CN220067777U - Strong heat dissipation PCB board based on copper foil even coverage - Google Patents
Strong heat dissipation PCB board based on copper foil even coverage Download PDFInfo
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- CN220067777U CN220067777U CN202321392183.7U CN202321392183U CN220067777U CN 220067777 U CN220067777 U CN 220067777U CN 202321392183 U CN202321392183 U CN 202321392183U CN 220067777 U CN220067777 U CN 220067777U
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- heat dissipation
- cannula
- base
- heat exchange
- strong heat
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 101
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 239000011889 copper foil Substances 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 239000002245 particle Substances 0.000 claims description 20
- 238000003780 insertion Methods 0.000 claims description 16
- 230000037431 insertion Effects 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 239000012634 fragment Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000024121 nodulation Effects 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000037221 weight management Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a strong heat dissipation PCB based on uniform copper foil coverage, which comprises a PCB substrate, wherein a copper foil layer is covered on the PCB substrate, a first strong heat dissipation base and a second strong heat dissipation base are arranged below the PCB substrate, and the first strong heat dissipation base and the second strong heat dissipation base are detachably and fixedly connected; the first strong heat dissipation base and the second strong heat dissipation base are attached to the lower surface of the PCB substrate. According to the utility model, the first strong heat dissipation base and the second strong heat dissipation base are arranged below the PCB, so that heat dissipation is effectively promoted, and the first strong heat dissipation base and the second strong heat dissipation base are in a detachable fixed connection mode, so that the heat dissipation area can be effectively changed.
Description
Technical Field
The utility model relates to the technical field of PCB preparation, in particular to a strong heat dissipation PCB based on uniform coverage of copper foil.
Background
With the development of 5G communication technology, high-speed PCB signal insertion loss is required to be controlled in a lower range. The key factors affecting the insertion loss performance of the high-speed PCB include the surface roughness of the high-speed circuit and the conductivity of the conductor, and the surface roughness of the high-speed circuit mainly consists of copper foil processing roughness and PCB circuit processing roughness.
The existing copper foil processing comprises the steps of carrying out nodulation treatment and passivation treatment on the surface of the raw foil, wherein the nodulation treatment can enable a plurality of copper nodules to grow on the surface of the raw foil, the specific surface area is increased, the binding force is improved, and the defect that more insertion loss is caused for high-speed signal transmission is overcome. The passivation treatment can lead in microelements such as nickel, zinc, chromium and the like on the surface of the copper foil, and the microelements can deteriorate high-speed signals and increase insertion loss. In addition, in the existing PCB processing, in order to improve the bonding force of the lamination, the surface roughening treatment (blackening or browning process) is required to be performed on the inner layer circuit pattern, and this process can cause the surface roughness of the high-speed circuit to be increased, and the insertion loss is further deteriorated.
Because the PCB board is generally highly integrated with the electronic device in the electronic device, the PCB board needs to bear the heat productivity of the electronic device, so when the electronic device is radiating, the PCB board needs to be radiating, and when the copper foil uniformly covers the substrate of the PCB board, the radiating requirement of the PCB board cannot be effectively met, how to effectively strengthen the radiating of the PCB board becomes a problem to be solved.
Disclosure of Invention
The utility model aims to overcome the defect that the heat dissipation requirement of a PCB (printed Circuit Board) cannot be met by simply utilizing copper foil to strengthen heat dissipation in the prior art, and provides a strong heat dissipation PCB based on uniform coverage of copper foil.
The aim of the utility model is mainly realized by the following technical scheme:
the strong heat dissipation PCB based on the uniform copper foil coverage comprises a PCB substrate, wherein a copper foil layer is covered on the PCB substrate, a first strong heat dissipation base and a second strong heat dissipation base are arranged below the PCB substrate, and the first strong heat dissipation base and the second strong heat dissipation base are detachably and fixedly connected;
the first strong heat dissipation base and the second strong heat dissipation base are attached to the lower surface of the PCB substrate.
At present, a copper foil layer is generally arranged on a PCB substrate for conducting, radiating and other functions, and in highly integrated electronic equipment, heat accumulation easily occurs at the position of the PCB, so that the PCB is easily burnt out in the electronic equipment, the copper foil layer can only conduct and radiate heat on the basis, the radiating effect is limited, and on the basis, radiating configuration needs to be added on the PCB if insufficient radiating exists, so that the use safety of the PCB is ensured.
