TWI492259B - 具有一透過開關自電路徑所去耦之通量路徑和一不依賴核心結構之懸浮結構的微機電系統繼電器以及形成其之方法 - Google Patents

具有一透過開關自電路徑所去耦之通量路徑和一不依賴核心結構之懸浮結構的微機電系統繼電器以及形成其之方法 Download PDF

Info

Publication number
TWI492259B
TWI492259B TW098122170A TW98122170A TWI492259B TW I492259 B TWI492259 B TW I492259B TW 098122170 A TW098122170 A TW 098122170A TW 98122170 A TW98122170 A TW 98122170A TW I492259 B TWI492259 B TW I492259B
Authority
TW
Taiwan
Prior art keywords
coil
suspension member
core
conductive trace
switch
Prior art date
Application number
TW098122170A
Other languages
English (en)
Chinese (zh)
Other versions
TW201007802A (en
Inventor
Trevor Niblock
Original Assignee
Nat Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Semiconductor Corp filed Critical Nat Semiconductor Corp
Publication of TW201007802A publication Critical patent/TW201007802A/zh
Application granted granted Critical
Publication of TWI492259B publication Critical patent/TWI492259B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/005—Details of electromagnetic relays using micromechanics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H3/00—Mechanisms for operating contacts
    • H01H3/22—Power arrangements internal to the switch for operating the driving mechanism
    • H01H3/28—Power arrangements internal to the switch for operating the driving mechanism using electromagnet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H49/00—Apparatus or processes specially adapted to the manufacture of relays or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00—Electromagnetic relays
    • H01H51/02—Non-polarised relays
    • H01H51/04—Non-polarised relays with single armature; with single set of ganged armatures
    • H01H51/06—Armature is movable between two limit positions of rest and is moved in one direction due to energisation of an electromagnet and after the electromagnet is de-energised is returned by energy stored during the movement in the first direction, e.g. by using a spring, by using a permanent magnet, by gravity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49105—Switch making

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Relay Circuits (AREA)
TW098122170A 2008-07-11 2009-07-01 具有一透過開關自電路徑所去耦之通量路徑和一不依賴核心結構之懸浮結構的微機電系統繼電器以及形成其之方法 TWI492259B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/218,368 US7902946B2 (en) 2008-07-11 2008-07-11 MEMS relay with a flux path that is decoupled from an electrical path through the switch and a suspension structure that is independent of the core structure and a method of forming the same

Publications (2)

Publication Number Publication Date
TW201007802A TW201007802A (en) 2010-02-16
TWI492259B true TWI492259B (zh) 2015-07-11

Family

ID=41504642

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098122170A TWI492259B (zh) 2008-07-11 2009-07-01 具有一透過開關自電路徑所去耦之通量路徑和一不依賴核心結構之懸浮結構的微機電系統繼電器以及形成其之方法

Country Status (6)

Country Link
US (1) US7902946B2 (https=)
JP (1) JP5456777B2 (https=)
KR (1) KR101724717B1 (https=)
DE (1) DE112009001086T5 (https=)
TW (1) TWI492259B (https=)
WO (1) WO2010005888A2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7999642B2 (en) * 2005-03-04 2011-08-16 Ht Microanalytical, Inc. Miniaturized switch device
US9284183B2 (en) 2005-03-04 2016-03-15 Ht Microanalytical, Inc. Method for forming normally closed micromechanical device comprising a laterally movable element
US8665041B2 (en) * 2008-03-20 2014-03-04 Ht Microanalytical, Inc. Integrated microminiature relay
US8378766B2 (en) 2011-02-03 2013-02-19 National Semiconductor Corporation MEMS relay and method of forming the MEMS relay
US20120199768A1 (en) * 2011-02-03 2012-08-09 Love Lonnie J Mesofluidic digital valve
JP2013068757A (ja) * 2011-09-22 2013-04-18 Japan Display East Co Ltd 表示装置
CN107748826B (zh) * 2017-11-08 2018-09-25 哈尔滨工业大学 一种继电器耐力学性能贮存退化分析方法
JP6950613B2 (ja) 2018-04-11 2021-10-13 Tdk株式会社 磁気作動型ｍｅｍｓスイッチ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6094116A (en) * 1996-08-01 2000-07-25 California Institute Of Technology Micro-electromechanical relays
TW200522347A (en) * 2003-10-14 2005-07-01 Yokogawa Electric Corp Relay
TWI294138B (en) * 2004-02-20 2008-03-01 Chou Chia-Shing A fabrication method for making a planar cantilever, low surface leakage, reproducible and reliable metal dimple contact micro-relay mems switch, and a method for making microelectromechanical device having a common ground plane layer and a set of conta

