KR880000989A - 수동 소자 - Google Patents

수동 소자 Download PDF

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Publication number
KR880000989A
KR880000989A KR870005647Q KR870005647Q KR880000989A KR 880000989 A KR880000989 A KR 880000989A KR 870005647 Q KR870005647 Q KR 870005647Q KR 870005647 Q KR870005647 Q KR 870005647Q KR 880000989 A KR880000989 A KR 880000989A
Authority
KR
South Korea
Prior art keywords
support member
passive element
element according
passive
face
Prior art date
Application number
KR870005647Q
Other languages
English (en)
Inventor
뒬 헬무트
프룬케르트 호르스트
Original Assignee
이반 밀러 레르너
엔 브이 필립스 글로아이람펜파브리켄
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이반 밀러 레르너, 엔 브이 필립스 글로아이람펜파브리켄 filed Critical 이반 밀러 레르너
Publication of KR880000989A publication Critical patent/KR880000989A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/01—Mounting; Supporting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Non-Adjustable Resistors (AREA)
  • Insulators (AREA)
  • Insulating Bodies (AREA)
  • Ceramic Capacitors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Thermistors And Varistors (AREA)
  • Organic Insulating Materials (AREA)

Abstract

내용 없음

Description

수동 소자
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 3 도는 여러가지 형태의 접속 소자를 갖춘 본 발명에 따르는 수동 원통형 소자의 단면도. 제 8 도는 본 발명에 따르는 완료된 필름 레지스터의 상세한 개략 단면도.

Claims (12)

  1. 단부에 전기 접속 소자를 가지고 직사각형의 평형 육면체 형태로 지지 부재 또는 원통형 지지 부재를 가지며 SMD기술에 적합한 수동 소자에 있어서, 상기 접속 소자(77,777)는 관 모양 방식으로 단부에 상기 지지부재를 둘러싸며 상기 지지 부재의 단부면(9)을 덮지는 않는 것을 특징으로 하는 수동 소자.
  2. 제 1 항에 있어서, 상기 접속 부재(77,777)는 상기 지지 부재(1)의 단부면이 완전히 자유로운 것을 특징으로 하는 수동 소자.
  3. 제 1 항에 있어서, 상기 접속 소자(77,777)는 그의 모서리(9)에 지지 부재(1)의 단부면을 둘러싸고 상기 단부면(9)의 내부 영역을 덮지 않는 것을 특징으로 하는 수동 소자.
  4. 제 1 항에 있어서, 상기 접속 소자(77,777)는 개별적으로 제조된 원통형 금속 슬리브로서 형성된 것을 특징으로 하는 수동 소자.
  5. 제 1 항에 있어서, 상기 두꺼운-필름 접속 소자(77,777)는 금속 분자를 구비하는 버팀대로부터 지지 부재상에 제공된 것을 특징으로 하는 수동 소자.
  6. 제 1 항에 있어서, 상기 전기 도금된 얇은-필름 접속 소자(77,777)는 상기 지지 부재(1)상에 제공된 것을 특징으로 하는 수동 소자.
  7. 제 1 항에 있어서, 상기 지지 부재는 전기적으로 절연 세라믹으로 구성하는 것을 특징으로 하는 수동 소자.
  8. 제 1 항에 있어서, 상기 지지 부재(1)는 유전체 세라믹으로 구성하는 것을 특징으로 하는 수동 소자.
  9. 제 1 항에 있어서, 상기 지지 부재(1)는 페라이트로 구성하는 것을 특징으로 하는 수동 소자.
  10. 제 7 항에 있어서, 그것은 전기 레지스터인 것을 특징으로 하는 수동 소자.
  11. 제 8 항에 있어서, 그것은 캐패시터인 것을 특징으로 하는 수동 소자.
  12. 제 9 항에 있어서, 그것은 인덕터인 것을 특징으로 하는 수동 소자.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR870005647Q 1986-06-07 1987-06-04 수동 소자 KR880000989A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3619212.0 1986-06-07
DE19863619212 DE3619212A1 (de) 1986-06-07 1986-06-07 Passives elektrisches bauelement

Publications (1)

Publication Number Publication Date
KR880000989A true KR880000989A (ko) 1988-03-30

Family

ID=6302520

Family Applications (1)

Application Number Title Priority Date Filing Date
KR870005647Q KR880000989A (ko) 1986-06-07 1987-06-04 수동 소자