According to the embodiment of the utility model, the first strong radiating base and the second strong radiating base are arranged below the PCB board, so that the heat dissipation is effectively promoted, the first strong radiating base and the second strong radiating base are in a detachable fixed connection mode, the radiating area can be effectively changed, according to the actual use conditions of the electronic equipment, when the larger radiating area is required to be configured, the first strong radiating base and the second strong radiating base are both configured below the PCB board, when the heat dissipation area is not required to be too large, the temperature of the PCB board can be effectively kept within a reasonable range, only one of the first strong radiating base or the second strong radiating base is required to be reserved, and the space and the weight management of the electronic equipment can be optimized, and the radiating area below the PCB board can be effectively adapted to different requirements by flexibly changing the radiating area, so that the first strong radiating base and/or the second strong radiating base can be effectively combined with the radiating system of the electronic equipment and can not only perform the cooling function on the PCB board, and the radiating system can also be used for cooling the other auxiliary PCB board.
Further, the first strong heat dissipation base comprises a first base body, a first heat exchange cavity is arranged in the first base body, a plurality of first heat exchange pipes penetrating through the first base body are arranged on the first base body, and the first heat exchange pipes penetrate through the first heat exchange cavity;
the second strong heat dissipation base comprises a second base body, a second heat exchange cavity is arranged in the second base body, a plurality of second heat exchange pipes penetrating through the second base body are arranged on the second base body, and the second heat exchange pipes penetrate through the second heat exchange cavity;
the socket comprises a first seat body and a second seat body, wherein a first socket connecting assembly and a second socket connecting assembly are arranged between the first seat body and the second seat body, and the first seat body and the second seat body are fixedly connected with the first socket connecting assembly and the second socket connecting assembly in a detachable mode.
The first base body is used for supporting the first heat exchange tube, the first heat exchange cavity can effectively transfer heat of the PCB to the first heat exchange tube, cooling and heat dissipation of the PCB substrate are achieved through heat exchange of the first heat exchange tube, heat in the first heat exchange cavity can be taken away, and the first heat exchange cavity can effectively transfer heat to the side wall of the first heat exchange tube, so that heat exchange contact area is increased, and heat exchange efficiency is improved; the principles of the second base, the second heat exchange tube and the second heat exchange cavity are the same as those of the first base, the first heat exchange tube and the first heat exchange cavity.
In the embodiment of the utility model, the first socket connection assembly and the second socket connection assembly can be connected with the first base body and the second base body in a plugging manner, so that the purpose of detachably and fixedly connecting the first strong heat dissipation base and the second strong heat dissipation base is achieved.
Further, the first socket connection assembly comprises a first cannula elastic sheet and a first connection cannula, a part of the first cannula elastic sheet is fixed in the first base body, the first connection cannula is embedded in the second base body, and the first cannula elastic sheet can be inserted into the first connection cannula;
the second socket connection assembly comprises a second cannula elastic sheet and a second connection cannula, a part of the second cannula elastic sheet is fixed in the second base body, the second connection cannula is embedded in the first base body, and the second cannula elastic sheet can be inserted into the second connection cannula.
In the embodiment of the utility model, the first cannula elastic piece and the second cannula elastic piece are elastic, and the first cannula elastic piece can prop against the inner wall of the first connecting cannula due to elasticity when being inserted into the first connecting cannula, so that the first cannula elastic piece is prevented from falling out, and the connection mode of the second cannula elastic piece and the second connecting cannula is the same as the connection mode of the first cannula elastic piece and the first connecting cannula;
the first connecting cannula with there is certain angle between the first cannula shell fragment, thereby makes first cannula shell fragment can be through elasticity support the inner wall of first connecting cannula when inserting in the first connecting cannula, thereby avoid first cannula shell fragment to deviate from, and the same reason, there is certain angle between the second connecting cannula with there is between the second cannula shell fragment.
Further, the second cannula elastic piece comprises a rotating shaft, the rotating shaft is positioned in the second heat exchange cavity, a bearing plate is arranged on the rotating shaft, a plurality of elastic pieces are fixed on the bearing plate, and the rotating shaft can drive the bearing plate to rotate and insert the elastic pieces into the second connecting cannula;
the first cannula elastic piece and the second cannula elastic piece have the same structure.
