DE112009001086T5 - Mikrosystem-Relais - Google Patents

Mikrosystem-Relais Download PDF

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Publication number
DE112009001086T5
DE112009001086T5 DE112009001086T DE112009001086T DE112009001086T5 DE 112009001086 T5 DE112009001086 T5 DE 112009001086T5 DE 112009001086 T DE112009001086 T DE 112009001086T DE 112009001086 T DE112009001086 T DE 112009001086T DE 112009001086 T5 DE112009001086 T5 DE 112009001086T5
Authority
DE
Germany
Prior art keywords
coil
core
conductive trace
relay
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE112009001086T
Other languages
German (de)
English (en)
Inventor
Trevor Niblock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of DE112009001086T5 publication Critical patent/DE112009001086T5/de
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/005—Details of electromagnetic relays using micromechanics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H3/00—Mechanisms for operating contacts
    • H01H3/22—Power arrangements internal to the switch for operating the driving mechanism
    • H01H3/28—Power arrangements internal to the switch for operating the driving mechanism using electromagnet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H49/00—Apparatus or processes specially adapted to the manufacture of relays or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00—Electromagnetic relays
    • H01H51/02—Non-polarised relays
    • H01H51/04—Non-polarised relays with single armature; with single set of ganged armatures
    • H01H51/06—Armature is movable between two limit positions of rest and is moved in one direction due to energisation of an electromagnet and after the electromagnet is de-energised is returned by energy stored during the movement in the first direction, e.g. by using a spring, by using a permanent magnet, by gravity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49105—Switch making

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Relay Circuits (AREA)
DE112009001086T 2008-07-11 2009-07-06 Mikrosystem-Relais Ceased DE112009001086T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/218,368 2008-07-11
US12/218,368 US7902946B2 (en) 2008-07-11 2008-07-11 MEMS relay with a flux path that is decoupled from an electrical path through the switch and a suspension structure that is independent of the core structure and a method of forming the same
PCT/US2009/049675 WO2010005888A2 (en) 2008-07-11 2009-07-06 Mems relay

Publications (1)

Publication Number Publication Date
DE112009001086T5 true DE112009001086T5 (de) 2012-01-12

Family

ID=41504642

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112009001086T Ceased DE112009001086T5 (de) 2008-07-11 2009-07-06 Mikrosystem-Relais

Country Status (6)

Country Link
US (1) US7902946B2 (https=)
JP (1) JP5456777B2 (https=)
KR (1) KR101724717B1 (https=)
DE (1) DE112009001086T5 (https=)
TW (1) TWI492259B (https=)
WO (1) WO2010005888A2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7999642B2 (en) * 2005-03-04 2011-08-16 Ht Microanalytical, Inc. Miniaturized switch device
US9284183B2 (en) 2005-03-04 2016-03-15 Ht Microanalytical, Inc. Method for forming normally closed micromechanical device comprising a laterally movable element
US8665041B2 (en) * 2008-03-20 2014-03-04 Ht Microanalytical, Inc. Integrated microminiature relay
US8378766B2 (en) 2011-02-03 2013-02-19 National Semiconductor Corporation MEMS relay and method of forming the MEMS relay
US20120199768A1 (en) * 2011-02-03 2012-08-09 Love Lonnie J Mesofluidic digital valve
JP2013068757A (ja) * 2011-09-22 2013-04-18 Japan Display East Co Ltd 表示装置
CN107748826B (zh) * 2017-11-08 2018-09-25 哈尔滨工业大学 一种继电器耐力学性能贮存退化分析方法
JP6950613B2 (ja) 2018-04-11 2021-10-13 Tdk株式会社 磁気作動型ｍｅｍｓスイッチ

