DE1076292B - Klebstoff, insbesondere zum Aufkleben von Kunststoffen, wie Polyvinylfolien u. dgl., auf Metalle mit einem Gehalt an Polyisocyanaten und an mit diesen Polyurethane bildenden Polyoxyverbindungen - Google Patents

Klebstoff, insbesondere zum Aufkleben von Kunststoffen, wie Polyvinylfolien u. dgl., auf Metalle mit einem Gehalt an Polyisocyanaten und an mit diesen Polyurethane bildenden Polyoxyverbindungen

Info

Publication number
DE1076292B
DE1076292B DEA30697A DEA0030697A DE1076292B DE 1076292 B DE1076292 B DE 1076292B DE A30697 A DEA30697 A DE A30697A DE A0030697 A DEA0030697 A DE A0030697A DE 1076292 B DE1076292 B DE 1076292B
Authority
DE
Germany
Prior art keywords
adhesive
content
polyisocyanates
polyvinyl
metals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DEA30697A
Other languages
German (de)
English (en)
Inventor
Jean-Jacques Meynis De Paulin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ALUMINIUM FRANCAIS
Original Assignee
ALUMINIUM FRANCAIS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ALUMINIUM FRANCAIS filed Critical ALUMINIUM FRANCAIS
Publication of DE1076292B publication Critical patent/DE1076292B/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J157/00Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28Non-macromolecular organic substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
DEA30697A 1957-11-08 1958-11-07 Klebstoff, insbesondere zum Aufkleben von Kunststoffen, wie Polyvinylfolien u. dgl., auf Metalle mit einem Gehalt an Polyisocyanaten und an mit diesen Polyurethane bildenden Polyoxyverbindungen Pending DE1076292B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1076292X 1957-11-08

Publications (1)

Publication Number Publication Date
DE1076292B true DE1076292B (de) 1960-02-25

Family

ID=9607575

Family Applications (1)

Application Number Title Priority Date Filing Date
DEA30697A Pending DE1076292B (de) 1957-11-08 1958-11-07 Klebstoff, insbesondere zum Aufkleben von Kunststoffen, wie Polyvinylfolien u. dgl., auf Metalle mit einem Gehalt an Polyisocyanaten und an mit diesen Polyurethane bildenden Polyoxyverbindungen

Country Status (3)

Country Link
BE (1) BE572803A (enrdf_load_stackoverflow)
DE (1) DE1076292B (enrdf_load_stackoverflow)
FR (1) FR1192267A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3215774A1 (de) * 1981-05-07 1982-12-09 Synthetic Surfaces Inc., 07076 Scotch Plains, N.J. Haertbare klebstoffzusammensetzung
EP0114313A3 (en) * 1982-12-21 1984-08-22 Takeda Chemical Industries, Ltd. Adhesive compositions

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1322381A (en) * 1970-01-02 1973-07-04 British Aluminium Co Ltd Protective coated aluminium and a process for the application of a protective coating to aluminium

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB558100A (en) * 1942-04-29 1943-12-21 Paul Frankfurther Improved adhesive composition
US2575265A (en) * 1949-12-17 1951-11-13 Goodrich Co B F Adhesive composition and method of making
DE897482C (de) * 1942-07-25 1953-11-23 Bayer Ag Verfahren zur Herstellung von hochmolekularen Produkten

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB558100A (en) * 1942-04-29 1943-12-21 Paul Frankfurther Improved adhesive composition
GB559359A (en) * 1942-04-29 1944-02-15 Paul Frankfurther Improved adhesive composition
GB595005A (en) * 1942-04-29 1947-11-25 Paul Frankfurther Improved adhesive composition
DE897482C (de) * 1942-07-25 1953-11-23 Bayer Ag Verfahren zur Herstellung von hochmolekularen Produkten
US2575265A (en) * 1949-12-17 1951-11-13 Goodrich Co B F Adhesive composition and method of making

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3215774A1 (de) * 1981-05-07 1982-12-09 Synthetic Surfaces Inc., 07076 Scotch Plains, N.J. Haertbare klebstoffzusammensetzung
EP0114313A3 (en) * 1982-12-21 1984-08-22 Takeda Chemical Industries, Ltd. Adhesive compositions

Also Published As

Publication number Publication date
BE572803A (enrdf_load_stackoverflow) 1900-01-01
FR1192267A (fr) 1959-10-26

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