The rotating shaft in the embodiment of the utility model is driven to rotate through the rotary driving device, such as a micro motor, when the rotating shaft rotates, the bearing plate can be controlled to push the elastic piece to be inserted into the second connecting cannula, so that the connection between the second cannula elastic piece and the second connecting cannula is realized, and when the rotating shaft reversely rotates, the purpose of disassembling the connection between the second cannula elastic piece and the second connecting cannula can be achieved by pulling out the second cannula elastic piece from the second connecting cannula.
Further, the second connecting cannula comprises a tube body, the size and the position of one end of the tube body correspond to those of the second cannula elastic piece, an end constraint head is arranged at the other end of the tube body, and the end constraint head can limit the degree of freedom of the second cannula elastic piece;
the first connecting cannula and the second connecting cannula have the same structure.
In the embodiment of the utility model, the pipe body can effectively bear the second cannula elastic piece, and the end constraint head can limit the degree of freedom of the second cannula elastic piece, so that the second cannula elastic piece is not easy to separate from the second connecting cannula;
the connection mode of the first cannula elastic sheet and the first connection cannula is the same as the connection mode of the second cannula elastic sheet and the second connection cannula.
Further, a plurality of heat conduction balls are arranged in the first heat exchange cavity, and the heat conduction balls are in contact with the inner wall of the first base body and can be in contact with the outer wall of the first heat exchange tube;
the second heat exchange cavity is internally provided with a plurality of heat conduction particles, and the heat conduction particles are contacted with the inner wall of the second base body and can be contacted with the outer wall of the second heat exchange tube.
In the embodiment of the utility model, the heat exchange is enhanced through the first heat exchange pipe and the second heat exchange pipe, the heat conducting ball is arranged in the first heat exchange cavity, the heat conducting particles are arranged in the second heat exchange cavity, the heat exchange efficiency of the first heat exchange pipe and the second heat exchange pipe can be improved through the heat conduction of the heat conducting ball and the heat conducting particles, and the heat conducting particles roll in the second heat exchange cavity in the electronic equipment in a moving state due to the change of the working condition of the electronic equipment, and the heat conducting particles and/or the heat conducting balls contacted with the first heat exchange pipe and/or the second heat exchange pipe can be effectively converted through the rolling of the heat conducting particles and the heat conducting balls, so that the heat exchange efficiency is further improved.
Further, the lower surface of the first strong heat dissipation base is fixedly provided with a plurality of first heat dissipation copper sheets, and the lower surface of the second strong heat dissipation base is fixedly provided with a plurality of second heat dissipation copper sheets.
In order to ensure that the basic heat dissipation of the embodiment of the utility model can be effectively improved, a plurality of first heat dissipation copper sheets are fixed on the lower surface of the first strong heat dissipation base, a plurality of second heat dissipation copper sheets are fixed on the lower surface of the second strong heat dissipation base, and the heat dissipation efficiency of the embodiment of the utility model can be effectively improved through the high heat conduction and the increase of the heat exchange areas of the first heat dissipation copper sheets and the second heat dissipation copper sheets, so that the basic heat dissipation of a PCB is ensured.
In summary, compared with the prior art, the utility model has the following beneficial effects:
(1) According to the utility model, the first strong heat dissipation base and the second strong heat dissipation base are arranged below the PCB, so that heat dissipation is effectively promoted, and the first strong heat dissipation base and the second strong heat dissipation base are in a detachable fixed connection mode, so that the heat dissipation area can be effectively changed.
(2) According to the utility model, a certain angle exists between the first connecting cannula and the first cannula elastic piece, so that the first cannula elastic piece can be elastically abutted against the inner wall of the first connecting cannula when inserted into the first connecting cannula, the first cannula elastic piece is prevented from falling out, and a certain angle exists between the second connecting cannula and the second cannula elastic piece.
