JP5028060B2 - パフォーマンスボードおよびカバー部材 - Google Patents
パフォーマンスボードおよびカバー部材 Download PDFInfo
- Publication number
- JP5028060B2 JP5028060B2 JP2006272070A JP2006272070A JP5028060B2 JP 5028060 B2 JP5028060 B2 JP 5028060B2 JP 2006272070 A JP2006272070 A JP 2006272070A JP 2006272070 A JP2006272070 A JP 2006272070A JP 5028060 B2 JP5028060 B2 JP 5028060B2
- Authority
- JP
- Japan
- Prior art keywords
- cover member
- substrate
- performance board
- back surface
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
Description
Claims (9)
- 半導体試験装置のテストヘッドに装着されて、被試験デバイスを実装されるパフォーマンスボードであって、
基板と、
前記基板の表面に装着されて被試験デバイスが実装されるソケットと、
前記基板に形成された配線を介して前記ソケットに電気的に接続され、前記基板の裏面に装着されてテストヘッド側に結合されるコネクタと、
前記基板の裏面に装着され前記基板の曲げ剛性を補うスティフナと、
前記基板において前記ソケットが装着された領域の裏面で前記スティフナに対して固定され、前記基板の裏面における当該領域を包囲して外部から熱的に遮断するカバー部材と
を備えるパフォーマンスボード。 - 前記基板は、前記ソケットを装着された領域の前記基板の曲げ剛性を補う、前記基板の裏面に装着された補強板を備え、
前記カバー部材は、前記パフォーマンスボードに装着された状態で一方の面を前記補強板に当接させるスペーサをその内部に有し、前記パフォーマンスボードに対して脱着可能に螺着されて前記補強板に対して固定され、
前記カバー部材、前記補強板および前記スペーサは、同軸に配されて互いに連通し、前記カバー部材の内部に乾燥空気を注入する注入孔を有する請求項1に記載のパフォーマンスボード。 - 前記カバー部材は、前記スティフナに形成された陥没部への圧入により固定される請求項1または2に記載のパフォーマンスボード。
- 前記カバー部材は、弾性材料により形成された弾性部材を介して前記スティフナに対して気密に装着される請求項1から請求項3までのいずれか一項に記載のパフォーマンスボード。
- 前記カバー部材は、前記スティフナに対して断熱部材を介して装着される請求項1から請求項4までのいずれか一項に記載のパフォーマンスボード。
- 前記カバー部材は、前記基板から離間した状態で固定される請求項1から請求項5までのいずれか一項に記載のパフォーマンスボード。
- 前記カバー部材は、その内部に乾燥空気を注入する注入孔を有する請求項1から請求項6までのいずれか一項に記載のパフォーマンスボード。
- 前記カバー部材は、その内部に加熱手段を更に備える請求項1から請求項7までのいずれか一項に記載のパフォーマンスボード。
- 基板、前記基板の表面に装着されて被試験デバイスを実装されるソケット、前記基板に形成された配線を介して前記ソケットに電気的に接続され、前記基板の裏面に装着されてテストヘッド側に結合されるコネクタ、および、前記基板の裏面に装着され前記基板の曲げ剛性を補うスティフナを有する半導体試験装置のパフォーマンスボードにおいて前記スティフナに対して固定され、前記基板において前記ソケットが装着された領域において、前記基板の裏面における当該領域の裏面を包囲して外部から熱的に遮断するカバー部材。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006272070A JP5028060B2 (ja) | 2006-10-03 | 2006-10-03 | パフォーマンスボードおよびカバー部材 |
US11/864,928 US7619426B2 (en) | 2006-10-03 | 2007-09-29 | Performance board and cover member |
TW096136770A TW200829936A (en) | 2006-10-03 | 2007-10-01 | Performance board and cover member |
KR1020070099448A KR101379413B1 (ko) | 2006-10-03 | 2007-10-02 | 퍼포먼스 보드 및 커버 부재 |
DE102007048181A DE102007048181A1 (de) | 2006-10-03 | 2007-10-02 | Funktionsplatte und Abdeckteil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006272070A JP5028060B2 (ja) | 2006-10-03 | 2006-10-03 | パフォーマンスボードおよびカバー部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008089468A JP2008089468A (ja) | 2008-04-17 |
JP5028060B2 true JP5028060B2 (ja) | 2012-09-19 |
Family
ID=39154887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006272070A Active JP5028060B2 (ja) | 2006-10-03 | 2006-10-03 | パフォーマンスボードおよびカバー部材 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7619426B2 (ja) |
JP (1) | JP5028060B2 (ja) |
KR (1) | KR101379413B1 (ja) |
DE (1) | DE102007048181A1 (ja) |
TW (1) | TW200829936A (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101104288B1 (ko) * | 2008-10-09 | 2012-01-11 | 가부시키가이샤 아드반테스트 | 인터페이스 부재, 테스트부 유닛 및 전자 부품 시험 장치 |
