DE102021113639B3 - Integriertes schaltungs-package und verfahren zum bilden desselben - Google Patents

Integriertes schaltungs-package und verfahren zum bilden desselben Download PDF

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DE102021113639B3
DE102021113639B3 DE102021113639.3A DE102021113639A DE102021113639B3 DE 102021113639 B3 DE102021113639 B3 DE 102021113639B3 DE 102021113639 A DE102021113639 A DE 102021113639A DE 102021113639 B3 DE102021113639 B3 DE 102021113639B3
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die
connector
interposer
dielectric layer
connectors
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English (en)
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Hsien-Wei Chen
Ming-Fa Chen
Ying-Ju Chen
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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CN115332195B (zh) * 2022-10-13 2023-01-31 江苏长电科技股份有限公司 双面SiP封装结构及其制作方法

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