CN87104005A - 无源电气组件 - Google Patents
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Abstract
一种适用于SMD技术的无源电气组件,它有一个圆柱形支承零件或一个呈直角平行六面体形状的支承零件,它的两端还有电连接元件,该连接元件以管状形式环绕着支承零件,而不覆盖支承零件的两个端面。
Description
本发明涉及一种无源电气组件,它适用于SMD技术,有一个圆柱形的支承零件或呈直角平行六面体形的支承零件,并在其两端装有电连接元件。
众所周知,一个具有例如圆柱形支承零件的无源电气组件,其连接帽位于该支承零件的端面上,并有连接导线焊在这些连接帽上(图1)。
作为现代装配这些组件的方法,运用将组件直接焊在印刷电路板的导体印制线上的可能性而不再采用连接导线。上述技术在所谓“表面装配器件”(Surface Mounted Device即SMD)领域里得到了越来越广泛的应用。
适用于SMD技术的组件,特别象电阻和电容,总的说来按两种不同的结构制造,即所谓的芯片组件和所谓的MELF组件。芯片组件一般有呈直角平行六面体形的支承零件,该支承零件具有宜于焊接的端面。MELF组件即“金属电极表面焊接”(Metal Electrode Face Bonding)组件起源于具有连接帽的圆柱形支承零件,其连接导线被省去了,这些连接帽本身通过电镀使其表面变得宜于焊接,并使MELF组件通过上述的连接帽直接焊到印刷电路板的导体印制线上去(图2)。
SMD技术的最大优点是:它能在印刷电路板上获得很高的组件封装密度。为了使密度不断提高,就需要有适用于SMD技术的尺寸越来越小的组件。
目前,对前面序言部分提到的几类无源组件的小型化有两方面的限制:首先,支承零件和连接触头由于机械上的因而也就是制造上的原因不能随意做小。其次,这样的组件不能随意做小是由于对电气特性的要求所致。
本发明的目的是改进本文开头一段所提及的无源组件,其方法是:采用相同尺寸的组件而得到电气特性的改进,或者将组件的长度减小而维持其电气性不变。
按照本发明的构思,这个目的是这样达到的:使连接元件以管状形式环绕着支承零件的两端,而又不复盖该支承零件的两个端面。
根据按照本发明作成的该组件的一个更有利的实施例,其连接元件使支承零件的两端面呈完全自由状态。由此产生的优点是:可以采用很容易制造的金属管来作连接元件,这些金属管可以作为套在支承零件上的套筒进行滑动并可以焊在支承零件上。到目前为止,熟悉这项技术的人们已经认定:对支承零件上的电功能层,例如电阻层,借助于密封在电阻体两端上的、呈端部联接帽形式的连接元件而保护,这一点在所谓的MELF组件、特别是在薄膜电阻中是绝对必要的。人们惊奇地发现:对出现在支承零件两个端面上的电阻层进行足够的保护已经可以借助一个金属层来实现,这个金属层可采用电镀一类的方法得到,并且必须在有了连接元件之后还应设法将金属层附到连接元件上以便可在连接元件之上附着一层焊料。因为电阻层是一个导电层,所以,随后电镀的各层均可以附到它上面去。
按照依本发明做成的该组件的更有利的实施例,厚膜连接元件是通过一种含有金属颗粒的一悬浮液制备到支承零件上的,或者采用电镀方法,在支承零件上制成薄膜连接元件。与此相关的优点是:可以以所谓微型组件(micro components)所具有的高精度来制造微小尺寸的连接元件。这种元件的长度为2毫米的量级,直径为0.8毫米。
按照依据本发明做成的无源组件的更有利的实施例,连接元件在支承零件的棱边上绕着其端面布置,而使端面的里边区域处于自由状态。这样做的优点,特别是当其使用金属套筒作连接元件时的优点是:金属套筒可以预先制做,使其具有可以在一端稍微形成凸缘的棱边。
当套筒与支承零件作接触配合时,其优点在于,一端稍微起凸缘的金属套筒的棱边起到支承零件的支座(abutment)作用,因此使得支承零件不能从金属套筒里滑脱。然而,也可以让尚未使棱边在一端稍微起凸缘的金属套筒先在支承零件上滑过,而棱边仅在接触配合的过程中被变形,从而以这样的方式环绕着支承零件的棱边,即:使支承零件的端面的里边区域保持自由状态。另外的优点是:将具有预制的稍微起凸缘的棱边的金属套筒用来与支承零件作接触配合,而金属套筒的稍微起凸缘的棱边在接触配合的过程中借助于沿支承零件方向的镦粗或挤压被再次变形。采用这种方法,在制造特别象陶瓷支承零件期间出现的、及其制造过程所形成的那些长度公差可以被补偿。
本发明的一个特殊优点是:当组件的长度给定时,与端面连接元件为连接帽形式的组件比起来,在本发明的情况下,支承零件上连接元件占据区以外的区域将具有较长的尺寸。在按照本发明制作的连接元件结构中,由于原有连接元件用来复盖支承零件端面的那部分被省去了,所以其连接帽的底部的壁厚可被算作处在连接元件之间的自由长度之用,因此具有同样组件尺寸的支承零件的自由长度,至少能多得到相当于两倍连接帽底部厚度的尺寸。