(3) According to the utility model, as the working conditions of the electronic equipment change, in the electronic equipment in a moving state, the heat conducting particles roll in the second heat exchange cavity, the heat conducting balls roll in the first heat exchange cavity, and the heat conducting particles and/or the heat conducting balls contacted with the first heat exchange pipe and/or the second heat exchange pipe can be effectively converted through the rolling of the heat conducting particles and the heat conducting balls, so that the heat exchange efficiency is further improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of embodiments of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model. In the drawings:
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a top cross-sectional view of a first strong heat sink base and a second strong heat sink base of the present utility model;
the names corresponding to the reference numerals are: the heat-conducting wire comprises a copper foil layer, a 2-PCB board substrate, a 3-first strong heat-radiating base, a 31-first base, 32-heat-conducting balls, 33-first inserting tube elastic sheets, 34-first connecting inserting tubes, 35-first heat exchange cavities, 4-first heat-radiating copper sheets, 5-first heat exchange tubes, 6-second heat-radiating copper sheets, 7-second strong heat-radiating base, 71-second base, 72-heat-conducting particles, 73-second heat exchange cavities, 74-second inserting tube elastic sheets, 741-bearing plates, 742-rotating shafts, 743-elastic sheets, 75-second connecting inserting tubes, 751-tube bodies, 752-end constraint heads and 8-second heat exchange tubes.
Detailed Description
For the purpose of making apparent the objects, technical solutions and advantages of the present utility model, the present utility model will be further described in detail with reference to the following examples and the accompanying drawings, wherein the exemplary embodiments of the present utility model and the descriptions thereof are for illustrating the present utility model only and are not to be construed as limiting the present utility model.
Examples:
as shown in fig. 1-2, the embodiment relates to a strong heat dissipation PCB board based on uniform coverage of copper foil, which comprises a PCB board substrate 2, wherein a copper foil layer 1 is covered on the PCB board substrate 2, a first strong heat dissipation base 3 and a second strong heat dissipation base 7 are arranged below the PCB board substrate 2, and the first strong heat dissipation base 3 and the second strong heat dissipation base 7 are detachably and fixedly connected;
the first strong heat dissipation base 3 and the second strong heat dissipation base 7 are attached to the lower surface of the PCB board substrate 2.
According to the embodiment, the first strong heat dissipation base 3 and the second strong heat dissipation base 7 are arranged below the PCB board, heat dissipation is effectively promoted, the first strong heat dissipation base 3 and the second strong heat dissipation base 7 are in a detachable fixed connection mode, the heat dissipation area can be effectively changed, according to the actual use conditions of the electronic equipment, when the larger heat dissipation area is required to be configured, the first strong heat dissipation base 3 and the second strong heat dissipation base 7 are both configured below the PCB board substrate 2, when the heat dissipation area is not required to be too large, the heat dissipation system can be effectively kept when the temperature of the PCB board is in a reasonable range, only one of the first strong heat dissipation base 3 or the second strong heat dissipation base 7 is required to be kept, and the space and the weight management of the electronic equipment can be optimized.
The first strong heat dissipation base 3 comprises a first base body 31, a first heat exchange cavity 35 is arranged in the first base body 31, a plurality of first heat exchange pipes 5 penetrating through the first base body 31 are arranged on the first base body 31, and the first heat exchange pipes 5 penetrate through the first heat exchange cavity 35;
the second strong heat dissipation base 7 comprises a second base 71, a second heat exchange cavity 73 is arranged in the second base 71, a plurality of second heat exchange tubes 8 penetrating through the second base 71 are arranged on the second base 71, and the second heat exchange tubes 8 penetrate through the second heat exchange cavity 73;
a first socket connection assembly and a second socket connection assembly are arranged between the first seat body 31 and the second seat body 71, and the first seat body 31 and the second seat body 71 are fixedly connected with the first socket connection assembly and the second socket connection assembly in a detachable mode.
The first socket-and-spigot assembly comprises a first cannula elastic piece 33 and a first connecting cannula 34, a part of the first cannula elastic piece 33 is fixed in the first seat 31, the first connecting cannula 34 is embedded in the second seat 71, and the first cannula elastic piece 33 can be inserted into the first connecting cannula 34;
the second socket-and-spigot assembly comprises a second cannula elastic piece 74 and a second connection cannula 75, a part of the second cannula elastic piece 74 is fixed in the second seat 71, the second connection cannula 75 is embedded in the first seat 31, and the second cannula elastic piece 74 can be inserted into the second connection cannula 75.
