CN114302038B - Camera structure and electronic equipment - Google Patents
Camera structure and electronic equipment Download PDFInfo
- Publication number
- CN114302038B CN114302038B CN202111594103.1A CN202111594103A CN114302038B CN 114302038 B CN114302038 B CN 114302038B CN 202111594103 A CN202111594103 A CN 202111594103A CN 114302038 B CN114302038 B CN 114302038B
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- fins
- heat
- camera
- inner cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 100
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000012782 phase change material Substances 0.000 claims abstract description 28
- 238000004891 communication Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 12
- 238000000034 method Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
Landscapes
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The application discloses a camera structure and electronic equipment, the camera structure includes: a holder housing; the camera body is arranged on the holder shell and is provided with a substrate; the first heat dissipation piece comprises a first body and a plurality of first heat dissipation fins arranged on the first body, the first body is provided with a first inner cavity, a phase change material is arranged in the first inner cavity, and the first body is arranged on the substrate. In the embodiment of the application, the first heat dissipation piece is arranged on the substrate of the camera body, the first body of the first heat dissipation piece is arranged on the substrate, the plurality of first heat dissipation fins are arranged on the first body, the first body is provided with the first inner cavity, and the heat dissipation effect of the camera body can be improved through the phase change material in the first inner cavity and the first heat dissipation fins.
Description
Technical Field
The application belongs to the technical field of electronics, and particularly relates to a camera structure and electronic equipment.
Background
In the related art, a camera on an electronic device needs to be provided with a holder anti-shake device, the camera is arranged in the holder anti-shake device, and when the camera works, the holder anti-shake device drives the camera to move. The camera is installed and is led to the radiating effect of camera to worsen in cloud platform anti-shake device, and the heat is difficult to dispel, has seriously influenced the normal work of camera.
Disclosure of Invention
The application aims to provide a camera structure and electronic equipment, which can improve the heat radiation capability of a camera body.
In order to solve the technical problems, the application is realized as follows:
in a first aspect, an embodiment of the present application proposes a camera structure, including:
a holder housing;
the camera body is arranged on the holder shell and is provided with a substrate;
The first heat dissipation piece comprises a first body and a plurality of first heat dissipation fins arranged on the first body, the first body is provided with a first inner cavity, a phase change material is arranged in the first inner cavity, and the first body is arranged on the substrate.
In a second aspect, an embodiment of the present application proposes an electronic device, which includes a camera structure as described in the first aspect.
In the embodiment of the application, the first heat dissipation piece is arranged on the substrate of the camera body, the first body of the first heat dissipation piece is arranged on the substrate, the plurality of first heat dissipation fins are arranged on the first body, the first body is provided with the first inner cavity, and the heat dissipation effect of the camera body can be improved through the phase change material in the first inner cavity and the first heat dissipation fins.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is one of the structural schematic diagrams of a camera structure according to an embodiment of the present application;
FIG. 2 is a second schematic diagram of a camera structure according to an embodiment of the application;
FIG. 3 is a third schematic diagram of a camera structure according to an embodiment of the application;
fig. 4 is a schematic structural diagram of a camera structure according to an embodiment of the present application.
Reference numerals:
1. A holder housing; 11. a cradle head power assembly; 2. a camera body; 21. a substrate; 22. a flexible circuit board; 31. a first body; 310. a first lumen; 32. a first heat dissipation fin; 320. a second lumen; 41. a second body; 410. a fourth lumen; 42. a second heat dissipation fin; 420. a third lumen; 5. and a heat conducting layer.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The features of the application "first", "second" and the like in the description and in the claims may be used for the explicit or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
A camera structure and an electronic device according to an embodiment of the present application are described below with reference to fig. 1 to 4.
As shown in fig. 1-2, a camera structure according to some embodiments of the application includes:
Cradle head housing 1.
The camera body 2, the camera body 2 set up in tripod head casing 1, the camera body 2 is provided with base plate 21.
The first heat dissipation element comprises a first body 31 and a plurality of first heat dissipation fins 32 arranged on the first body 31, the first body 31 is provided with a first inner cavity 310, a phase change material is arranged in the first inner cavity 310, and the first body 31 is arranged on the substrate 21.
In this embodiment, a first heat dissipation member is disposed on the substrate 21 of the camera body 2, the first body 31 of the first heat dissipation member is disposed on the substrate 21, the plurality of first heat dissipation fins 32 are disposed on the first body 31, the first body 31 has a first inner cavity 310, and the heat dissipation effect of the camera body can be improved through the phase change material in the first inner cavity 310 and the first heat dissipation fins 32.
