CN218006612U

CN218006612U - Multilayer HDI circuit board of inlayer interconnection

Info

Publication number: CN218006612U
Application number: CN202222136070.2U
Authority: CN
Inventors: 吴利辉; 吴伟红
Original assignee: Shenzhen Wanchuangxing Electronics Co ltd
Current assignee: Shenzhen Wanchuangxing Electronics Co ltd
Priority date: 2022-08-15
Filing date: 2022-08-15
Publication date: 2022-12-09
Anticipated expiration: 2032-08-15

Abstract

The utility model discloses a multilayer HDI circuit board of inlayer interconnection, including multilayer HDI circuit board main part, the heat-conducting plate is installed to multilayer HDI circuit board main part lower extreme, two sets of backup pads are installed to the heat-conducting plate lower extreme, and are two sets of symmetric distribution around the backup pad is, bottom heat dissipation mechanism is installed to heat-conducting plate lower extreme left part, a plurality of radiating fin is located right-hand just of bottom heat dissipation mechanism, the mounting bracket is installed jointly to heat-conducting plate front end and rear end, the mounting bracket is the U-shaped structure, the mounting bracket upper end alternates fixed mounting has top heat dissipation mechanism, the left side the connecting plate is all installed to backup pad and the backup pad lower extreme on the right side. The utility model discloses a set up bottom heat dissipation mechanism and top heat dissipation mechanism and mutually support the heat dissipation that has realized multilayer HDI circuit board main part, effectively prolonged the life of multilayer HDI circuit board main part, simple structure, the practicality is strong.

Description

Multilayer HDI circuit board of inlayer interconnection

Technical Field

The utility model relates to a circuit board technical field, in particular to multilayer HDI circuit board of inlayer interconnection.

Background

The HDI circuit board is a circuit board with higher line distribution density by using a micro-blind buried via technology. Under the premise that electronic products tend to have complicated functions, the contact distance of integrated circuit devices is reduced, the signal transmission speed is increased, the number of connections is increased, the length of interconnections between points is locally shortened, and high-density circuit arrangement and micro-via technology are required to achieve the goal.

Because multilayer HDI circuit board internal line distribution density is high, its during operation can produce a large amount of heats for the circuit board heaies up rapidly, if not take the heat dissipation measure in time, the life of multilayer HDI circuit board can reduce, so, we propose a multilayer HDI circuit board of inlayer interconnection, improve the heat-sinking capability of multilayer HDI circuit board.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a multilayer HDI circuit board of inlayer interconnection, can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a multilayer HDI circuit board of inlayer interconnection, includes multilayer HDI circuit board main part, the heat-conducting plate is installed to multilayer HDI circuit board main part lower extreme, two sets of backup pads are installed to the heat-conducting plate lower extreme, and are two sets of symmetric distribution around the backup pad is, bottom heat dissipation mechanism is installed to heat-conducting plate lower extreme left part, a plurality of radiating fin is installed to the heat-conducting plate lower extreme right-hand side just under the bottom heat dissipation mechanism, the mounting bracket is installed jointly to heat-conducting plate front end and rear end, the mounting bracket is the U-shaped structure, the mounting bracket upper end alternates fixed mounting there is top heat dissipation mechanism, top heat dissipation mechanism is located multilayer HDI circuit board main part top, left side most the connecting plate is all installed to backup pad and the backup pad lower extreme on right side.

Multilayer HDI circuit board main part adopts inlayer interconnection structure, heat-conducting plate and radiating fin all adopt metal copper material to make for the heat that conduction multilayer HDI circuit board main part during operation produced, the backup pad adopts the metal aluminium material to make, bottom heat dissipation mechanism is used for the heat dissipation of multilayer HDI circuit board main part bottom, top heat dissipation mechanism is used for the heat dissipation of multilayer HDI circuit board main part upper end component face, the connecting plate is used for fixed mounting.

Preferably, the bottom heat dissipation mechanism comprises a first shell, the upper end of the first shell is fixedly connected with the lower end of the heat conduction plate, three axial flow fans are installed in the inner cavity of the first shell, a dust screen is installed at the left end of the first shell, the three axial flow fans are distributed in a linear array mode, the dust screen reduces the probability that dust enters the first shell, and cleanness of the axial flow fans is kept.

Preferably, top heat dissipation mechanism includes the second shell, second shell and mounting bracket interlude fixed connection, second shell internally mounted has radiator fan, the air current that radiator fan blew out just contacts with multilayer HDI circuit board main part upper end component face.