The second cannula elastic piece 74 includes a rotation shaft 742, the rotation shaft 742 is located in the second heat exchange cavity 73, a bearing plate 741 is provided on the rotation shaft 742, a plurality of elastic pieces 743 are fixed on the bearing plate 741, and the rotation shaft 742 can drive the bearing plate 741 to rotate and insert the elastic pieces 743 into the second connection cannula 75;
the first cannula spring 33 has the same structure as the second cannula spring 74.
The second connection cannula 75 includes a tube body 751, one end of the tube body 751 has a size and a position corresponding to those of the second cannula elastic piece 74, and the other end of the tube body 751 is provided with an end constraint head 752, and the end constraint head 752 can limit the degree of freedom of the second cannula elastic piece 74;
the first connecting cannula 34 is identical in structure to the second connecting cannula 75.
In this embodiment, when a larger heat dissipating capacity needs to be increased, by rotating the rotating shaft 742, the bearing plate 741 pushes the elastic piece 743 to be inserted into the pipe body 751, and connection between the second cannula elastic piece 74 and the second connection cannula 75 is achieved by constraint of the end constraint head 752, and connection between the first cannula elastic piece 33 and the first connection cannula 34 can be achieved in the same manner, in this embodiment, connection between the first strong heat dissipating base 3 and the second strong heat dissipating base 7 is performed in a form of a first socket connection assembly and a second socket connection assembly, and the first socket connection assembly and the second socket connection assembly are distributed symmetrically with respect to centers of connection positions of the first strong heat dissipating base 3 and the second strong heat dissipating base 7, so that uniformity and stability of connection between the first strong heat dissipating base 3 and the second strong heat dissipating base 7 are ensured.
When the heat dissipation capacity needs to be reduced, the rotation shaft 742 is reversely rotated, and the bearing plate 741 can drive the elastic piece 743 to be pulled out from the pipe 751, thereby releasing the connection between the first strong heat dissipation base 3 and the second strong heat dissipation base 7.
A plurality of heat conducting balls 32 are arranged in the first heat exchange cavity 35, and the heat conducting balls 32 are in contact with the inner wall of the first base 31 and can be in contact with the outer wall of the first heat exchange tube 5;
a plurality of heat conducting particles 72 are arranged in the second heat exchange cavity 73, and the heat conducting particles 72 are in contact with the inner wall of the second base 71 and can be in contact with the outer wall of the second heat exchange tube 8.
The lower surface of the first strong heat dissipation base 3 is fixed with a plurality of first heat dissipation copper sheets 4, and the lower surface of the second strong heat dissipation base 7 is fixed with a plurality of second heat dissipation copper sheets 6.
In this embodiment, heat exchange is enhanced by the first heat exchange tube 5 and the second heat exchange tube 8, the heat conducting balls 32 are disposed in the first heat exchange cavity 35, the heat conducting particles 72 are disposed in the second heat exchange cavity 73, heat exchange efficiency of the first heat exchange tube 5 and the second heat exchange tube 8 can be improved by heat conduction of the heat conducting balls 32 and the heat conducting particles 72, and in the electronic equipment in a moving state, the heat conducting particles 72 roll in the second heat exchange cavity 73, the heat conducting balls 32 roll in the first heat exchange cavity 35, and the heat conducting particles 72 and/or the heat conducting balls 32 contacted with the first heat exchange tube 5 and/or the second heat exchange tube 8 can be effectively transformed by rolling the heat conducting particles 72 and/or the heat conducting balls 32, so that heat exchange efficiency is further improved.
The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the utility model, and is not meant to limit the scope of the utility model, but to limit the utility model to the particular embodiments, and any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the utility model are intended to be included within the scope of the utility model.
Claims (7)
1. The strong heat dissipation PCB based on the uniform coverage of copper foil comprises a PCB substrate (2), wherein a copper foil layer (1) is covered on the PCB substrate (2), and the strong heat dissipation PCB is characterized in that a first strong heat dissipation base (3) and a second strong heat dissipation base (7) are arranged below the PCB substrate (2), and the first strong heat dissipation base (3) and the second strong heat dissipation base (7) are detachably and fixedly connected;
the first strong heat dissipation base (3) and the second strong heat dissipation base (7) are attached to the lower surface of the PCB substrate (2).