The phase change material PHASE CHANGE MATERIAL, PCM is a substance which changes a state of a substance and can provide latent heat under the condition of constant temperature. The process of transforming physical properties is known as the phase change process, in which a phase change material will absorb or release a large amount of latent heat.
In the working process of the camera body 2, the camera body 2 is driven by the cradle head power assembly 11 so as to enable the camera body 2 to move to different positions. In order to meet the movement requirement of the camera body 2, an interval space is reserved between the camera body 2 and the holder shell 1. For example, a space is provided between the substrate 21 and the holder case 1. The first heat dissipation element is disposed on the substrate 21, so that the first heat dissipation element is located in a high-spaced space, and the space volume inside the holder housing 1 does not need to be increased, thereby avoiding the increase of the volume occupied by the holder.
The camera body 2 operates to generate heat, which is transferred to the first heat sink through the substrate 21. The phase change material in the first cavity 310 is capable of absorbing heat to reduce heat build-up of the camera body 2 itself. The heat absorbed by the phase change material can be dissipated through the first body 31 and the first heat dissipation fins 32, so that heat accumulation of the substrate 21 is avoided, and the heat dissipation effect of the substrate 21 is improved.
For example, the substrate 21 is warmed up during the operation of the camera body 2. The heating of the substrate 21 heats up the first body 31, thereby activating the phase change material within the first cavity 310 to absorb heat. The first body 31 and the first heat dissipation fins 32 can dissipate heat outwards, and when the temperature of the substrate 21 is reduced, the phase change material is excited to release heat. This effectively prevents the substrate 21 from becoming too high in temperature, and improves the heat dissipation effect. The substrate 21 is electrically connected to an external device through a flexible wiring board 22.
In one embodiment, the phase change material is a solid-liquid phase change material. The phase change material liquefies when absorbing heat and solidifies when releasing heat.
For example, the phase change material is an inorganic crystalline hydrated salt, an organic paraffin, a fatty acid, or the like.
In one embodiment, the first body 31 is plate-shaped.
In this embodiment, the plate-shaped first body 31 can be adhered to the substrate 21 to have a larger contact area, so that the heat of the substrate 21 is more easily conducted to the first body 31, and the phase change material in the first cavity 310 is more easily acted.
For example, the heat conducting layer 5 is disposed between the substrate 21 and the first heat sink, and the heat conducting layer 5 can improve the heat conduction efficiency between the substrate 21 and the first heat sink.
For example, the heat conductive layer 5 is provided between the first body 31 and the substrate 21. The heat conductive layer 5 may be a heat conductive paste or solder paste, and the first body 31 is adhered to the substrate 21 by means of the heat conductive paste or solder.
In one embodiment, the first heat dissipating fin 32 has a second cavity 320, the first cavity 310 is in communication with the second cavity 320, and the phase change material is disposed in the first cavity 310 and the second cavity 320.
In this embodiment, the phase change materials are disposed in the first body 31 and the first heat dissipation fins 32, so that the amount of the phase change material of the first heat dissipation member is increased, and more heat can be applied, and the heat dissipation effect is improved.
In addition, the phase change material in the first heat dissipation fin 32 enables heat to be accumulated in the first heat dissipation fin 32, so that heat can be conducted to the first heat dissipation fin 32, and the heat dissipation effect of the first heat dissipation fin 32 is increased.
In one embodiment, as shown in fig. 1 to 4, the plurality of first heat dissipation fins 32 are sequentially arranged on the surface of the first body 31, where the surface of the first body 31 has a first area and a second area, and the second area is located on a peripheral side of the first area.
Among the plurality of first heat dissipation fins 32, one part is located in a first area, the other part is located in a second area, and in a direction perpendicular to the surface of the first body 31, the size of the first heat dissipation fin 32 located in the first area is larger than the size of the first heat dissipation fin 32 located in the second area.
In this embodiment, the first region is located in the middle region of the first body 31, and the second region is located in the peripheral region of the first region. The size of the first heat dissipation fins 32 in the middle area is smaller, so that the camera body 2 can avoid collision contact between the first heat dissipation fins 32 and the holder shell 1 in the rotating process, and the problem of component damage is avoided.
In one embodiment, the plurality of first heat dissipation fins 32 decrease in size in a direction perpendicular to the surface of the first body 31 in a direction from the first region toward the second region.
