
JP2716925B2 (ja) * 1993-04-07 1998-02-18 株式会社エイ・ティ・アール光電波通信研究所 スロット結合型マイクロストリップアンテナ及び平面回路装置
US5471181A (en) * 1994-03-08 1995-11-28 Hughes Missile Systems Company Interconnection between layers of striplines or microstrip through cavity backed slot
JP3323087B2 (ja) 1996-11-29 2002-09-09 京セラ株式会社 高周波伝送線路の結合構造
JP3965762B2 (ja) * 1998-03-13 2007-08-29 日立化成工業株式会社 トリプレート線路層間接続器
CN1316858C (zh) * 2001-04-27 2007-05-16 日本电气株式会社 高频电路基板及其制造方法
JP4079660B2 (ja) * 2001-04-27 2008-04-23 日本電気株式会社 高周波回路基板
CN1459811A (zh) * 2002-05-22 2003-12-03 松下电器产业株式会社 陶瓷层压器件、通信设备和制造陶瓷层压器件的方法
US7239013B2 (en) * 2002-07-18 2007-07-03 Hitachi Chemical Co., Ltd. Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device
JP2004187281A (ja) * 2002-11-18 2004-07-02 Matsushita Electric Ind Co Ltd 伝送線路接続装置
KR100683005B1 (ko) * 2004-06-10 2007-02-15 한국전자통신연구원 다층 원형 도체 배열을 이용한 마이크로스트립 스택 패치안테나 및 그를 이용한 평면 배열 안테나
JP4468779B2 (ja) 2004-09-30 2010-05-26 日本無線株式会社 マイクロストリップ線路結合器およびその設計方法
WO2006054601A1 (ja) * 2004-11-19 2006-05-26 Matsushita Electric Industrial Co., Ltd. コンデンサ内蔵多層基板とその製造方法、及び冷陰極管点灯装置
KR100706024B1 (ko) 2005-10-19 2007-04-12 한국전자통신연구원 밀리미터파 대역 광대역 마이크로스트립-도파관 변환 장치
JP4946150B2 (ja) * 2006-02-08 2012-06-06 日立化成工業株式会社 電磁界結合構造及び多層配線板
EP1923950A1 (de) 2006-11-17 2008-05-21 Siemens S.p.A. SMT-fähiges Mikrowellenbauteil mit Wellenleiterschnittstelle
JP5990828B2 (ja) * 2010-03-09 2016-09-14 日立化成株式会社 電磁結合構造、多層伝送線路板、電磁結合構造の製造方法、及び多層伝送線路板の製造方法

Also Published As

Publication number Publication date
JP2012182782A (ja) 2012-09-20
KR20130119492A (ko) 2013-10-31
WO2012108084A1 (ja) 2012-08-16
DE112011104858T5 (de) 2013-11-07
CN103380537B (zh) 2016-10-05
JP5831096B2 (ja) 2015-12-09
US9397381B2 (en) 2016-07-19
US20130328646A1 (en) 2013-12-12
CN103380537A (zh) 2013-10-30
KR101505350B1 (ko) 2015-03-23

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