DE112008001482T5 - Vorrichtung und Verfahren zur Verbesserung der Behandlungsgleichmäßigkeit in einem Plasmaprozess - Google Patents

Vorrichtung und Verfahren zur Verbesserung der Behandlungsgleichmäßigkeit in einem Plasmaprozess Download PDF

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Publication number
DE112008001482T5
DE112008001482T5 DE112008001482T DE112008001482T DE112008001482T5 DE 112008001482 T5 DE112008001482 T5 DE 112008001482T5 DE 112008001482 T DE112008001482 T DE 112008001482T DE 112008001482 T DE112008001482 T DE 112008001482T DE 112008001482 T5 DE112008001482 T5 DE 112008001482T5
Authority
DE
Germany
Prior art keywords
workpiece
plasma
sacrificial body
peripheral edge
outer peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112008001482T
Other languages
German (de)
English (en)
Inventor
Jiangang Concord Zhao
James D. Vacaville Getty
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nordson Corp
Original Assignee
Nordson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordson Corp filed Critical Nordson Corp
Publication of DE112008001482T5 publication Critical patent/DE112008001482T5/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H01J2237/3343—Problems associated with etching

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
DE112008001482T 2007-06-01 2008-05-23 Vorrichtung und Verfahren zur Verbesserung der Behandlungsgleichmäßigkeit in einem Plasmaprozess Withdrawn DE112008001482T5 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US94151807P 2007-06-01 2007-06-01
US60/941,518 2007-06-01
US12/125,335 US20080296261A1 (en) 2007-06-01 2008-05-22 Apparatus and methods for improving treatment uniformity in a plasma process
US12/125,335 2008-05-22
PCT/US2008/064670 WO2008150739A1 (en) 2007-06-01 2008-05-23 Apparatus and methods for improving treatment uniformity in a plasma process

Publications (1)

Publication Number Publication Date
DE112008001482T5 true DE112008001482T5 (de) 2010-04-29

Family

ID=40086939

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112008001482T Withdrawn DE112008001482T5 (de) 2007-06-01 2008-05-23 Vorrichtung und Verfahren zur Verbesserung der Behandlungsgleichmäßigkeit in einem Plasmaprozess

Country Status (7)

Country Link
US (1) US20080296261A1 (https=)
JP (1) JP2010529656A (https=)
KR (1) KR20100025515A (https=)
CN (1) CN101681785B (https=)
DE (1) DE112008001482T5 (https=)
TW (1) TW200905777A (https=)
WO (1) WO2008150739A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008024681A2 (en) 2006-08-22 2008-02-28 Nordson Corporation Apparatus and methods for handling workpieces in a processing system
US8372238B2 (en) 2008-05-20 2013-02-12 Nordson Corporation Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes
CN102099870A (zh) * 2008-06-11 2011-06-15 因特瓦克公司 用于在太阳能电池制作中使用的专用注入系统和方法
US8749053B2 (en) * 2009-06-23 2014-06-10 Intevac, Inc. Plasma grid implant system for use in solar cell fabrications
TWI506719B (zh) 2011-11-08 2015-11-01 因特瓦克公司 基板處理系統及方法
CN103165374B (zh) * 2011-12-08 2017-05-10 中微半导体设备(上海)有限公司 一种等离子体处理装置及应用于等离子处理装置的边缘环
US9385017B2 (en) * 2012-08-06 2016-07-05 Nordson Corporation Apparatus and methods for handling workpieces of different sizes
US9318332B2 (en) 2012-12-19 2016-04-19 Intevac, Inc. Grid for plasma ion implant
JP7451490B2 (ja) * 2018-07-30 2024-03-18 ノードソン コーポレーション プラズマを用いたワーク処理用のシステム
CN113035680B (zh) * 2019-12-24 2024-06-14 中微半导体设备(上海)股份有限公司 用于真空设备的调平机构和等离子体处理装置
CN111180370A (zh) * 2020-02-21 2020-05-19 北京北方华创微电子装备有限公司 晶圆承载托盘及半导体加工设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4786359A (en) * 1987-06-24 1988-11-22 Tegal Corporation Xenon enhanced plasma etch
JPH0373524A (ja) * 1989-08-14 1991-03-28 Fujitsu Ltd エッチング方法
US6284093B1 (en) * 1996-11-29 2001-09-04 Applied Materials, Inc. Shield or ring surrounding semiconductor workpiece in plasma chamber
US20010049196A1 (en) * 1997-09-09 2001-12-06 Roger Patrick Apparatus for improving etch uniformity and methods therefor
US6074488A (en) * 1997-09-16 2000-06-13 Applied Materials, Inc Plasma chamber support having an electrically coupled collar ring
US6014979A (en) * 1998-06-22 2000-01-18 Applied Materials, Inc. Localizing cleaning plasma for semiconductor processing
DE29813326U1 (de) * 1998-07-29 1998-12-10 PROTEC Gesellschaft für Werkstoff- und Oberflächentechnik mbH, 57234 Wilnsdorf Verbesserte Vorrichtung zum Schutz von elektrostatischen Haltesystemen in Anlagen zur Bearbeitung von Wafern
JP2000299305A (ja) * 1999-04-16 2000-10-24 Toshiba Corp プラズマ処理装置
US6344105B1 (en) * 1999-06-30 2002-02-05 Lam Research Corporation Techniques for improving etch rate uniformity
US6475336B1 (en) * 2000-10-06 2002-11-05 Lam Research Corporation Electrostatically clamped edge ring for plasma processing
US6391787B1 (en) * 2000-10-13 2002-05-21 Lam Research Corporation Stepped upper electrode for plasma processing uniformity
US6554954B2 (en) * 2001-04-03 2003-04-29 Applied Materials Inc. Conductive collar surrounding semiconductor workpiece in plasma chamber
JP2003100713A (ja) * 2001-09-26 2003-04-04 Kawasaki Microelectronics Kk プラズマ電極用カバー
US6776849B2 (en) * 2002-03-15 2004-08-17 Asm America, Inc. Wafer holder with peripheral lift ring
KR100610010B1 (ko) * 2004-07-20 2006-08-08 삼성전자주식회사 반도체 식각 장치
KR100674922B1 (ko) * 2004-12-02 2007-01-26 삼성전자주식회사 포커스 링을 냉각하는 냉각 유로를 가지는 웨이퍼지지장치
WO2008024681A2 (en) * 2006-08-22 2008-02-28 Nordson Corporation Apparatus and methods for handling workpieces in a processing system

Also Published As

Publication number Publication date
WO2008150739A1 (en) 2008-12-11
CN101681785B (zh) 2012-05-09
CN101681785A (zh) 2010-03-24
TW200905777A (en) 2009-02-01
KR20100025515A (ko) 2010-03-09
JP2010529656A (ja) 2010-08-26
US20080296261A1 (en) 2008-12-04

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Legal Events

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R082 Change of representative

Representative=s name: EISENFUEHR SPEISER PATENTANWAELTE RECHTSANWAEL, DE

R005 Application deemed withdrawn due to failure to request examination