Preferably, the lower end face of the connecting plate is flush with the lower end face of the supporting plate, the supporting plate is of an L-shaped structure, and the heat conducting plate is overhead by the supporting plate.

Preferably, the radiating fins are distributed in an isosceles triangle array, so that each radiating fin can be in contact with the airflow blown out by the axial flow fan.

Preferably, the height of the first housing is smaller than the height of the support plate.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. the heat dissipation of the multilayer HDI circuit board main body is realized by arranging the bottom heat dissipation mechanism and the top heat dissipation mechanism which are mutually matched, the heat generated during the working of the multilayer HDI circuit board main body is conducted through the heat conduction plate made of copper materials, the air circulation speed below the heat conduction plate is accelerated through the three axial flow fans, the contact area between the heat conduction plate and air is increased through arranging the heat dissipation fins, the heat exchange efficiency of the heat conduction plate is effectively improved, the bottom of the multilayer HDI circuit board main body is rapidly cooled, the air flow speed above the multilayer HDI circuit board main body is accelerated through the heat dissipation fans, the element surface at the top of the multilayer HDI circuit board main body is rapidly dissipated, and the service life of the multilayer HDI circuit board main body is effectively prolonged;

2. the heat-conducting plate is overhead by arranging the supporting plate, the contact area of the heat-conducting plate and air is increased, the heat exchange efficiency is accelerated, the air circulation below the multi-layer HDI circuit board main body is facilitated, the heat dissipation fins distributed in an isosceles triangle shape are used for dissipating heat of the heat-conducting plate, all the heat dissipation fins are ensured to be in contact with air flow blown out by the axial flow fan, and the heat dissipation effect is further improved.

Drawings

Fig. 1 is a schematic diagram of an overall structure of an internal-layer-interconnected multilayer HDI circuit board according to the present invention;

fig. 2 is a schematic overall structural diagram of another view angle of the multilayer HDI circuit board with the inner layers interconnected according to the present invention;

fig. 3 is a schematic view of an overall structure of a bottom heat dissipation mechanism of an inner-layer-interconnected multilayer HDI circuit board according to the present invention;

fig. 4 is a schematic diagram of the overall structure of the bottom heat dissipation mechanism of the multilayer HDI circuit board with interconnected inner layers according to the present invention.

In the figure: 1. a multilayer HDI circuit board main body; 2. a heat conducting plate; 3. a support plate; 4. a bottom heat dissipation mechanism; 5. a mounting frame; 6. a top heat dissipation mechanism; 7. a heat dissipating fin; 8. a connecting plate; 41. a first housing; 42. an axial flow fan; 43. a dust screen; 61. a second housing; 62. a heat dissipation fan.

Detailed Description

In order to make the utility model realize, the technical means, the creation characteristics, the achievement purpose and the efficacy are easy to understand and understand, the utility model is further explained by combining the specific implementation mode.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-4, a multilayer HDI circuit board of inlayer interconnection, including multilayer HDI circuit board main part 1, heat-conducting plate 2 is installed to 1 lower extreme of multilayer HDI circuit board main part, two sets of backup pads 3 are installed to 2 lower extremes of heat-conducting plate, symmetrical distribution around two sets of backup pads 3 are, bottom heat dissipation mechanism 4 is installed to 2 lower extreme left parts of heat-conducting plate, a plurality of radiating fin 7 is installed to 2 lower extremes of heat-conducting plate, a plurality of radiating fin 7 is located bottom heat dissipation mechanism 4 right-hand, mounting bracket 5 is installed jointly to 2 front ends of heat-conducting plate and rear end, mounting bracket 5 is the U-shaped structure, 5 upper ends of mounting bracket alternate fixed mounting have top heat dissipation mechanism 6, top heat dissipation mechanism 6 is located multilayer HDI circuit board main part 1 top, connecting plate 8 is all installed to 3 lower extremes of backup pad on leftmost side and rightmost.

The multilayer HDI circuit board main body 1 adopts an inner layer interconnection structure, the heat conducting plate 2 and the radiating fins 7 are made of metal copper materials and used for conducting heat generated when the multilayer HDI circuit board main body 1 works, the supporting plate 3 is made of a metal aluminum material, the bottom radiating mechanism 4 is used for radiating the bottom of the multilayer HDI circuit board main body 1, the top radiating mechanism 6 is used for radiating the upper element face of the multilayer HDI circuit board main body 1, and the connecting plate 8 is used for fixed installation.

The bottom heat dissipation mechanism 4 comprises a first shell 41, the upper end of the first shell 41 is fixedly connected with the lower end of the heat conduction plate 2, three axial flow fans 42 are installed in the inner cavity of the first shell 41, a dust screen 43 is installed at the left end of the first shell 41, the three axial flow fans 42 are distributed in a linear array mode, the dust screen 43 reduces the probability that dust enters the first shell 41, and cleanness of the axial flow fans 42 is kept.

