WO1991012705A1 - Unite hybride en couche epaisse avec prise enfichable - Google Patents

Unite hybride en couche epaisse avec prise enfichable Download PDF

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Publication number
WO1991012705A1
WO1991012705A1 PCT/DE1991/000037 DE9100037W WO9112705A1 WO 1991012705 A1 WO1991012705 A1 WO 1991012705A1 DE 9100037 W DE9100037 W DE 9100037W WO 9112705 A1 WO9112705 A1 WO 9112705A1
Authority
WO
WIPO (PCT)
Prior art keywords
thick
film
film hybrid
plastic
hybrid assembly
Prior art date
Application number
PCT/DE1991/000037
Other languages
German (de)
English (en)
Inventor
Dieter Seipler
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO1991012705A1 publication Critical patent/WO1991012705A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing

Definitions

  • the invention relates to a thick-film hybrid assembly with a plug connection according to the preamble of claim 1.
  • Thick-film hybrid assemblies are known with one or more ceramic carrier plates lying parallel to one another, to which thick-film conductor tracks are applied by means of a thick-film metallization. Furthermore, it is known to provide such assemblies with a plug-in connection which is connected via a further conductor material, e.g. a lead frame, and the necessary connection, e.g. Bonding or soldering. Such a connection is evidently expensive to manufacture.
  • a further conductor material e.g. a lead frame
  • the thick-film conductor tracks are guided to the outer edge of the ceramic carrier plate and form connection contacts there for a mating connector part, the ceramic carrier plate with the outer edge being inserted through a slot in a plastic body in such a way that the connection contacts are exposed on one side of the plastic body and are available for a mating connector.
  • the slot is poured out between them for holding and sealing between the ceramic carrier plate and the plastic body.
  • the ceramic carrier plate (Al2O3) with thick-film metallization is inert and well suited for contact with resilient mating contacts with the same surface.
  • the noble metals gold or silver or alloys thereof or dipped in tin are suitable as the thick-film surface. Sealing the ceramic against plastic is already being practiced. Additional conductor material and then necessary connections are avoided by the direct plugging of the thick-film hybrid assembly according to the invention.
  • connection technology according to the invention can in particular also be used with a plurality of ceramic carrier plates lying parallel to one another.
  • the plastic body is advantageously designed as a plastic plate or as a molded plastic part which is perpendicular to the ceramic carrier plate (s), these being inserted through the longitudinal slots with the connection contacts and the longitudinal slots being poured linearly together with adhesive material for a good hold and a good seal.
  • the thick-film hybrid assembly can also be cast in a known manner in the connection technology according to the invention on the side of the plastic body opposite the connection contacts and / or housed in a housing. Seals towards the mating connector connection can
  • Fig. 3 is a front view with a view of the plug connection.
  • a Dick Mrs ⁇ is hybrid assembly 1 is shown with two * arallel lying ceramic panels 2, 3, an intermediate Metall ⁇ core 4, an end plastic plate 5 and a ver ⁇ cast housing 6.
  • the two ceramic carrier plates 2, 3 or thick-film hybrid arrangements are connected in the area of the plastic plate 5 by a wire connection 8 and in the area remote from it by a double comb 9.
  • the plastic plate 5 contains two parallel slots 10, 11 (see also FIG. 3) in the width of the ceramic supports, through which they are inserted and protrude with an outer edge region 12 over the plastic plate 5.
  • This outer edge region 12 on a ceramic carrier plate 2 or 3 is shown separately in FIG. 2. From this it can be seen that thick-film conductor tracks 13 are guided on the outer edge region 12 of a ceramic carrier plate 2 and are self-supporting widen there to 14 terminal contacts. A number of such connection contacts lie next to one another in a grid dimension corresponding to the mating connector provided. The dimensions could be chosen like mini or microtimer contacts.
  • the surfaces are thick-film gold or Ag or AgPd with Sn (dipped) or made of eutectic solder.
  • the plastic plate 5 and the ceramic carrier plates 2, 3 are linearly sealed from the outside in the area of the slots 10, 11 and continuously sealed and cast with adhesive material to form an adhesive seal 15.
  • Spring contacts 16 with the corresponding contacts of the corresponding surface of a mating connector are plugged onto the connection contacts 14.
  • An annular circumferential sealing lip 17 which projects far from the plastic plate 5 is provided for sealing the connection area.
  • a sealing ring 18 embedded in a groove can be used in the outer region.
  • the thick-film hybrid assembly is, as usual, mounted on a heat sink and the connector part against e.g. a metal housing screwed and sealed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'invention concerne une unité hybride en couche épaisse (1) avec une prise enfichable et au moins une plaque-support en céramique (2, 3) sur laquelle sont disposées des pistes conductrices en couche épaisse (7) au-dessus de la métallisation en couche épaisse. Dans l'invention, des pistes conductrices en couche épaisse (7) sont disposées sur le bord extérieur (12) de la plaque-support en céramique (2, 3) et forment à cet endroit des contacts de raccordement (14) pour une contre-fiche (16). L'une au moins des plaques-supports en céramique (2, 3) est enfichée avec son bord extérieur (12) par une fente (10, 11) dans une pièce en matière plastique (5) de telle manière que les contacts de raccordement (14) soient libres sur l'un des côtés de la pièce en matière plastique (5) et soient disponibles pour un raccordement sur la contre-fiche. Pour assurer le maintien et l'étanchéité entre la plaque-support en céramique (2, 3) et la pièce en matière plastique (5), la fente (10, 11) placée entre ces éléments est scellée (joint adhésif 15). On réalise ainsi, dans de bonnes conditions, un enfichage direct d'une unité hybride en couche épaisse et on évite d'utiliser d'autres matériaux conducteurs, comme le grillage estampé, et d'établir des liaisons, par exemple par bonding ou par soudage.
PCT/DE1991/000037 1990-02-17 1991-01-18 Unite hybride en couche epaisse avec prise enfichable WO1991012705A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4005113.7 1990-02-17
DE19904005113 DE4005113A1 (de) 1990-02-17 1990-02-17 Dickschichthybridbaugruppe mit einem steckanschluss