Country Status (9)

Country Link
US (1) US4984130A (ko)
EP (1) EP0249277B1 (ko)
JP (1) JPS62293601A (ko)
KR (1) KR880000989A (ko)
CN (1) CN1009686B (ko)
AT (1) ATE88049T1 (ko)
AU (1) AU611082B2 (ko)
CA (1) CA1274590A (ko)
DE (2) DE3619212A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0327031U (ko) * 1989-07-26 1991-03-19
DE4027501C2 (de) * 1990-08-30 1995-06-22 Quante Ag Abschlußwiderstand, insbesondere für Breitbandkommunikations-Kabellinien
US5339068A (en) * 1992-12-18 1994-08-16 Mitsubishi Materials Corp. Conductive chip-type ceramic element and method of manufacture thereof
TW335595B (en) * 1996-09-09 1998-07-01 Philips Electronics Nv Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturiing such components
CN1178232C (zh) 1999-04-26 2004-12-01 松下电器产业株式会社 电子零件及无线终端装置
TW540829U (en) * 2002-07-02 2003-07-01 Inpaq Technology Co Ltd Improved chip-type thick film resistor structure
US6914770B1 (en) 2004-03-02 2005-07-05 Vishay Sprague, Inc. Surface mount flipchip capacitor
US7088573B2 (en) * 2004-03-02 2006-08-08 Vishay Sprague, Inc. Surface mount MELF capacitor
US7085127B2 (en) * 2004-03-02 2006-08-01 Vishay Sprague, Inc. Surface mount chip capacitor
DE102011112659B4 (de) * 2011-09-06 2022-01-27 Vishay Semiconductor Gmbh Oberflächenmontierbares elektronisches Bauelement
JP5678919B2 (ja) * 2012-05-02 2015-03-04 株式会社村田製作所 電子部品
KR101652850B1 (ko) * 2015-01-30 2016-08-31 삼성전기주식회사 칩 전자부품, 그 제조방법 및 이를 구비한 기판
JP6914617B2 (ja) * 2016-05-11 2021-08-04 Tdk株式会社 積層コイル部品
JP2018125489A (ja) * 2017-02-03 2018-08-09 Koa株式会社 抵抗器
KR102511867B1 (ko) * 2017-12-26 2023-03-20 삼성전기주식회사 칩 전자부품
DE102019122611A1 (de) * 2019-08-22 2021-02-25 Endress+Hauser SE+Co. KG SMD-lötbares Bauelement und Verfahren zum Herstellen eines SMD-lötbaren Bauelements
CN113301732B (zh) * 2021-05-28 2022-04-19 西安微电子技术研究所 一种无引线陶瓷封装元器件的焊接装置及方法

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US1864336A (en) * 1927-06-08 1932-06-21 Allen Bradley Co Resistor unit
US2083339A (en) * 1931-09-16 1937-06-08 Globe Union Inc Electrical resistance unit
US2022314A (en) * 1933-12-29 1935-11-26 Globar Corp Electrical resistor and its manufacture
GB460471A (en) * 1935-02-02 1937-01-28 Philips Nv Improvements in or relating to electric condensers
US2552653A (en) * 1944-08-23 1951-05-15 Stupakoff Ceramic & Mfg Co Electrical condenser
US2748456A (en) * 1950-10-20 1956-06-05 Aircraft Marine Prod Inc Electrical connector and method of manufacture
US3444436A (en) * 1967-04-26 1969-05-13 Erie Technological Prod Inc Mounted capacitor with spaced terminal feet
JPS5726379Y2 (ko) * 1978-09-21 1982-06-08
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US4356529A (en) * 1981-01-21 1982-10-26 Sprague Electric Company Terminated monolithic ceramic chip capacitor

Also Published As

Publication number Publication date
CA1274590A (en) 1990-09-25
EP0249277B1 (de) 1993-04-07
DE3785250D1 (de) 1993-05-13
EP0249277A3 (en) 1989-07-19
CN1009686B (zh) 1990-09-19
US4984130A (en) 1991-01-08
JPS62293601A (ja) 1987-12-21
AU611082B2 (en) 1991-06-06
EP0249277A2 (de) 1987-12-16
DE3619212A1 (de) 1987-12-10
AU7381087A (en) 1987-12-10
ATE88049T1 (de) 1993-04-15
CN87104005A (zh) 1988-01-13

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