DE1083438B - Von einem Metallgehaeuse umschlossene Transistoranordnung - Google Patents

Von einem Metallgehaeuse umschlossene Transistoranordnung

Info

Publication number
DE1083438B
DE1083438B DEI16468A DEI0016468A DE1083438B DE 1083438 B DE1083438 B DE 1083438B DE I16468 A DEI16468 A DE I16468A DE I0016468 A DEI0016468 A DE I0016468A DE 1083438 B DE1083438 B DE 1083438B
Authority
DE
Germany
Prior art keywords
emitter
collector
base
metal housing
transistor arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DEI16468A
Other languages
German (de)
English (en)
Inventor
Georges Calon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ELEKTRONIK MBH
TDK Micronas GmbH
Original Assignee
ELEKTRONIK MBH
TDK Micronas GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ELEKTRONIK MBH, TDK Micronas GmbH filed Critical ELEKTRONIK MBH
Priority to DEI16468A priority Critical patent/DE1083438B/de
Priority to FR815079A priority patent/FR1244736A/fr
Publication of DE1083438B publication Critical patent/DE1083438B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
DEI16468A 1959-05-23 1959-05-23 Von einem Metallgehaeuse umschlossene Transistoranordnung Pending DE1083438B (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DEI16468A DE1083438B (de) 1959-05-23 1959-05-23 Von einem Metallgehaeuse umschlossene Transistoranordnung
FR815079A FR1244736A (fr) 1959-05-23 1960-01-07 Organe semi-conducteur, en particulier transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEI16468A DE1083438B (de) 1959-05-23 1959-05-23 Von einem Metallgehaeuse umschlossene Transistoranordnung

Publications (1)

Publication Number Publication Date
DE1083438B true DE1083438B (de) 1960-06-15

Family

ID=7185947

Family Applications (1)

Application Number Title Priority Date Filing Date
DEI16468A Pending DE1083438B (de) 1959-05-23 1959-05-23 Von einem Metallgehaeuse umschlossene Transistoranordnung

Country Status (2)

Country Link
DE (1) DE1083438B (fr)
FR (1) FR1244736A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1168568B (de) * 1961-07-26 1964-04-23 Telefunken Patent Verfahren zur Herstellung von Legierungs-elektroden fuer Halbleiteranordnungen
DE1206089B (de) * 1960-10-01 1965-12-02 Telefunken Patent Verfahren zum Herstellen eines Transistors mit einlegierten Elektroden und nach diesem Verfahren hergestellter Transistor
DE1232267B (de) * 1961-05-27 1967-01-12 Telefunken Patent Verfahren zur Herstellung eines Halbleiterbauelementes mit Mesastruktur

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1048358B (fr) * 1955-08-12 1959-01-08
DE1784807A1 (de) * 1968-09-20 1971-11-11 Strabag Bau Ag Stossverbindung fuer Bewehrungseinlagen von vorgefertigten Bauwerksteilen

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1048358B (fr) * 1955-08-12 1959-01-08
DE1784807A1 (de) * 1968-09-20 1971-11-11 Strabag Bau Ag Stossverbindung fuer Bewehrungseinlagen von vorgefertigten Bauwerksteilen

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1206089B (de) * 1960-10-01 1965-12-02 Telefunken Patent Verfahren zum Herstellen eines Transistors mit einlegierten Elektroden und nach diesem Verfahren hergestellter Transistor
DE1232267B (de) * 1961-05-27 1967-01-12 Telefunken Patent Verfahren zur Herstellung eines Halbleiterbauelementes mit Mesastruktur
DE1168568B (de) * 1961-07-26 1964-04-23 Telefunken Patent Verfahren zur Herstellung von Legierungs-elektroden fuer Halbleiteranordnungen

Also Published As

Publication number Publication date
FR1244736A (fr) 1960-10-28

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