DE102006017056A1 - Vorrichtung und Verfahren zum Reinigen eines Halbleiterwafers - Google Patents

Vorrichtung und Verfahren zum Reinigen eines Halbleiterwafers Download PDF

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Publication number
DE102006017056A1
DE102006017056A1 DE102006017056A DE102006017056A DE102006017056A1 DE 102006017056 A1 DE102006017056 A1 DE 102006017056A1 DE 102006017056 A DE102006017056 A DE 102006017056A DE 102006017056 A DE102006017056 A DE 102006017056A DE 102006017056 A1 DE102006017056 A1 DE 102006017056A1
Authority
DE
Germany
Prior art keywords
wafer
organic solvent
cleaning
cleaning device
mixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102006017056A
Other languages
German (de)
English (en)
Inventor
Hun-Jung Suwon Yi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of DE102006017056A1 publication Critical patent/DE102006017056A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H33/00—Other toys
    • A63H33/16—Models made by folding paper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/18—Cleaning before device manufacture, i.e. Begin-Of-Line process by combined dry cleaning and wet cleaning
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H33/00—Other toys
    • A63H33/04—Building blocks, strips, or similar building parts
    • A63H33/14—Building blocks, strips, or similar building parts specially adapted to be assembled by adhesive or cement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE102006017056A 2005-04-13 2006-04-11 Vorrichtung und Verfahren zum Reinigen eines Halbleiterwafers Withdrawn DE102006017056A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050030806A KR100696378B1 (ko) 2005-04-13 2005-04-13 반도체 기판을 세정하는 장치 및 방법
KR10-2005-0030806 2005-04-13

Publications (1)

Publication Number Publication Date
DE102006017056A1 true DE102006017056A1 (de) 2006-10-26

Family

ID=37068116

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102006017056A Withdrawn DE102006017056A1 (de) 2005-04-13 2006-04-11 Vorrichtung und Verfahren zum Reinigen eines Halbleiterwafers

Country Status (4)

Country Link
US (1) US20060231125A1 (https=)
JP (1) JP2006295194A (https=)
KR (1) KR100696378B1 (https=)
DE (1) DE102006017056A1 (https=)

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TWM352764U (en) * 2008-06-19 2009-03-11 Scientech Corp Constant temperature gas/liquid mixture generating system for using in wafer drying process
JPWO2010103893A1 (ja) * 2009-03-13 2012-09-13 株式会社Adeka 金属含有薄膜の製造方法における残存水分子除去プロセス及びパージソルベント
JP5234985B2 (ja) * 2009-03-31 2013-07-10 大日本スクリーン製造株式会社 基板処理装置及び基板処理方法
US20120103371A1 (en) * 2010-10-28 2012-05-03 Lam Research Ag Method and apparatus for drying a semiconductor wafer
US20120260947A1 (en) * 2011-04-12 2012-10-18 Satoshi Kaneko Substrate cleaning apparatus, substrate cleaning method, and computer-readable recording medium having substrate cleaning program recorded therein
US20120260517A1 (en) * 2011-04-18 2012-10-18 Lam Research Corporation Apparatus and Method for Reducing Substrate Pattern Collapse During Drying Operations
JP2015062956A (ja) * 2012-09-19 2015-04-09 株式会社荏原製作所 研磨装置
US9748120B2 (en) 2013-07-01 2017-08-29 Lam Research Ag Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus
JP6131162B2 (ja) 2012-11-08 2017-05-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6317837B2 (ja) * 2012-11-08 2018-04-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6455962B2 (ja) 2013-03-18 2019-01-23 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6302700B2 (ja) 2013-03-18 2018-03-28 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6351993B2 (ja) 2013-03-18 2018-07-04 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6181438B2 (ja) * 2013-06-24 2017-08-16 株式会社荏原製作所 基板保持装置および基板洗浄装置
JP2015092539A (ja) * 2013-09-30 2015-05-14 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
KR102099889B1 (ko) * 2013-12-27 2020-05-18 세메스 주식회사 기판처리장치 및 방법
KR102267508B1 (ko) * 2014-02-27 2021-06-22 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
JP6376553B2 (ja) * 2014-03-26 2018-08-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6270268B2 (ja) * 2014-02-27 2018-01-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6270270B2 (ja) * 2014-03-17 2018-01-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6376554B2 (ja) * 2014-03-26 2018-08-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102308587B1 (ko) * 2014-03-19 2021-10-01 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
JP6380887B2 (ja) * 2014-03-19 2018-08-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6418554B2 (ja) * 2015-06-10 2018-11-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6593920B2 (ja) * 2015-08-18 2019-10-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6551203B2 (ja) * 2015-12-11 2019-07-31 株式会社デンソー 洗浄ノズル
TWI767920B (zh) * 2016-07-15 2022-06-21 美商應用材料股份有限公司 乾燥高深寬比特徵
JP6881922B2 (ja) * 2016-09-12 2021-06-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
EP3727711B1 (en) 2018-04-23 2021-07-28 Carbon, Inc. Method and resin extractor for additive manufacturing
EP3817870B1 (en) * 2018-07-06 2024-04-17 Shellback Semiconductor Technology, LLC Systems and methods for a spray measurement apparatus
KR102179717B1 (ko) * 2019-05-17 2020-11-17 무진전자 주식회사 플라즈마와 증기를 이용한 건식 세정 장치
KR102178593B1 (ko) * 2019-05-17 2020-11-16 무진전자 주식회사 플라즈마와 증기를 이용한 건식 세정 방법
KR102772734B1 (ko) 2019-05-20 2025-02-28 삼성전자주식회사 포토 레지스트 제거 장치 및 반도체 소자 제조 장치
CN112146359B (zh) * 2020-09-25 2022-03-11 长江存储科技有限责任公司 干燥装置、干燥方法、清洗干燥系统及清洗干燥方法
ES3030639T3 (en) * 2020-10-09 2025-07-01 Carbon Inc Vapor spin cleaning of additively manufactured parts
US12605899B2 (en) 2022-04-13 2026-04-21 Carbon, Inc. Centrifugal separator for cleaning additively manufactured objects with adjustable mount

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JP3247270B2 (ja) * 1994-08-25 2002-01-15 東京エレクトロン株式会社 処理装置及びドライクリーニング方法
JP3556043B2 (ja) * 1996-03-19 2004-08-18 株式会社荏原製作所 基板乾燥装置
US6248168B1 (en) * 1997-12-15 2001-06-19 Tokyo Electron Limited Spin coating apparatus including aging unit and solvent replacement unit
US6318385B1 (en) * 1998-03-13 2001-11-20 Semitool, Inc. Micro-environment chamber and system for rinsing and drying a semiconductor workpiece
US6634806B2 (en) * 2000-03-13 2003-10-21 Tokyo Electron Limited Substrate processing method and substrate processing apparatus
US6589359B2 (en) * 2000-07-11 2003-07-08 Tokyo Electron Limited Cleaning method and cleaning apparatus for substrate
US6550988B2 (en) * 2000-10-30 2003-04-22 Dainippon Screen Mfg., Co., Ltd. Substrate processing apparatus
KR100416590B1 (ko) * 2001-01-13 2004-02-05 삼성전자주식회사 반도체 웨이퍼 세정장치 및 이를 이용한 웨이퍼 세정방법

Also Published As

Publication number Publication date
KR20060108429A (ko) 2006-10-18
JP2006295194A (ja) 2006-10-26
US20060231125A1 (en) 2006-10-19
KR100696378B1 (ko) 2007-03-19

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8139 Disposal/non-payment of the annual fee