这是非常特殊的优点,特别适用于制造圆柱形薄膜电阻。薄膜电阻的金属层表面可以通过激光或研磨片盘之类手段切割螺旋线来调节达到所需要的电阻值。因为,与采用连接帽作连接元件的、具有相同组件总长度的已知电阻相比,采用按照本发明的连接元件时,其连接元件之间的自由长度要长些,所以可得到较大的区域供调整电阻之用。在制作高阻值薄膜电阻时,随调节过程而制造的螺旋线的数量起到重要作用。
本发明的实施例由下列附图表示,其中:
图1和图2表示先有技术中的无源圆柱形组件,
图3和图4是本发明中具有各种形状的连接元件的无源电气组件的剖视图,
图5表示图4的连接元件的细节,
图6和图7则表示由图4所示的由接触配合过程所决定的不同形式连接元件的细节,
图8是对按照本发明制作成的薄膜电阻的细节的图解式剖面图。
图1和图2表示先有技术中的无源电气组件,它具有圆柱形支承零件1和装在1上的两个端面上的呈金属帽形状的连接元件3。
图1所示的组件包括位于连接元件3上的连接导线5,连接导线5是弯曲的,并焊在印刷线路板上用来组装这些组件的各个孔中。
图2表示一个MELF组件,其中只有金属帽充做连接元件3,它的帽子被直接焊在印刷线路板线路上用来组装这些组件。
图3至8是本发明无源电气组件的剖视图。
图3表示一个具有圆柱形支承零件1的无源电气组件,其支承零件1装配有连接元件7,它呈管状形式环绕着支承零件1,并使支承零件1的端面9处于完全自由状态。上述呈金属套管形状的连接元件7可以在支承零件1上滑动并焊在它上面,但是它们也可以另外的方式成形,如通过含有金属颗粒的悬浮液而形成厚膜接触,或由电镀沉积获得薄膜接触。从比较图2和图3可以看到,当省去原有的连接元件的连接帽底部厚度时,则该连接帽的底部的壁厚可用作连接元件7之间的自由长度,因此在保持该组件的尺寸不变的情况下,支承零件1的自由长度a就增加了至少为该连接帽底部厚度两倍的尺寸。正如上面已经提到的,这样就有一个优点,它特别适用于制造薄膜电阻,即:在采用对附在该支承零件1上的电阻层切割螺旋线的方法来决定阻值时,这就得到了较大的区域供调整阻值之用。这一点在制造高阻值薄膜电阻时更为重要。
按照本发明,在维持组件的尺寸不变的情况下,这些组件的电学特性可加以大大地改善,这一点是通过与原有的组件相比较,用记录在下述表格中的电阻值RN的比较数值来说明的。此外,从该表格还可明显看出,在小体积电阻中,按照本发明制作的电阻的阻值RN的增长超过正比例关系。这表明具有按本发明制作的连接元件的组件的一个重要优点。
表:
*从1000Ω的相同阻值薄膜电阻以相同的螺距为0.2毫米、切割线宽度为0.08毫米方式制作。
图4以及图5的细节表明按照本发明制作的具有连接元件77的无源电气组件,连接元件77与图3所示连接元件7的不同在于:77在端面9的棱边99处环绕着端面9,使端面9的里边区域呈自由状态。例如,预制的具有棱边777的金属套筒在这种结构中被用作连接元件77,这里,棱边777在一侧稍微起凸缘。这样做的优点是:在一侧稍微起凸缘的棱边777成为支承零件1的支座。当具有在一侧起凸缘棱边的金属套筒被用做连接元件时,就获得另一个优点,即在接触配合过程中可对陶瓷支承零件制造时的长度公差进行补偿。
图6和图7是对不同长度的支承零件1,连接元件77与其相适配时的图解细节。
图6示出了一种具有最大长度的支承零件1的组件,其中连接元件77的起凸缘棱边777在接触配合过程中被变形,结果由此形成的接触配合好的组件的总长度与支承零件1的长度相当。
图7示出了具有最小长度支承零件1的一种组件,其中连接元件77的起凸缘棱边777在接触配合过程中的变形与图6的起凸缘棱边777的变形相比要小些,结果作为最终的产品,尽管在支承零件1短一些的情况下,还是得到了先前给定的该组件的总长度。
图8示出了采用本发明的连接元件制作成的薄膜电阻的细节。
呈电阻层11形式的电功能层在具有起凸缘棱边777的两个连接元件77之间的区域内,被涂上一层诸如绝缘合成树脂一类的绝缘层13。然后,当为连接元件77、777提供可焊接涂层15、17时(按照现有技术,这一点要借助由诸如电镀铜层15和诸如锡或铅-锡一类的焊料层17组成的多层结构来实现),支承零件1未被连接元件77、777复盖的端面9也被电镀,因为位于端面9上的电阻层11也是导电的。连续涂层15、17牢牢地密封了功能层11使其不受环境的影响,而复盖支承零件端面的连接元件底部所起的附加保护作用并非为获得高质量组件,例如获得具有良好抗老化性能的组件所必需的。
薄膜电阻的制造已经通过例子做了叙述。然而,这些连接元件也可用来制造具有圆柱形支承零件或具有直角平行六面体形支承零件的电容和电感。