In this embodiment, the first heat dissipation fins 32 located at the central region change in size gradually from the first heat dissipation fins 32 located at the peripheral side. This causes the ends of the plurality of first heat radiating fins 32 remote from the first body 31 to overall take on an arcuate change.
In the process of rotating the camera body 2, as shown in fig. 1 and fig. 2, the collision between the first heat dissipation fins 32 and the pan-tilt housing 1 can be effectively avoided.
In an embodiment, as shown in fig. 3 and 4, the plurality of second heat dissipation fins 42 on the pan-tilt housing 1 and the plurality of second heat dissipation fins 42 are staggered with the plurality of first heat dissipation fins 32, a third inner cavity 420 is disposed in the second heat dissipation fins 42, and the third inner cavity 420 is provided with a phase change material.
In this embodiment, when the first heat sink absorbs the heat of the substrate 21, the heat radiated through the first heat sink can be radiated to the second heat radiating fins 42. The second heat dissipation fins 42 are located on the holder housing 1, and heat of the second heat dissipation fins 42 can be dissipated to the outside through the holder housing 1, so that the heat dissipation effect is improved.
The second heat dissipation fins 42 and the first heat dissipation fins 32 are arranged in a staggered manner, so that the interval distance between the first heat dissipation piece and the second heat dissipation piece is reduced, the efficiency of heat conduction from the first heat dissipation piece to the second heat dissipation piece is improved, and the heat dissipation effect is improved.
Each second heat dissipation fin 42 and each first heat dissipation fin 32 are arranged in a staggered manner, and are provided with a space, and under the condition that the camera body 2 rotates, the first heat dissipation fins 32 swing in the space, so that the second heat dissipation fins 42 are prevented from influencing the rotation of the camera body 2.
In one embodiment, the holder housing 1 further includes a second body 41, and the plurality of second heat dissipating fins 42 are disposed on the second body 41. The second body 41 and the plurality of second heat dissipation fins 42 form a second heat dissipation element, and heat of the first heat dissipation element can be dissipated to the second heat dissipation element.
A fourth inner cavity 410 is disposed in the second body 41, the fourth inner cavity 410 is communicated with the third inner cavity 420, and a phase change material is disposed in the fourth inner cavity 410.
In this embodiment, the second body 41 increases the amount of the phase change material in the second heat sink, thereby improving the ability of the second heat sink to absorb and convert heat and improving the heat dissipation effect.
In one embodiment, as shown in fig. 3 and 4, a part of the second heat dissipation fins 42 is disposed opposite to the first region, and another part is disposed opposite to the second region, and the second heat dissipation fins 42 disposed opposite to the first region have a larger size than the second heat dissipation fins 42 disposed opposite to the second region in a direction perpendicular to a surface on which the second heat dissipation fins 42 are disposed.
In this embodiment, among the plurality of second heat dissipation fins 42, a portion of the second heat dissipation fins 42, which is located opposite to the first region, has a larger dimension in a direction perpendicular to a surface on which the second heat dissipation fins are located. The second heat dissipation fins 42 of this portion are smaller in size in the peripheral side region disposed opposite to the second region.
The second heat dissipating fins 42 have a distribution structure with a middle portion higher than the first heat dissipating member and two sides lower than the second heat dissipating member, and the middle portion is closer to the first heat dissipating member and has a higher heat transfer effect. The size of the peripheral side area is smaller, the first heat dissipation piece is prevented from being blocked, and the rotation of the first heat dissipation piece along with the camera body 2 is not influenced.
In one embodiment, the plurality of the second heat dissipation fins 42 decrease in size in a direction perpendicular to the surface on which the second heat dissipation fins 42 are located in a direction along the first region toward the second region.
In this embodiment, the second heat dissipation fins 42 located at the middle region change in size gradually from the second heat dissipation fins 42 located at the peripheral side. This causes the ends of the plurality of second heat dissipating fins 42 facing the first heat dissipating fins 32 to generally assume an arcuate change.
The end portions of the plurality of second heat dissipation fins 42 are arc-shaped, so that the middle regions of the plurality of second heat dissipation fins 42 protrude toward the first heat dissipation fins 32. In this way, when the first heat dissipation fin 32 swings with the rotation of the camera body 2, the second heat dissipation fin 42 can be prevented from colliding with the first heat dissipation fin 32.
An electronic device according to some embodiments of the present application includes a camera structure according to any one of the embodiments of the present application.