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578976A (en) * 1995-06-22 1996-11-26 Rockwell International Corporation Micro electromechanical RF switch
US6094116A (en) * 1996-08-01 2000-07-25 California Institute Of Technology Micro-electromechanical relays
US5880921A (en) * 1997-04-28 1999-03-09 Rockwell Science Center, Llc Monolithically integrated switched capacitor bank using micro electro mechanical system (MEMS) technology
CA2211830C (en) * 1997-08-22 2002-08-13 Cindy Xing Qiu Miniature electromagnetic microwave switches and switch arrays
JP3062881B2 (ja) * 1998-05-12 2000-07-12 株式会社日立製作所 光スイッチ
US6310526B1 (en) * 1999-09-21 2001-10-30 Lap-Sum Yip Double-throw miniature electromagnetic microwave (MEM) switches
US6469602B2 (en) * 1999-09-23 2002-10-22 Arizona State University Electronically switching latching micro-magnetic relay and method of operating same
DE10000483C1 (de) * 2000-01-07 2001-08-23 Inst Mikrotechnik Mainz Gmbh Faseroptisches Schaltelement
US6360036B1 (en) * 2000-01-14 2002-03-19 Corning Incorporated MEMS optical switch and method of manufacture
US6803843B2 (en) * 2001-02-22 2004-10-12 Canon Kabushiki Kaisha Movable-body apparatus, optical deflector, and method of fabricating the same
US6573822B2 (en) * 2001-06-18 2003-06-03 Intel Corporation Tunable inductor using microelectromechanical switches
FR2826645B1 (fr) * 2001-07-02 2004-06-04 Memscap Composant microelectromecanique
JP3750574B2 (ja) * 2001-08-16 2006-03-01 株式会社デンソー 薄膜電磁石およびこれを用いたスイッチング素子
JP4094407B2 (ja) * 2001-11-15 2008-06-04 セイコーインスツル株式会社 光スイッチ
US20030107460A1 (en) * 2001-12-10 2003-06-12 Guanghua Huang Low voltage MEM switch
US20030137374A1 (en) * 2002-01-18 2003-07-24 Meichun Ruan Micro-Magnetic Latching switches with a three-dimensional solenoid coil
US6832015B2 (en) * 2002-06-28 2004-12-14 Hewlett-Packard Development Company, L.P. Switching apparatus
US7095919B2 (en) * 2002-07-12 2006-08-22 Omron Corporation Optical switch
US7202763B2 (en) * 2002-09-25 2007-04-10 Nxp B.V. Micro-electromechanical switching device
FR2848331B1 (fr) * 2002-12-10 2005-03-11 Commissariat Energie Atomique Commutateur micro-mecanique et procede de realisation
US7205621B2 (en) * 2003-02-17 2007-04-17 Nippon Telegraph And Telephone Corporation Surface shape recognition sensor
JP4305293B2 (ja) * 2003-10-14 2009-07-29 横河電機株式会社 リレー
US7101724B2 (en) * 2004-02-20 2006-09-05 Wireless Mems, Inc. Method of fabricating semiconductor devices employing at least one modulation doped quantum well structure and one or more etch stop layers for accurate contact formation
JP4222315B2 (ja) 2005-01-26 2009-02-12 パナソニック電工株式会社 マイクロリレー
US7464459B1 (en) * 2007-05-25 2008-12-16 National Semiconductor Corporation Method of forming a MEMS actuator and relay with vertical actuation
US7444042B1 (en) * 2007-05-25 2008-10-28 National Semiconductor Corporation Optical switch

Also Published As

Publication number Publication date
KR101724717B1 (ko) 2017-04-07
US7902946B2 (en) 2011-03-08
JP2011527821A (ja) 2011-11-04
WO2010005888A2 (en) 2010-01-14
KR20110027649A (ko) 2011-03-16
TWI492259B (zh) 2015-07-11
WO2010005888A3 (en) 2010-04-15
TW201007802A (en) 2010-02-16
US20100007448A1 (en) 2010-01-14
JP5456777B2 (ja) 2014-04-02

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R012 Request for examination validly filed
R016 Response to examination communication
R016 Response to examination communication
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final