DE102009051746A1 - Optoelektronisches Bauelement - Google Patents

Optoelektronisches Bauelement Download PDF

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Publication number
DE102009051746A1
DE102009051746A1 DE102009051746A DE102009051746A DE102009051746A1 DE 102009051746 A1 DE102009051746 A1 DE 102009051746A1 DE 102009051746 A DE102009051746 A DE 102009051746A DE 102009051746 A DE102009051746 A DE 102009051746A DE 102009051746 A1 DE102009051746 A1 DE 102009051746A1
Authority
DE
Germany
Prior art keywords
carrier
optoelectronic
optoelectronic semiconductor
semiconductor chip
optoelectronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102009051746A
Other languages
German (de)
English (en)
Inventor
Klaus Dr. Müller
Siegfried Herrmann
Günter Spath
Ewald Karl Michael Dr. Günther
Herbert Brunner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE102009051746A priority Critical patent/DE102009051746A1/de
Priority to KR1020127011272A priority patent/KR20120091173A/ko
Priority to JP2012531310A priority patent/JP2013506976A/ja
Priority to US13/499,622 priority patent/US8853732B2/en
Priority to CN201080044010.5A priority patent/CN102576790B/zh
Priority to PCT/EP2010/062733 priority patent/WO2011039023A1/de
Priority to EP10749639.0A priority patent/EP2483937B1/de
Priority to TW099131809A priority patent/TW201126775A/zh
Publication of DE102009051746A1 publication Critical patent/DE102009051746A1/de
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
DE102009051746A 2009-09-30 2009-11-03 Optoelektronisches Bauelement Withdrawn DE102009051746A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102009051746A DE102009051746A1 (de) 2009-09-30 2009-11-03 Optoelektronisches Bauelement
KR1020127011272A KR20120091173A (ko) 2009-09-30 2010-08-31 광전자 소자
JP2012531310A JP2013506976A (ja) 2009-09-30 2010-08-31 オプトエレクトロニクス部品
US13/499,622 US8853732B2 (en) 2009-09-30 2010-08-31 Optoelectronic component
CN201080044010.5A CN102576790B (zh) 2009-09-30 2010-08-31 光电子部件
PCT/EP2010/062733 WO2011039023A1 (de) 2009-09-30 2010-08-31 Optoelektronisches bauelement
EP10749639.0A EP2483937B1 (de) 2009-09-30 2010-08-31 Optoelektronisches bauelement
TW099131809A TW201126775A (en) 2009-09-30 2010-09-20 Optoelectronic component

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009047878.7 2009-09-30
DE102009047878 2009-09-30
DE102009051746A DE102009051746A1 (de) 2009-09-30 2009-11-03 Optoelektronisches Bauelement

Publications (1)

Publication Number Publication Date
DE102009051746A1 true DE102009051746A1 (de) 2011-03-31

Family

ID=43662656

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102009051746A Withdrawn DE102009051746A1 (de) 2009-09-30 2009-11-03 Optoelektronisches Bauelement

Country Status (8)

Country Link
US (1) US8853732B2 (https=)
EP (1) EP2483937B1 (https=)
JP (1) JP2013506976A (https=)
KR (1) KR20120091173A (https=)
CN (1) CN102576790B (https=)
DE (1) DE102009051746A1 (https=)
TW (1) TW201126775A (https=)
WO (1) WO2011039023A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012200416A1 (de) 2012-01-12 2013-07-18 Osram Opto Semiconductors Gmbh Optoelektronisches modul und verfahren zur herstellung eines optoelektronischen moduls
WO2013124420A1 (de) * 2012-02-23 2013-08-29 Osram Opto Semiconductors Gmbh Verfahren zum herstellen eines optoelektronischen bauelements und derart hergestelltes optoelektronisches bauelement
DE102012108160A1 (de) 2012-09-03 2014-03-06 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
DE102014101492A1 (de) 2014-02-06 2015-08-06 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
DE102015208704A1 (de) * 2015-05-11 2016-11-17 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
WO2017194623A1 (de) * 2016-05-11 2017-11-16 Osram Opto Semiconductors Gmbh Verfahren zur herstellung eines optoelektronischen bauelements und optoelektronisches bauelement

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011105010A1 (de) * 2011-06-20 2012-12-20 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
DE102014101489B4 (de) * 2014-02-06 2023-03-02 Pictiva Displays International Limited Verfahren zur Herstellung einer optoelektronischen Anordnung
DE102015114010A1 (de) * 2015-08-24 2017-03-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, Verfahren zur Herstellung eines optoelektronischen Bauelements und Verfahren zum Betrieb eines optoelektronischen Bauelements
DE102015118433A1 (de) * 2015-10-28 2017-05-04 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
KR102487685B1 (ko) * 2015-11-10 2023-01-16 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 및 이를 구비한 조명 장치
DE102016104383A1 (de) * 2016-03-10 2017-09-14 Osram Opto Semiconductors Gmbh Verfahren und optoelektronische Leuchtvorrichtung zum Beleuchten eines Gesichts einer Person sowie Kamera und mobiles Endgerät
DE102018101582B4 (de) * 2018-01-24 2022-10-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlung emittierende Vorrichtung
KR102567568B1 (ko) * 2018-04-06 2023-08-16 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지
EP3591345B1 (de) * 2018-07-02 2020-11-11 Dr. Johannes Heidenhain GmbH Verfahren zur herstellung einer lichtquelle für eine sensoreinheit einer positionsmesseinrichtung sowie eine positionsmesseinrichtung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10233050A1 (de) * 2002-07-19 2004-02-05 Osram Opto Semiconductors Gmbh Lichtquelle auf LED-Basis, insbesondere für die Erzeugung von weißem Licht
US20080035942A1 (en) * 2006-08-08 2008-02-14 Lg Electronics Inc. Light emitting device package and method for manufacturing the same
US20080102541A1 (en) * 2006-10-31 2008-05-01 Kang Eun Jeong Method for manufacturing light emitting diode chip and light emitting diode light source module
DE102007022947A1 (de) * 2007-04-26 2008-10-30 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen

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TWI289944B (en) 2000-05-26 2007-11-11 Osram Opto Semiconductors Gmbh Light-emitting-diode-element with a light-emitting-diode-chip
JP2002335020A (ja) 2001-05-10 2002-11-22 Nichia Chem Ind Ltd 発光装置
JP4876356B2 (ja) 2001-09-05 2012-02-15 ソニー株式会社 回路素子内蔵基板の製造方法、並びに電気回路装置の製造方法
US8455994B2 (en) * 2002-01-31 2013-06-04 Imbera Electronics Oy Electronic module with feed through conductor between wiring patterns
JP2004363279A (ja) * 2003-06-04 2004-12-24 Sony Corp 光電変換装置の製造方法、並びにその製造に用いる疑似ウェーハの製造方法
US7919787B2 (en) 2003-06-27 2011-04-05 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Semiconductor device with a light emitting semiconductor die
JP4458804B2 (ja) * 2003-10-17 2010-04-28 シチズン電子株式会社 白色ｌｅｄ
JP2005322722A (ja) * 2004-05-07 2005-11-17 Korai Kagi Kofun Yugenkoshi 発光ダイオード
JP2008504698A (ja) 2004-06-30 2008-02-14 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 発光ダイオード装置、光学式記録装置および少なくとも１つの発光ダイオードをパルス状に作動させる方法
WO2006005062A2 (en) * 2004-06-30 2006-01-12 Cree, Inc. Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
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JP2006100787A (ja) 2004-08-31 2006-04-13 Toyoda Gosei Co Ltd 発光装置および発光素子
DE102004050371A1 (de) * 2004-09-30 2006-04-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit einer drahtlosen Kontaktierung
TW200637033A (en) 2004-11-22 2006-10-16 Matsushita Electric Industrial Co Ltd Light-emitting device, light-emitting module, display unit, lighting unit and method for manufacturing light-emitting device
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Publication number Priority date Publication date Assignee Title
DE10233050A1 (de) * 2002-07-19 2004-02-05 Osram Opto Semiconductors Gmbh Lichtquelle auf LED-Basis, insbesondere für die Erzeugung von weißem Licht
US20080035942A1 (en) * 2006-08-08 2008-02-14 Lg Electronics Inc. Light emitting device package and method for manufacturing the same
US20080102541A1 (en) * 2006-10-31 2008-05-01 Kang Eun Jeong Method for manufacturing light emitting diode chip and light emitting diode light source module
DE102007022947A1 (de) * 2007-04-26 2008-10-30 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012200416A1 (de) 2012-01-12 2013-07-18 Osram Opto Semiconductors Gmbh Optoelektronisches modul und verfahren zur herstellung eines optoelektronischen moduls
US9356210B2 (en) 2012-01-12 2016-05-31 Osram Opto Semiconductors Gmbh Optoelectronic module comprising an optical waveguide and method for producing same
WO2013124420A1 (de) * 2012-02-23 2013-08-29 Osram Opto Semiconductors Gmbh Verfahren zum herstellen eines optoelektronischen bauelements und derart hergestelltes optoelektronisches bauelement
US9543479B2 (en) 2012-02-23 2017-01-10 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic component and optoelectronic component produced in such a way
DE102012108160A1 (de) 2012-09-03 2014-03-06 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
WO2014032938A1 (de) 2012-09-03 2014-03-06 Osram Opto Semiconductors Gmbh Optoelektronisches halbleiterbauelement und verfahren zur herstellung eines optoelektronischen halbleiterbauelements
DE102014101492A1 (de) 2014-02-06 2015-08-06 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
US9780265B2 (en) 2014-02-06 2017-10-03 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component
DE102015208704A1 (de) * 2015-05-11 2016-11-17 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
WO2017194623A1 (de) * 2016-05-11 2017-11-16 Osram Opto Semiconductors Gmbh Verfahren zur herstellung eines optoelektronischen bauelements und optoelektronisches bauelement
US10854793B2 (en) 2016-05-11 2020-12-01 Osram Oled Gmbh Method for producing an optoelectronic component and optoelectronic component

Also Published As

Publication number Publication date
US20120248492A1 (en) 2012-10-04
EP2483937A1 (de) 2012-08-08
KR20120091173A (ko) 2012-08-17
TW201126775A (en) 2011-08-01
CN102576790A (zh) 2012-07-11
JP2013506976A (ja) 2013-02-28
US8853732B2 (en) 2014-10-07
CN102576790B (zh) 2016-08-03
EP2483937B1 (de) 2019-01-09
WO2011039023A1 (de) 2011-04-07

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