In this embodiment, in the process of working the camera structure on the electronic device, the heat generated by the camera body 2 can be better dissipated, so that the heat dissipation efficiency is improved. Avoiding heat build-up on the substrate 21 reduces the impact on the camera body 2.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.
Claims (9)
1. A camera structure, comprising:
a holder housing;
the camera body is arranged on the holder shell and is provided with a substrate;
The first heat dissipation piece comprises a first body and a plurality of first heat dissipation fins arranged on the first body, the first body is provided with a first inner cavity, a phase change material is arranged in the first inner cavity, and the first body is arranged on the substrate;
The camera comprises a holder shell, and is characterized in that a plurality of second radiating fins are arranged on the holder shell, the second radiating fins and the first radiating fins are staggered, a space is reserved between the first radiating fins and the second radiating fins, a third inner cavity is arranged in the second radiating fins, a phase-change material is arranged in the third inner cavity, and under the condition that the camera body rotates, the first radiating fins can swing in the space.
2. The camera structure of claim 1, wherein the first heat dissipating fin has a second cavity, the first cavity is in communication with the second cavity, and the phase change material is disposed in the first cavity and the second cavity.
3. The camera structure according to claim 1, wherein the plurality of first heat dissipation fins are sequentially arranged on the surface of the first body, the surface of the first body has a first area and a second area, and the second area is located on the periphery of the first area;
And in the plurality of first heat dissipation fins, one part of the first heat dissipation fins are positioned in a first area, the other part of the first heat dissipation fins are positioned in a second area, and the size of the first heat dissipation fins positioned in the first area is larger than that of the first heat dissipation fins positioned in the second area in the direction perpendicular to the surface of the first body.
4. A camera structure as recited in claim 3, wherein the plurality of first heat dissipating fins decrease in size in a direction perpendicular to the surface of the first body in a direction along the first region toward the second region.
5. The camera structure according to claim 1, wherein the holder housing is further provided with a second body, and the plurality of second heat dissipation fins are disposed on the second body;
the second body is internally provided with a fourth inner cavity, the fourth inner cavity is communicated with the third inner cavity, and a phase change material is arranged in the fourth inner cavity.
6. The camera structure of claim 1, wherein a portion of the plurality of second heat dissipating fins is disposed opposite to the first region, and another portion of the plurality of second heat dissipating fins is disposed opposite to the second region, and a size of the second heat dissipating fins disposed opposite to the first region is larger than a size of the second heat dissipating fins disposed opposite to the second region in a direction perpendicular to a surface on which the second heat dissipating fins are disposed.
7. The camera structure of claim 6, wherein the plurality of second heat dissipating fins decrease in size in a direction perpendicular to a surface on which the second heat dissipating fins are located in a direction along the first region toward the second region.
8. The camera structure of claim 1, wherein the first body is plate-shaped.
9. An electronic device comprising a camera structure as claimed in any one of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111594103.1A CN114302038B (en) | 2021-12-22 | 2021-12-22 | Camera structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111594103.1A CN114302038B (en) | 2021-12-22 | 2021-12-22 | Camera structure and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114302038A CN114302038A (en) | 2022-04-08 |
| CN114302038B true CN114302038B (en) | 2024-05-14 |
Family
ID=80970527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111594103.1A Active CN114302038B (en) | 2021-12-22 | 2021-12-22 | Camera structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114302038B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008131398A (en) * | 2006-11-21 | 2008-06-05 | Sony Corp | Heat dissipation structure of imaging apparatus and imaging apparatus |