2. The strong heat dissipation PCB board based on uniform coverage of copper foil according to claim 1, wherein the first strong heat dissipation base (3) comprises a first base body (31), a first heat exchange cavity (35) is arranged in the first base body (31), a plurality of first heat exchange pipes (5) penetrating through the first base body (31) are arranged on the first base body (31), and the first heat exchange pipes (5) penetrate through the first heat exchange cavity (35);
the second strong heat dissipation base (7) comprises a second base body (71), a second heat exchange cavity (73) is formed in the second base body (71), a plurality of second heat exchange pipes (8) penetrating through the second base body (71) are arranged on the second base body (71), and the second heat exchange pipes (8) penetrate through the second heat exchange cavity (73);
a first socket connection assembly and a second socket connection assembly are arranged between the first seat body (31) and the second seat body (71), and the first seat body (31) and the second seat body (71) are fixedly connected with the first socket connection assembly and the second socket connection assembly in a detachable mode.
3. The strong heat dissipation PCB board based on uniform coverage of copper foil according to claim 2, wherein the first socket connection assembly comprises a first insertion tube elastic sheet (33) and a first connection insertion tube (34), a part of the first insertion tube elastic sheet (33) is fixed in the first seat body (31), the first connection insertion tube (34) is embedded in the second seat body (71), and the first insertion tube elastic sheet (33) can be inserted into the first connection insertion tube (34);
the second socket-joint connection assembly comprises a second cannula elastic sheet (74) and a second connection cannula (75), a part of the second cannula elastic sheet (74) is fixed in the second base body (71), the second connection cannula (75) is embedded in the first base body (31), and the second cannula elastic sheet (74) can be inserted into the second connection cannula (75).
4. A strong heat dissipation PCB board based on uniform coverage of copper foil according to claim 3, wherein the second insertion tube elastic sheet (74) comprises a rotation shaft (742), the rotation shaft (742) is located in the second heat exchange cavity (73), a bearing plate (741) is arranged on the rotation shaft (742), a plurality of elastic sheets (743) are fixed on the bearing plate (741), and the rotation shaft (742) can drive the bearing plate (741) to rotate and insert the elastic sheets (743) into the second connection insertion tube (75);
the first cannula elastic piece (33) and the second cannula elastic piece (74) have the same structure.
5. A strong heat dissipation PCB board based on uniform coverage of copper foil according to claim 3, wherein the second connection insertion tube (75) comprises a tube body (751), one end of the tube body (751) corresponds in size and position to the second insertion tube elastic sheet (74), and an end constraint head (752) is provided at the other end thereof, the end constraint head (752) being capable of limiting the degree of freedom of the second insertion tube elastic sheet (74);
the first connecting cannula (34) and the second connecting cannula (75) have the same structure.
6. The strong heat dissipation PCB board based on uniform coverage of copper foil according to claim 2, wherein a plurality of heat conduction balls (32) are arranged in the first heat exchange cavity (35), and the heat conduction balls (32) are in contact with the inner wall of the first base body (31) and can be in contact with the outer wall of the first heat exchange tube (5);
a plurality of heat conducting particles (72) are arranged in the second heat exchange cavity (73), and the heat conducting particles (72) are in contact with the inner wall of the second base body (71) and can be in contact with the outer wall of the second heat exchange tube (8).
7. The strong heat dissipation PCB board based on uniform coverage of copper foil according to any one of claims 1 to 6, wherein a plurality of first heat dissipation copper sheets (4) are fixed on the lower surface of the first strong heat dissipation base (3), and a plurality of second heat dissipation copper sheets (6) are fixed on the lower surface of the second strong heat dissipation base (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321392183.7U CN220067777U (en) | 2023-06-02 | 2023-06-02 | Strong heat dissipation PCB board based on copper foil even coverage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321392183.7U CN220067777U (en) | 2023-06-02 | 2023-06-02 | Strong heat dissipation PCB board based on copper foil even coverage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220067777U true CN220067777U (en) | 2023-11-21 |
Family
ID=88760115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321392183.7U Active CN220067777U (en) | 2023-06-02 | 2023-06-02 | Strong heat dissipation PCB board based on copper foil even coverage |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220067777U (en) |
-
2023
- 2023-06-02 CN CN202321392183.7U patent/CN220067777U/en active Active
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