Claims (12)
1、一种无源电气组件,它适用于SMD技术,并具有圆柱形支承零件或具有直角平行六面体形支承零件,在支承零件的两端还具有连接元件,其特征在于:连接元件(77、777)呈管状环绕着支承零件(1)的两端,并且不复盖该支承零件的端面(9)。
2、根据权利要求1所述的无源电气组件,其特征在于:连接元件(77、777)使支承零件(1)的端面(9)处于完全自由状态。
3、根据权利要求1所述的无源电气组件,其特征在于:连接元件(77、777)在支承零件(1)的棱边(99)处环绕着其端面(9),并且不复盖端面(9)里面的区域。
4、根据至少上述权利要求之一所述的无源电气组件,其特征在于:连接元件(77、777)是以单独地制造的圆柱形金属套筒形成的。
5、根据至少上述权利要求之一所述的无源电气组件,其特征在于:厚膜连接元件(77、777)是通过含有金属颗粒的悬浮液而制备到支承零件上去的。
6、根据至少上述权利要求之一所述的无源电气组件,其特征在于:电镀薄膜连接元件(77、777)被提供在支承零件(1)之上。
7、根据权利要求1~6所述的无源电气组件,其特征在于:支承零件由电绝缘(electrically insulating)陶瓷组成。
8、根据权利要求1~6所述的无源电气组件,其特征在于:支承零件(1)由绝缘(dielectric)陶瓷组成。
9、根据权利要求1~6所述的无源电气组件,其特征在于:支承零件(1)由铁氧体组成。
10、根据权利要求7所述的无源电气组件,其特征在于:它是一个电阻。
11、根据权利要求8所述的无源电气组件,其特征在于:它是一个电容。
12、根据权利要求9所述的无源电气组件,其特征在于:它是一个电感。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEP3619212.0 | 1986-06-07 | ||
DE19863619212 DE3619212A1 (de) | 1986-06-07 | 1986-06-07 | Passives elektrisches bauelement |
Publications (2)
Publication Number | Publication Date |
---|---|
CN87104005A true CN87104005A (zh) | 1988-01-13 |
CN1009686B CN1009686B (zh) | 1990-09-19 |
Family
ID=6302520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN87104005A Expired CN1009686B (zh) | 1986-06-07 | 1987-06-04 | 无源电气元件 |
Country Status (9)
Country | Link |
---|---|
US (1) | US4984130A (zh) |
EP (1) | EP0249277B1 (zh) |
JP (1) | JPS62293601A (zh) |
KR (1) | KR880000989A (zh) |
CN (1) | CN1009686B (zh) |
AT (1) | ATE88049T1 (zh) |
AU (1) | AU611082B2 (zh) |
CA (1) | CA1274590A (zh) |
DE (2) | DE3619212A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109961936A (zh) * | 2017-12-26 | 2019-07-02 | 三星电机株式会社 | 片式电子组件 |
CN113301732A (zh) * | 2021-05-28 | 2021-08-24 | 西安微电子技术研究所 | 一种无引线陶瓷封装元器件的焊接装置及方法 |
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JPH0327031U (zh) * | 1989-07-26 | 1991-03-19 | ||
DE4027501C2 (de) * | 1990-08-30 | 1995-06-22 | Quante Ag | Abschlußwiderstand, insbesondere für Breitbandkommunikations-Kabellinien |
US5339068A (en) * | 1992-12-18 | 1994-08-16 | Mitsubishi Materials Corp. | Conductive chip-type ceramic element and method of manufacture thereof |
