DE102008060113A1 - Verfahren zur Kapselung einer elektronischen Anordnung - Google Patents

Verfahren zur Kapselung einer elektronischen Anordnung Download PDF

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Publication number
DE102008060113A1
DE102008060113A1 DE102008060113A DE102008060113A DE102008060113A1 DE 102008060113 A1 DE102008060113 A1 DE 102008060113A1 DE 102008060113 A DE102008060113 A DE 102008060113A DE 102008060113 A DE102008060113 A DE 102008060113A DE 102008060113 A1 DE102008060113 A1 DE 102008060113A1
Authority
DE
Germany
Prior art keywords
pressure
sensitive adhesive
psa
block copolymers
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102008060113A
Other languages
German (de)
English (en)
Inventor
Jan Ellinger
Thorsten Dr. Krawinkel
Klaus Dr. Keite-Telgenbüscher
Alexander Steen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tesa SE
Original Assignee
Tesa SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa SE filed Critical Tesa SE
Priority to DE102008060113A priority Critical patent/DE102008060113A1/de
Priority to TW098137381A priority patent/TWI488242B/zh
Priority to PCT/EP2009/065393 priority patent/WO2010063579A1/de
Priority to KR1020107027853A priority patent/KR101660817B1/ko
Priority to US12/996,716 priority patent/US8460969B2/en
Priority to PL09756304T priority patent/PL2279537T3/pl
Priority to CN200980132496.5A priority patent/CN102132439B/zh
Priority to EP09756304.3A priority patent/EP2279537B1/de
Priority to JP2011538934A priority patent/JP6074141B2/ja
Publication of DE102008060113A1 publication Critical patent/DE102008060113A1/de
Priority to JP2016216894A priority patent/JP6407940B2/ja
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/005—Modified block copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesive Tapes (AREA)
DE102008060113A 2008-12-03 2008-12-03 Verfahren zur Kapselung einer elektronischen Anordnung Withdrawn DE102008060113A1 (de)

Priority Applications (10)

Application Number Priority Date Filing Date Title
DE102008060113A DE102008060113A1 (de) 2008-12-03 2008-12-03 Verfahren zur Kapselung einer elektronischen Anordnung
TW098137381A TWI488242B (zh) 2008-12-03 2009-11-04 封裝電子零件之方法
PL09756304T PL2279537T3 (pl) 2008-12-03 2009-11-18 Metoda hermetyzacji układu elektronicznego
KR1020107027853A KR101660817B1 (ko) 2008-12-03 2009-11-18 전자 장치를 캡슐화하는 방법
US12/996,716 US8460969B2 (en) 2008-12-03 2009-11-18 Method for encapsulating an electronic arrangement
PCT/EP2009/065393 WO2010063579A1 (de) 2008-12-03 2009-11-18 Verfahren zur kapselung einer elektronischen anordnung
CN200980132496.5A CN102132439B (zh) 2008-12-03 2009-11-18 封装电子装置的方法
EP09756304.3A EP2279537B1 (de) 2008-12-03 2009-11-18 Verfahren zur kapselung einer elektronischen anordnung
JP2011538934A JP6074141B2 (ja) 2008-12-03 2009-11-18 電子的装置のカプセル化方法
JP2016216894A JP6407940B2 (ja) 2008-12-03 2016-11-07 電子的装置のカプセル化方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008060113A DE102008060113A1 (de) 2008-12-03 2008-12-03 Verfahren zur Kapselung einer elektronischen Anordnung

Publications (1)

Publication Number Publication Date
DE102008060113A1 true DE102008060113A1 (de) 2010-07-29

Family

ID=41530580

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008060113A Withdrawn DE102008060113A1 (de) 2008-12-03 2008-12-03 Verfahren zur Kapselung einer elektronischen Anordnung

Country Status (9)

Country Link
US (1) US8460969B2 (https=)
EP (1) EP2279537B1 (https=)
JP (2) JP6074141B2 (https=)
KR (1) KR101660817B1 (https=)
CN (1) CN102132439B (https=)
DE (1) DE102008060113A1 (https=)
PL (1) PL2279537T3 (https=)
TW (1) TWI488242B (https=)
WO (1) WO2010063579A1 (https=)

Cited By (25)

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DE102009018518A1 (de) 2009-04-24 2010-10-28 Tesa Se Transparente Barrierelaminate
DE102009036970A1 (de) 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
WO2012019909A1 (de) 2010-08-13 2012-02-16 Tesa Se Verfahren zur kapselung einer elektronischen anordnung
WO2012076262A1 (de) 2010-12-10 2012-06-14 Tesa Se Klebmasse und verfahren zur kapselung einer elektronischen anordnung
DE102011080729A1 (de) 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige Haftklebemasse und Haftklebeband
DE102012202377A1 (de) 2011-10-21 2013-04-25 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
DE102011085034A1 (de) 2011-10-21 2013-04-25 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
DE102012206273A1 (de) 2012-04-17 2013-10-17 Tesa Se Vernetzbare Klebmasse mit Hart- und Weichblöcken als Permeantenbarriere
DE102012211335A1 (de) 2012-06-29 2014-01-02 Tesa Se Klebeband für die Kapselung einer organischen elektronischen Anordnung
DE102012219877A1 (de) 2012-08-24 2014-02-27 Tesa Se Haftklebemasse insbesondere zur Kapselung einer elektronischen Anordnung
DE102012224310A1 (de) 2012-12-21 2014-06-26 Tesa Se Gettermaterial enthaltendes Klebeband
WO2014095385A1 (de) 2012-12-21 2014-06-26 Tesa Se Verfahren zum entfernen von permeaten aus flächengebilden und klebeband dafür
DE102012224319A1 (de) 2012-12-21 2014-06-26 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102013202473A1 (de) 2013-02-15 2014-08-21 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102014200948A1 (de) 2014-01-20 2015-07-23 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102014207074A1 (de) 2014-04-11 2015-10-15 Tesa Se Klebeband für die Kapselung einer organischen elektronischen Anordnung
DE102014207792A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zum Lagern einer Dünnglasfolie
WO2015162012A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und verfahren zur lagerung von dünnglas
DE102014208111A1 (de) 2014-04-29 2015-10-29 Tesa Se Verfahren zur Herstellung einer Verklebung auf Permeat sensiblen Oberflächen
DE102014208109A1 (de) 2014-04-29 2015-10-29 Tesa Se Spaltbares Klebend mit dosierfähigen spaltbaren Flüssigklebstoff
DE102015202415A1 (de) * 2015-02-11 2016-08-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Klebstoff, Verfahren zur berührungslosen Temperaturmessung des Klebstoffs und Verfahren zur verbesserten Verbindung zweier Bauteile mit Klebstoff
DE102015212058A1 (de) 2015-06-29 2016-12-29 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
US9593264B2 (en) 2011-08-10 2017-03-14 Tesa Se Electrically conductive heat-activated adhesive compound
DE102016213840A1 (de) 2016-07-27 2018-02-01 Tesa Se Klebeband zur Verkapselung elektronischer Aufbauten
DE102018202545A1 (de) 2018-02-20 2019-08-22 Tesa Se Zusammensetzung zur Erzeugung einer Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung

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