Publications (1)

Publication Number Publication Date
WO1991012705A1 true WO1991012705A1 (fr) 1991-08-22

Family

ID=6400449

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1991/000037 WO1991012705A1 (fr) 1990-02-17 1991-01-18 Unite hybride en couche epaisse avec prise enfichable

Country Status (4)

Country Link
EP (1) EP0515383A1 (fr)
JP (1) JPH05504234A (fr)
DE (1) DE4005113A1 (fr)
WO (1) WO1991012705A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4142138C2 (de) * 1991-12-20 1998-04-23 Bosch Gmbh Robert Elektrisches Steuergerät
DE4142139A1 (de) * 1991-12-20 1993-06-24 Bosch Gmbh Robert Elektronisches geraet
DE10300171A1 (de) * 2003-01-08 2004-07-22 Hella Kg Hueck & Co. Elektronische Baugruppe mit metallischem Gehäuseteil
DE102010025086A1 (de) * 2010-06-25 2011-12-29 Continental Automotive Gmbh Verfahren zur elektrischen Kontaktierung einer elektrischen Baugruppe für ein Kraftfahrzeug mit zumindest einem Stecker

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1508507A (en) * 1974-06-20 1978-04-26 Matsushita Electric Ind Co Ltd Connector assembly for printed circuit board
WO1986002230A1 (fr) * 1984-09-27 1986-04-10 Robert Bosch Gmbh Montage hybride pour circuit electronique
US4818240A (en) * 1987-10-30 1989-04-04 International Business Machines Corporation Power rails for edge mounting modules
US4843520A (en) * 1987-02-03 1989-06-27 Matsushita Electric Industrial Co. Ltd. Electronic circuit module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1508507A (en) * 1974-06-20 1978-04-26 Matsushita Electric Ind Co Ltd Connector assembly for printed circuit board
WO1986002230A1 (fr) * 1984-09-27 1986-04-10 Robert Bosch Gmbh Montage hybride pour circuit electronique
US4843520A (en) * 1987-02-03 1989-06-27 Matsushita Electric Industrial Co. Ltd. Electronic circuit module
US4818240A (en) * 1987-10-30 1989-04-04 International Business Machines Corporation Power rails for edge mounting modules

Also Published As

Publication number Publication date
JPH05504234A (ja) 1993-07-01
EP0515383A1 (fr) 1992-12-02
DE4005113A1 (de) 1991-08-22

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