TW335595B (en) * | 1996-09-09 | 1998-07-01 | Philips Electronics Nv | Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturiing such components |
CN1178232C (zh) | 1999-04-26 | 2004-12-01 | 松下电器产业株式会社 | 电子零件及无线终端装置 |
TW540829U (en) * | 2002-07-02 | 2003-07-01 | Inpaq Technology Co Ltd | Improved chip-type thick film resistor structure |
US6914770B1 (en) | 2004-03-02 | 2005-07-05 | Vishay Sprague, Inc. | Surface mount flipchip capacitor |
US7088573B2 (en) * | 2004-03-02 | 2006-08-08 | Vishay Sprague, Inc. | Surface mount MELF capacitor |
US7085127B2 (en) * | 2004-03-02 | 2006-08-01 | Vishay Sprague, Inc. | Surface mount chip capacitor |
DE102011112659B4 (de) * | 2011-09-06 | 2022-01-27 | Vishay Semiconductor Gmbh | Oberflächenmontierbares elektronisches Bauelement |
JP5678919B2 (ja) * | 2012-05-02 | 2015-03-04 | 株式会社村田製作所 | 電子部品 |
KR101652850B1 (ko) * | 2015-01-30 | 2016-08-31 | 삼성전기주식회사 | 칩 전자부품, 그 제조방법 및 이를 구비한 기판 |
JP6914617B2 (ja) * | 2016-05-11 | 2021-08-04 | Tdk株式会社 | 積層コイル部品 |
JP2018125489A (ja) * | 2017-02-03 | 2018-08-09 | Koa株式会社 | 抵抗器 |
DE102019122611A1 (de) * | 2019-08-22 | 2021-02-25 | Endress+Hauser SE+Co. KG | SMD-lötbares Bauelement und Verfahren zum Herstellen eines SMD-lötbaren Bauelements |
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US1864336A (en) * | 1927-06-08 | 1932-06-21 | Allen Bradley Co | Resistor unit |
US2083339A (en) * | 1931-09-16 | 1937-06-08 | Globe Union Inc | Electrical resistance unit |
US2022314A (en) * | 1933-12-29 | 1935-11-26 | Globar Corp | Electrical resistor and its manufacture |
GB460471A (en) * | 1935-02-02 | 1937-01-28 | Philips Nv | Improvements in or relating to electric condensers |
US2552653A (en) * | 1944-08-23 | 1951-05-15 | Stupakoff Ceramic & Mfg Co | Electrical condenser |
US2748456A (en) * | 1950-10-20 | 1956-06-05 | Aircraft Marine Prod Inc | Electrical connector and method of manufacture |