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578976A (en) * 1995-06-22 1996-11-26 Rockwell International Corporation Micro electromechanical RF switch
US5880921A (en) * 1997-04-28 1999-03-09 Rockwell Science Center, Llc Monolithically integrated switched capacitor bank using micro electro mechanical system (MEMS) technology
CA2211830C (en) * 1997-08-22 2002-08-13 Cindy Xing Qiu Miniature electromagnetic microwave switches and switch arrays
JP3062881B2 (ja) * 1998-05-12 2000-07-12 株式会社日立製作所 光スイッチ
US6310526B1 (en) * 1999-09-21 2001-10-30 Lap-Sum Yip Double-throw miniature electromagnetic microwave (MEM) switches
US6469602B2 (en) * 1999-09-23 2002-10-22 Arizona State University Electronically switching latching micro-magnetic relay and method of operating same
DE10000483C1 (de) * 2000-01-07 2001-08-23 Inst Mikrotechnik Mainz Gmbh Faseroptisches Schaltelement
US6360036B1 (en) * 2000-01-14 2002-03-19 Corning Incorporated MEMS optical switch and method of manufacture
US6803843B2 (en) * 2001-02-22 2004-10-12 Canon Kabushiki Kaisha Movable-body apparatus, optical deflector, and method of fabricating the same
US6573822B2 (en) * 2001-06-18 2003-06-03 Intel Corporation Tunable inductor using microelectromechanical switches
FR2826645B1 (fr) * 2001-07-02 2004-06-04 Memscap Composant microelectromecanique
JP3750574B2 (ja) * 2001-08-16 2006-03-01 株式会社デンソー 薄膜電磁石およびこれを用いたスイッチング素子
JP4094407B2 (ja) * 2001-11-15 2008-06-04 セイコーインスツル株式会社 光スイッチ
US20030107460A1 (en) * 2001-12-10 2003-06-12 Guanghua Huang Low voltage MEM switch
US20030137374A1 (en) * 2002-01-18 2003-07-24 Meichun Ruan Micro-Magnetic Latching switches with a three-dimensional solenoid coil
US6832015B2 (en) * 2002-06-28 2004-12-14 Hewlett-Packard Development Company, L.P. Switching apparatus
US7095919B2 (en) * 2002-07-12 2006-08-22 Omron Corporation Optical switch
US7202763B2 (en) * 2002-09-25 2007-04-10 Nxp B.V. Micro-electromechanical switching device
FR2848331B1 (fr) * 2002-12-10 2005-03-11 Commissariat Energie Atomique Commutateur micro-mecanique et procede de realisation
US7205621B2 (en) * 2003-02-17 2007-04-17 Nippon Telegraph And Telephone Corporation Surface shape recognition sensor
JP4222315B2 (ja) 2005-01-26 2009-02-12 パナソニック電工株式会社 マイクロリレー
US7464459B1 (en) * 2007-05-25 2008-12-16 National Semiconductor Corporation Method of forming a MEMS actuator and relay with vertical actuation
US7444042B1 (en) * 2007-05-25 2008-10-28 National Semiconductor Corporation Optical switch

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6094116A (en) * 1996-08-01 2000-07-25 California Institute Of Technology Micro-electromechanical relays
TW200522347A (en) * 2003-10-14 2005-07-01 Yokogawa Electric Corp Relay
TWI294138B (en) * 2004-02-20 2008-03-01 Chou Chia-Shing A fabrication method for making a planar cantilever, low surface leakage, reproducible and reliable metal dimple contact micro-relay mems switch, and a method for making microelectromechanical device having a common ground plane layer and a set of conta

Also Published As

Publication number Publication date
KR101724717B1 (ko) 2017-04-07
US7902946B2 (en) 2011-03-08
JP2011527821A (ja) 2011-11-04
WO2010005888A2 (en) 2010-01-14
KR20110027649A (ko) 2011-03-16
WO2010005888A3 (en) 2010-04-15
DE112009001086T5 (de) 2012-01-12
TW201007802A (en) 2010-02-16
US20100007448A1 (en) 2010-01-14
JP5456777B2 (ja) 2014-04-02

Similar Documents

Publication Publication Date Title
TWI492259B (zh) 具有一透過開關自電路徑所去耦之通量路徑和一不依賴核心結構之懸浮結構的微機電系統繼電器以及形成其之方法
US8446237B1 (en) MEMS relay and method of forming the MEMS relay
US10969602B2 (en) Integrated camera lens suspension
US7464459B1 (en) Method of forming a MEMS actuator and relay with vertical actuation
CN1075229C (zh) 批量制造的电磁微动继电器/微动开关及其制造方法
JP2007537562A5 (https=)
JP2010526456A (ja) 電気部品
WO2000044020A2 (en) Laminate-based apparatus and method of fabrication
WO2008045230A9 (en) Contact electrode for microdevices and etch method of manufacture
JP5131298B2 (ja) スイッチ及びその製造方法並びに静電リレー
US20120241200A1 (en) Circuit board, manufacturing method of circuit board, suspension substrate, suspension, device-mounted suspension, and hard disk drive
US7644490B1 (en) Method of forming a microelectromechanical (MEMS) device
JP5187327B2 (ja) スイッチ及びその製造方法並びにリレー
CN101224865A (zh) 微开关器件及其制造方法
EP2365499A1 (en) Switch and method for manufacturing the same, and relay
US20100231333A1 (en) Electromechanical relay and method of making same
JPWO2013046283A1 (ja) 可動部を有する電気機器とその製造方法
JP2010502465A (ja) マイクロアクチュエータおよびロッキング・スイッチ
US7602267B1 (en) MEMS actuator and relay with horizontal actuation
US7598829B1 (en) MEMS actuator and relay with vertical actuation
JP6020621B2 (ja) サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP4628275B2 (ja) マイクロスイッチング素子およびマイクロスイッチング素子製造方法
JP6237827B2 (ja) サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
WO2010074221A1 (ja) マイクロリレー
JP2012198957A (ja) サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