The top heat dissipation mechanism 6 comprises a second casing 61, the second casing 61 is fixedly connected with the mounting frame 5 in an inserting manner, a heat dissipation fan 62 is installed inside the second casing 61, and airflow blown out by the heat dissipation fan 62 is just in surface contact with an upper element of the multilayer HDI circuit board main body 1.

The terminal surface flushes with backup pad 3 lower terminal surface under 8 lower terminal surfaces of connecting plate, and backup pad 3 is L shape structure, and backup pad 3 makes somebody a mere figurehead with heat-conducting plate 2.

The radiating fins 7 are distributed in an isosceles triangle array, so that each radiating fin 7 can be in contact with the airflow blown out by the axial flow fan 42.

The height of the first housing 41 is smaller than the height of the support plate 3.

It should be noted that, the utility model relates to an inlayer interconnected multilayer HDI circuit board, the heat dissipation of multilayer HDI circuit board main part 1 has been realized through setting up bottom heat dissipation mechanism 4 and top heat dissipation mechanism 6 and mutually supporting, heat that heat conduction plate 2 conduction multilayer HDI circuit board main part 1 through copper material produced during operation, the circulation of air speed below heat conduction plate 2 is accelerated through three axial fan 42, increase the area of contact of heat conduction plate 2 and air through setting up radiating fin 7, the heat exchange efficiency of heat conduction plate 2 has effectively been improved, make the bottom of multilayer HDI circuit board main part 1 cool down rapidly, the air flow rate of multilayer HDI circuit board main part 1 top is accelerated through radiator fan 62, make the quick heat dissipation of multilayer HDI circuit board main part 1 top component face, the life of multilayer HDI circuit board main part 1 has effectively been prolonged; make somebody a mere figurehead heat-conducting plate 2 through setting up backup pad 3, increase heat-conducting plate 2 and the area of contact of air for heat exchange efficiency, and the circulation of air of the multilayer HDI circuit board main part 1 below of being convenient for, be used for heat dissipation of heat-conducting plate 2 through setting up the radiating fin 7 that is isosceles triangle distribution, and ensure that all radiating fin 7 all can contact with the air current that axial fan 42 blew out, further improve the radiating effect.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides an multilayer HDI circuit board of inlayer interconnection, includes multilayer HDI circuit board main part (1), its characterized in that: heat-conducting plate (2) are installed to multilayer HDI circuit board main part (1) lower extreme, two sets of backup pad (3) are installed to heat-conducting plate (2) lower extreme, and are two sets of symmetric distribution around backup pad (3) is, bottom heat dissipation mechanism (4) are installed to heat-conducting plate (2) lower extreme left part, a plurality of radiating fin (7) are installed to heat-conducting plate (2) lower extreme right-hand just being located bottom heat dissipation mechanism (4), mounting bracket (5) are installed jointly to heat-conducting plate (2) front end and rear end, mounting bracket (5) are the U-shaped structure, it has top heat dissipation mechanism (6) to alternate fixed mounting bracket (5) upper end, top heat dissipation mechanism (6) are located multilayer HDI circuit board main part (1) top, left side connecting plate (8) are all installed to backup pad (3) lower extreme on backup pad (3) and the right side.

2. An inner layer interconnected multilayer HDI circuit board according to claim 1, characterized in that: bottom heat dissipation mechanism (4) include first shell (41), first shell (41) upper end and heat-conducting plate (2) lower extreme fixed connection, three axial fan (42) are installed to first shell (41) inner chamber, dust screen (43), three are installed to first shell (41) left end axial fan (42) are the linear array and distribute.

3. An inner layer interconnected multilayer HDI circuit board according to claim 2, characterized in that: top heat dissipation mechanism (6) include second shell (61), second shell (61) alternate fixed connection with mounting bracket (5), second shell (61) internally mounted has radiator fan (62).

4. An inter-layer interconnected multilayer HDI circuit board according to claim 3, wherein: the lower end face of the connecting plate (8) is flush with the lower end face of the supporting plate (3), and the supporting plate (3) is of an L-shaped structure.

5. An inter-layer interconnected multilayer HDI circuit board according to claim 4, wherein: the radiating fins (7) are distributed in an isosceles triangle array.

6. An inner layer interconnected multilayer HDI circuit board according to claim 5, characterized in that: the height of the first housing (41) is smaller than the height of the support plate (3).