DE102008052360B4 - Elektrische Verbindungsvorrichtung - Google Patents

Elektrische Verbindungsvorrichtung Download PDF

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Publication number
DE102008052360B4
DE102008052360B4 DE102008052360.7A DE102008052360A DE102008052360B4 DE 102008052360 B4 DE102008052360 B4 DE 102008052360B4 DE 102008052360 A DE102008052360 A DE 102008052360A DE 102008052360 B4 DE102008052360 B4 DE 102008052360B4
Authority
DE
Germany
Prior art keywords
contact
recess
test
rear end
inclined surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102008052360.7A
Other languages
German (de)
English (en)
Other versions
DE102008052360A8 (de
DE102008052360A1 (de
Inventor
Eichi Osato
Hidekazu MIURA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micronics Japan Co Ltd
Original Assignee
Micronics Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Publication of DE102008052360A1 publication Critical patent/DE102008052360A1/de
Publication of DE102008052360A8 publication Critical patent/DE102008052360A8/de
Application granted granted Critical
Publication of DE102008052360B4 publication Critical patent/DE102008052360B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Electrotherapy Devices (AREA)
DE102008052360.7A 2007-10-23 2008-10-20 Elektrische Verbindungsvorrichtung Active DE102008052360B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-275074 2007-10-23
JP2007275074A JP5113481B2 (ja) 2007-10-23 2007-10-23 接触子及びこれを用いる電気的接続装置

Publications (3)

Publication Number Publication Date
DE102008052360A1 DE102008052360A1 (de) 2009-04-30
DE102008052360A8 DE102008052360A8 (de) 2009-08-13
DE102008052360B4 true DE102008052360B4 (de) 2019-07-11

Family

ID=40490492

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008052360.7A Active DE102008052360B4 (de) 2007-10-23 2008-10-20 Elektrische Verbindungsvorrichtung

Country Status (6)

Country Link
US (1) US7753693B2 (https=)
JP (1) JP5113481B2 (https=)
KR (1) KR101001642B1 (https=)
CN (1) CN101419244B (https=)
DE (1) DE102008052360B4 (https=)
TW (1) TW200924314A (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5906579B2 (ja) * 2011-04-08 2016-04-20 セイコーエプソン株式会社 端子モジュールおよび記録装置
CN104769442B (zh) * 2012-11-07 2018-02-02 欧姆龙株式会社 连接端子和使用该连接端子的导通检查设备
TWI657362B (zh) * 2015-03-23 2019-04-21 群創光電股份有限公司 觸控裝置
US9343830B1 (en) * 2015-06-08 2016-05-17 Xcerra Corporation Integrated circuit chip tester with embedded micro link
WO2018003507A1 (ja) * 2016-06-28 2018-01-04 株式会社日本マイクロニクス 電気的接続装置及び接触子
WO2020022085A1 (ja) * 2018-07-27 2020-01-30 日置電機株式会社 測定装置
CN111060802A (zh) * 2019-11-28 2020-04-24 苏州韬盛电子科技有限公司 用于大电流测试以及高频测试的金属接触器
WO2021207153A1 (en) * 2020-04-07 2021-10-14 Smiths Interconnect Americas, Inc. Test socket for semiconductor integrated circuits
CN115877170A (zh) * 2021-09-27 2023-03-31 史密斯互连美洲公司 具有擦拭触件的测试插座的系统和方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW302022U (en) * 1996-09-20 1997-04-01 Tian-Yi Chen Conducting interface apparatus for testing jig of integrated circuit
JP2003123874A (ja) 2001-10-16 2003-04-25 Micronics Japan Co Ltd 接触子及びその製造方法並びに電気的接続装置
US20060183356A1 (en) 2003-02-17 2006-08-17 Kabushiki Kaisha Nihon Micronics Electrical connector
US20070272924A1 (en) 2006-05-29 2007-11-29 Tangerine System Co., Ltd. Integrated circuit (ic) testing device with conduction interface

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5888075A (en) * 1997-02-10 1999-03-30 Kabushiki Kaisha Nihon Micronics Auxiliary apparatus for testing device
JP2001035578A (ja) * 1999-05-14 2001-02-09 Mitsubishi Electric Corp 電子回路装置のテスト用ソケット及びその製造方法
JP4592292B2 (ja) * 2004-01-16 2010-12-01 株式会社日本マイクロニクス 電気的接続装置
EP1753100A4 (en) * 2004-06-03 2008-05-07 Nihon Micronics Kk CONTACTOR AND ELECTRICAL CONNECTOR
WO2006114895A1 (ja) * 2005-04-21 2006-11-02 Kabushiki Kaisha Nihon Micronics 電気的接続装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW302022U (en) * 1996-09-20 1997-04-01 Tian-Yi Chen Conducting interface apparatus for testing jig of integrated circuit
JP2003123874A (ja) 2001-10-16 2003-04-25 Micronics Japan Co Ltd 接触子及びその製造方法並びに電気的接続装置
US20060183356A1 (en) 2003-02-17 2006-08-17 Kabushiki Kaisha Nihon Micronics Electrical connector
US20070272924A1 (en) 2006-05-29 2007-11-29 Tangerine System Co., Ltd. Integrated circuit (ic) testing device with conduction interface

Also Published As

Publication number Publication date
JP2009103563A (ja) 2009-05-14
DE102008052360A8 (de) 2009-08-13
TW200924314A (en) 2009-06-01
TWI376841B (https=) 2012-11-11
DE102008052360A1 (de) 2009-04-30
KR101001642B1 (ko) 2010-12-17
CN101419244B (zh) 2012-10-10
US7753693B2 (en) 2010-07-13
CN101419244A (zh) 2009-04-29
KR20090041315A (ko) 2009-04-28
US20090104795A1 (en) 2009-04-23
JP5113481B2 (ja) 2013-01-09

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