JP2010101834A (ja) * | 2008-10-27 | 2010-05-06 | Yokogawa Electric Corp | 半導体試験装置 |
JP5351071B2 (ja) * | 2009-02-24 | 2013-11-27 | 株式会社アドバンテスト | テスト部ユニット、テストヘッドおよび電子部品試験装置 |
US8203354B2 (en) * | 2009-09-25 | 2012-06-19 | Intersil Americas, Inc. | System for testing electronic components |
JP2011220924A (ja) * | 2010-04-13 | 2011-11-04 | Advantest Corp | 試験装置および接続装置 |
JP2011242339A (ja) * | 2010-05-20 | 2011-12-01 | Advantest Corp | テストヘッド、試験ボードおよび試験装置 |
WO2014001528A1 (en) | 2012-06-29 | 2014-01-03 | Eles Semiconductor Equipment S.P.A. | Test board with local thermal conditioning elements |
ITMI20121157A1 (it) * | 2012-06-29 | 2013-12-30 | Eles Semiconductor Equipment S P A | Test di dispositivi elettronici con riscaldatori disposti tra scheda di test e dispositivi elettronici da testare |
ITMI20131086A1 (it) * | 2013-06-28 | 2014-12-29 | Eles Semiconductor Equipment S P A | Scheda di test con elementi di condizionamento termico locali |
US10241146B2 (en) * | 2017-05-01 | 2019-03-26 | Advantest Corporation | Test system and method |
US20190011497A1 (en) * | 2017-07-09 | 2019-01-10 | Texas Instruments Incorporated | Test Fixture with Sintered Connections Between Mother Board and Daughter Board |
CN115826640A (zh) * | 2021-09-17 | 2023-03-21 | 致茂电子股份有限公司 | 温度控制系统、温度控制方法以及具备该系统的影像传感器测试设备 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07260879A (ja) | 1994-03-25 | 1995-10-13 | Advantest Corp | Ic試験装置のテストヘッド用インターフェイス |
JPH0943312A (ja) * | 1995-05-23 | 1997-02-14 | Advantest Corp | Icハンドラのテスト部 |
JP2000147053A (ja) | 1998-11-05 | 2000-05-26 | Advantest Corp | Ic試験装置 |
JP4041604B2 (ja) | 1998-11-10 | 2008-01-30 | 株式会社アドバンテスト | 電子部品試験装置 |
US6420885B1 (en) * | 2000-02-10 | 2002-07-16 | Xilinx, Inc. | System and apparatus for low-temperature semiconductor device testing |
KR100448913B1 (ko) * | 2002-01-07 | 2004-09-16 | 삼성전자주식회사 | 반도체 디바이스 테스트 시스템 |
US6894523B2 (en) * | 2003-07-01 | 2005-05-17 | Intel Corporation | System and method for testing semiconductor devices |
JP4254438B2 (ja) * | 2003-09-03 | 2009-04-15 | 横河電機株式会社 | テストボード装置 |
WO2006064546A1 (ja) * | 2004-12-14 | 2006-06-22 | Advantest Corporation | コンタクトピン、それを用いたプローブカード及び電子部品試験装置 |
-
2006
- 2006-10-03 JP JP2006272070A patent/JP5028060B2/ja active Active
-
2007
- 2007-09-29 US US11/864,928 patent/US7619426B2/en active Active
- 2007-10-01 TW TW096136770A patent/TW200829936A/zh unknown
- 2007-10-02 KR KR1020070099448A patent/KR101379413B1/ko active IP Right Grant
- 2007-10-02 DE DE102007048181A patent/DE102007048181A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE102007048181A1 (de) | 2008-04-10 |
US20080231309A1 (en) | 2008-09-25 |
US7619426B2 (en) | 2009-11-17 |
JP2008089468A (ja) | 2008-04-17 |
TW200829936A (en) | 2008-07-16 |
KR101379413B1 (ko) | 2014-04-01 |
KR20080031137A (ko) | 2008-04-08 |
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