DE102007048181A1 - Funktionsplatte und Abdeckteil - Google Patents

Funktionsplatte und Abdeckteil Download PDF

Info

Publication number
DE102007048181A1
DE102007048181A1 DE102007048181A DE102007048181A DE102007048181A1 DE 102007048181 A1 DE102007048181 A1 DE 102007048181A1 DE 102007048181 A DE102007048181 A DE 102007048181A DE 102007048181 A DE102007048181 A DE 102007048181A DE 102007048181 A1 DE102007048181 A1 DE 102007048181A1
Authority
DE
Germany
Prior art keywords
attached
substrate
cover
back surface
panel according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102007048181A
Other languages
German (de)
English (en)
Inventor
Satoshi Takeshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of DE102007048181A1 publication Critical patent/DE102007048181A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
DE102007048181A 2006-10-03 2007-10-02 Funktionsplatte und Abdeckteil Withdrawn DE102007048181A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006272070A JP5028060B2 (ja) 2006-10-03 2006-10-03 パフォーマンスボードおよびカバー部材
JP2006-272070 2006-10-03

Publications (1)

Publication Number Publication Date
DE102007048181A1 true DE102007048181A1 (de) 2008-04-10

Family

ID=39154887

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102007048181A Withdrawn DE102007048181A1 (de) 2006-10-03 2007-10-02 Funktionsplatte und Abdeckteil

Country Status (5)

Country Link
US (1) US7619426B2 (ko)
JP (1) JP5028060B2 (ko)
KR (1) KR101379413B1 (ko)
DE (1) DE102007048181A1 (ko)
TW (1) TW200829936A (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010041317A1 (ja) * 2008-10-09 2010-04-15 株式会社アドバンテスト インターフェイス部材、テスト部ユニットおよび電子部品試験装置
JP2010101834A (ja) * 2008-10-27 2010-05-06 Yokogawa Electric Corp 半導体試験装置
JP5351071B2 (ja) * 2009-02-24 2013-11-27 株式会社アドバンテスト テスト部ユニット、テストヘッドおよび電子部品試験装置
US8203354B2 (en) * 2009-09-25 2012-06-19 Intersil Americas, Inc. System for testing electronic components
JP2011220924A (ja) * 2010-04-13 2011-11-04 Advantest Corp 試験装置および接続装置
JP2011242339A (ja) * 2010-05-20 2011-12-01 Advantest Corp テストヘッド、試験ボードおよび試験装置
WO2014001528A1 (en) 2012-06-29 2014-01-03 Eles Semiconductor Equipment S.P.A. Test board with local thermal conditioning elements
ITMI20131086A1 (it) * 2013-06-28 2014-12-29 Eles Semiconductor Equipment S P A Scheda di test con elementi di condizionamento termico locali
ITMI20121157A1 (it) * 2012-06-29 2013-12-30 Eles Semiconductor Equipment S P A Test di dispositivi elettronici con riscaldatori disposti tra scheda di test e dispositivi elettronici da testare
US10241146B2 (en) * 2017-05-01 2019-03-26 Advantest Corporation Test system and method
US20190011497A1 (en) * 2017-07-09 2019-01-10 Texas Instruments Incorporated Test Fixture with Sintered Connections Between Mother Board and Daughter Board
CN115826640A (zh) * 2021-09-17 2023-03-21 致茂电子股份有限公司 温度控制系统、温度控制方法以及具备该系统的影像传感器测试设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07260879A (ja) 1994-03-25 1995-10-13 Advantest Corp Ｉｃ試験装置のテストヘッド用インターフェイス
JPH0943312A (ja) * 1995-05-23 1997-02-14 Advantest Corp Ｉｃハンドラのテスト部
JP2000147053A (ja) 1998-11-05 2000-05-26 Advantest Corp Ｉｃ試験装置
JP4041604B2 (ja) 1998-11-10 2008-01-30 株式会社アドバンテスト 電子部品試験装置
US6420885B1 (en) * 2000-02-10 2002-07-16 Xilinx, Inc. System and apparatus for low-temperature semiconductor device testing
KR100448913B1 (ko) * 2002-01-07 2004-09-16 삼성전자주식회사 반도체 디바이스 테스트 시스템
US6894523B2 (en) * 2003-07-01 2005-05-17 Intel Corporation System and method for testing semiconductor devices
JP4254438B2 (ja) * 2003-09-03 2009-04-15 横河電機株式会社 テストボード装置
JPWO2006064546A1 (ja) * 2004-12-14 2008-06-12 株式会社アドバンテスト コンタクトピン、それを用いたプローブカード及び電子部品試験装置

Also Published As

Publication number Publication date
KR20080031137A (ko) 2008-04-08
US7619426B2 (en) 2009-11-17
TW200829936A (en) 2008-07-16
JP5028060B2 (ja) 2012-09-19
JP2008089468A (ja) 2008-04-17
KR101379413B1 (ko) 2014-04-01
US20080231309A1 (en) 2008-09-25

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Legal Events

Date Code Title Description
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20120501