DE102009053586A1 - Photomaskenrohling, Herstellungsverfahren für Photomaskenrohling und Herstellungsverfahren für Photomaske - Google Patents
Photomaskenrohling, Herstellungsverfahren für Photomaskenrohling und Herstellungsverfahren für Photomaske Download PDFInfo
- Publication number
- DE102009053586A1 DE102009053586A1 DE102009053586A DE102009053586A DE102009053586A1 DE 102009053586 A1 DE102009053586 A1 DE 102009053586A1 DE 102009053586 A DE102009053586 A DE 102009053586A DE 102009053586 A DE102009053586 A DE 102009053586A DE 102009053586 A1 DE102009053586 A1 DE 102009053586A1
- Authority
- DE
- Germany
- Prior art keywords
- light
- layer
- thin film
- photomask
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
- H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008295142A JP5356784B2 (ja) | 2008-11-19 | 2008-11-19 | フォトマスクブランクの製造方法及びフォトマスクの製造方法 |
| JP2008-295142 | 2008-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102009053586A1 true DE102009053586A1 (de) | 2010-06-10 |
Family
ID=42145850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102009053586A Withdrawn DE102009053586A1 (de) | 2008-11-19 | 2009-11-17 | Photomaskenrohling, Herstellungsverfahren für Photomaskenrohling und Herstellungsverfahren für Photomaske |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8197992B2 (https=) |
| JP (1) | JP5356784B2 (https=) |
| KR (1) | KR101676031B1 (https=) |
| DE (1) | DE102009053586A1 (https=) |
| TW (1) | TWI453535B (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5409298B2 (ja) * | 2009-11-26 | 2014-02-05 | Hoya株式会社 | マスクブランク及び転写用マスク並びにそれらの製造方法 |
| US9091934B2 (en) * | 2010-12-24 | 2015-07-28 | Hoya Corporation | Mask blank, method of manufacturing the same, transfer mask, and method of manufacturing the same |
| CN102929097A (zh) * | 2012-10-17 | 2013-02-13 | 深圳市华星光电技术有限公司 | 光罩、tft玻璃基板及其制造方法 |
| JP5802294B2 (ja) * | 2014-03-06 | 2015-10-28 | Hoya株式会社 | フォトマスクブランクの製造方法及びフォトマスクの製造方法 |
| TWI835695B (zh) * | 2018-11-30 | 2024-03-11 | 日商Hoya股份有限公司 | 光罩基底、光罩之製造方法及顯示裝置之製造方法 |
| JP2021004920A (ja) * | 2019-06-25 | 2021-01-14 | Hoya株式会社 | マスクブランク、転写用マスクの製造方法、及び半導体デバイスの製造方法 |
| JP7801845B2 (ja) * | 2020-09-08 | 2026-01-19 | テクセンドフォトマスク株式会社 | 位相シフトマスクブランク、位相シフトマスク及び位相シフトマスクの製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002156742A (ja) | 2000-11-20 | 2002-05-31 | Shin Etsu Chem Co Ltd | 位相シフトマスクブランク、位相シフトマスク及びこれらの製造方法 |
| JP2008295142A (ja) | 2007-05-23 | 2008-12-04 | Toyo Electric Mfg Co Ltd | 電気車用の半導体冷却装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09139514A (ja) * | 1995-11-13 | 1997-05-27 | Nec Kansai Ltd | 太陽電池およびその製造方法 |
| JPH11184067A (ja) * | 1997-12-19 | 1999-07-09 | Hoya Corp | 位相シフトマスク及び位相シフトマスクブランク |
| JP2002169265A (ja) | 2000-12-01 | 2002-06-14 | Hoya Corp | フォトマスクブランクス及びフォトマスクブランクスの製造方法 |
| JP4600629B2 (ja) * | 2001-06-26 | 2010-12-15 | 信越化学工業株式会社 | 位相シフトマスクブランク及びその製造方法 |
| US20040146650A1 (en) * | 2002-10-29 | 2004-07-29 | Microfabrica Inc. | EFAB methods and apparatus including spray metal or powder coating processes |
| EP1698647A4 (en) | 2003-12-26 | 2008-01-30 | Kansai Paint Co Ltd | POLYMER AND PROCESS FOR PRODUCING THE SAME |
| DE112005001588B4 (de) * | 2004-07-09 | 2021-02-25 | Hoya Corp. | Fotomaskenrohling, Fotomaskenherstellungsverfahren und Halbleiterbausteinherstellungsverfahren |
| JP2007128799A (ja) * | 2005-11-07 | 2007-05-24 | Seiko Epson Corp | 有機el装置の製造方法、及び有機el装置、並びに有機el装置の製造装置 |
| JP4737426B2 (ja) * | 2006-04-21 | 2011-08-03 | 信越化学工業株式会社 | フォトマスクブランク |
| JP4958149B2 (ja) * | 2006-11-01 | 2012-06-20 | Hoya株式会社 | 位相シフトマスクブランクの製造方法及び位相シフトマスクの製造方法 |
-
2008
- 2008-11-19 JP JP2008295142A patent/JP5356784B2/ja not_active Expired - Fee Related
-
2009
- 2009-11-17 DE DE102009053586A patent/DE102009053586A1/de not_active Withdrawn
- 2009-11-18 KR KR1020090111506A patent/KR101676031B1/ko not_active Expired - Fee Related
- 2009-11-18 TW TW098139064A patent/TWI453535B/zh not_active IP Right Cessation
- 2009-11-18 US US12/620,805 patent/US8197992B2/en not_active Expired - Fee Related
-
2012
- 2012-05-01 US US13/460,893 patent/US8709683B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002156742A (ja) | 2000-11-20 | 2002-05-31 | Shin Etsu Chem Co Ltd | 位相シフトマスクブランク、位相シフトマスク及びこれらの製造方法 |
| JP2008295142A (ja) | 2007-05-23 | 2008-12-04 | Toyo Electric Mfg Co Ltd | 電気車用の半導体冷却装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201109829A (en) | 2011-03-16 |
| US20100124711A1 (en) | 2010-05-20 |
| JP5356784B2 (ja) | 2013-12-04 |
| US8197992B2 (en) | 2012-06-12 |
| JP2010122409A (ja) | 2010-06-03 |
| US8709683B2 (en) | 2014-04-29 |
| TWI453535B (zh) | 2014-09-21 |
| KR101676031B1 (ko) | 2016-11-14 |
| KR20100056404A (ko) | 2010-05-27 |
| US20120214093A1 (en) | 2012-08-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: G03F0001080000 Ipc: G03F0001500000 |
|
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: G03F0001080000 Ipc: G03F0001500000 Effective date: 20120111 |
|
| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20120601 |