US3444436A (en) * | 1967-04-26 | 1969-05-13 | Erie Technological Prod Inc | Mounted capacitor with spaced terminal feet |
JPS5726379Y2 (zh) * | 1978-09-21 | 1982-06-08 | ||
JPS5582487A (en) * | 1978-12-18 | 1980-06-21 | Sony Corp | Electronic circuit device |
DE3169754D1 (en) * | 1980-12-09 | 1985-05-09 | Matsushita Electric Ind Co Ltd | Lamination-wound chip coil and method for manufacturing the same |
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-
1986
- 1986-06-07 DE DE19863619212 patent/DE3619212A1/de not_active Withdrawn
-
1987
- 1987-06-02 EP EP87201033A patent/EP0249277B1/de not_active Expired - Lifetime
- 1987-06-02 DE DE8787201033T patent/DE3785250D1/de not_active Expired - Fee Related
- 1987-06-02 AT AT87201033T patent/ATE88049T1/de not_active IP Right Cessation
- 1987-06-04 AU AU73810/87A patent/AU611082B2/en not_active Ceased
- 1987-06-04 JP JP62139055A patent/JPS62293601A/ja active Pending
- 1987-06-04 CA CA000538898A patent/CA1274590A/en not_active Expired - Lifetime
- 1987-06-04 CN CN87104005A patent/CN1009686B/zh not_active Expired
- 1987-06-04 KR KR870005647Q patent/KR880000989A/ko unknown
-
1990
- 1990-04-12 US US07/512,631 patent/US4984130A/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109961936A (zh) * | 2017-12-26 | 2019-07-02 | 三星电机株式会社 | 片式电子组件 |
CN109961936B (zh) * | 2017-12-26 | 2021-06-22 | 三星电机株式会社 | 片式电子组件 |
CN113301732A (zh) * | 2021-05-28 | 2021-08-24 | 西安微电子技术研究所 | 一种无引线陶瓷封装元器件的焊接装置及方法 |
CN113301732B (zh) * | 2021-05-28 | 2022-04-19 | 西安微电子技术研究所 | 一种无引线陶瓷封装元器件的焊接装置及方法 |
Also Published As
Publication number | Publication date |
---|---|
CA1274590A (en) | 1990-09-25 |
EP0249277B1 (de) | 1993-04-07 |
DE3785250D1 (de) | 1993-05-13 |
EP0249277A3 (en) | 1989-07-19 |
CN1009686B (zh) | 1990-09-19 |
KR880000989A (ko) | 1988-03-30 |
US4984130A (en) | 1991-01-08 |
JPS62293601A (ja) | 1987-12-21 |
AU611082B2 (en) | 1991-06-06 |
EP0249277A2 (de) | 1987-12-16 |
DE3619212A1 (de) | 1987-12-10 |
AU7381087A (en) | 1987-12-10 |
ATE88049T1 (de) | 1993-04-15 |
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