| CN101964868A (en) * | 2007-05-01 | 2011-02-02 | 奥林巴斯映像株式会社 | Portable electron device |
| CN105351899A (en) * | 2015-09-23 | 2016-02-24 | 华南理工大学 | LED heat-dissipating device adopting semiconductor refrigerating plate and phase change materials |
| CN207947792U (en) * | 2018-01-17 | 2018-10-09 | 泉州市中骁智能科技有限公司 | A kind of security monitoring optical fiber storage area network equipment |
| CN109348090A (en) * | 2018-02-28 | 2019-02-15 | 华核（天津）新技术开发有限公司 | The infrared line-scan digital camera of accurate temperature controller type and control method |
| CN210319741U (en) * | 2019-09-05 | 2020-04-14 | 育笙科技（深圳）有限公司 | High-efficient radiating control street lamp |
| WO2020155900A1 (en) * | 2019-01-29 | 2020-08-06 | 株洲智热技术有限公司 | Phase change heat radiating device |
| CN211791713U (en) * | 2020-04-23 | 2020-10-27 | 维沃移动通信有限公司 | Cloud platform camera and electronic equipment |
| CN112003487A (en) * | 2020-07-24 | 2020-11-27 | 华为技术有限公司 | Heat dissipation device, inverter and electronic equipment |
| WO2021063312A1 (en) * | 2019-09-30 | 2021-04-08 | 长城汽车股份有限公司 | Lighting device and vehicle |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011221159A (en) * | 2010-04-07 | 2011-11-04 | Seiko Epson Corp | Heat dissipating member, electro-optical device, and electronic apparatus |
| CN112804412A (en) * | 2019-10-28 | 2021-05-14 | 晋城三赢精密电子有限公司 | Camera module and electronic device |
-
2021
- 2021-12-22 CN CN202111594103.1A patent/CN114302038B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008131398A (en) * | 2006-11-21 | 2008-06-05 | Sony Corp | Heat dissipation structure of imaging apparatus and imaging apparatus |
| CN101964868A (en) * | 2007-05-01 | 2011-02-02 | 奥林巴斯映像株式会社 | Portable electron device |
| CN105351899A (en) * | 2015-09-23 | 2016-02-24 | 华南理工大学 | LED heat-dissipating device adopting semiconductor refrigerating plate and phase change materials |
| CN207947792U (en) * | 2018-01-17 | 2018-10-09 | 泉州市中骁智能科技有限公司 | A kind of security monitoring optical fiber storage area network equipment |
| CN109348090A (en) * | 2018-02-28 | 2019-02-15 | 华核（天津）新技术开发有限公司 | The infrared line-scan digital camera of accurate temperature controller type and control method |
| WO2020155900A1 (en) * | 2019-01-29 | 2020-08-06 | 株洲智热技术有限公司 | Phase change heat radiating device |
| CN210319741U (en) * | 2019-09-05 | 2020-04-14 | 育笙科技（深圳）有限公司 | High-efficient radiating control street lamp |
| WO2021063312A1 (en) * | 2019-09-30 | 2021-04-08 | 长城汽车股份有限公司 | Lighting device and vehicle |
| CN211791713U (en) * | 2020-04-23 | 2020-10-27 | 维沃移动通信有限公司 | Cloud platform camera and electronic equipment |
| CN112003487A (en) * | 2020-07-24 | 2020-11-27 | 华为技术有限公司 | Heat dissipation device, inverter and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114302038A (en) | 2022-04-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4029822B2 (en) | Electronic circuit equipment | |
| US20020033247A1 (en) | Use of PCMs in heat sinks for electronic components | |
| TWI483099B (en) | Phase change type heat dissipating device | |
| JP2009124091A (en) | Semiconductor package module | |
| KR100939992B1 (en) | Cooling Apparatus, and Electric-Electronic Equipment with the Cooling Apparatus | |
| CN114302038B (en) | Camera structure and electronic equipment | |
| CN107333033B (en) | Camera and mobile terminal | |
| WO2014140098A1 (en) | Heat spreader with flat pipe cooling element | |
| TWI497656B (en) | Electronic device | |
| JP2007019130A (en) | Heat dissipator | |
| JP4278720B2 (en) | Plate heat pipe | |
| CN218632017U (en) | Heat dissipation device, circuit board and battery module | |
| JP5100165B2 (en) | Cooling board | |
| JP2015075312A (en) | Phase change module and electronic equipment device mounted with the same | |
| JPH11214877A (en) | Cooling device of electronic equipment and its cooling fan | |
| KR101917342B1 (en) | The heat dissipation structure of waterproof and dustproof motor | |
| EP4239671A1 (en) | Phase change liquid cooling heat dissipation device | |
| CN111106079B (en) | Heat dissipation chip, manufacturing method thereof and electronic equipment | |
| CN211152537U (en) | Server radiator | |
| TWI492341B (en) | Phase change type heat dissipating device | |
| JP3332858B2 (en) | Plate type heat pipe and cooling structure using it | |
| CN214954896U (en) | Adhesive sheet type semiconductor electronic refrigeration sheet radiating fan | |
| CN213638713U (en) | Heat radiation structure and electronic equipment | |
| JP2004311464A (en) | Semiconductor device | |
| CN214381564U (en) | Circuit board structure with can accomodate mounting panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |