CN212848380U - Phase change liquid cooling heat abstractor - Google Patents
Phase change liquid cooling heat abstractor Download PDFInfo
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- CN212848380U CN212848380U CN202022501236.7U CN202022501236U CN212848380U CN 212848380 U CN212848380 U CN 212848380U CN 202022501236 U CN202022501236 U CN 202022501236U CN 212848380 U CN212848380 U CN 212848380U
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Abstract
The application discloses a phase change liquid cooling heat dissipation device. The phase change liquid cooling heat dissipation device sequentially comprises from top to bottom: the heat absorption mechanism of the water cooling module is fixedly arranged with the phase change energy storage module and the heat conduction cavity from top to bottom respectively, and the heat conduction cavity is arranged on the CPU; the heat conduction cavity is filled with water, the ratio of the addition amount of the water to the volume in the heat conduction cavity is 0.2-0.9, and the heat conduction cavity is made of red copper; and the phase-change energy storage module is filled with phase-change materials. The CPU solves the technical problems that the CPU in the computer cannot be normally used due to the fact that the CPU cannot rapidly dissipate heat under an overload state, the performance of the CPU is reduced, the service life of the CPU is shortened, and the computer cannot be normally used.
Description
Technical Field
The application relates to the technical field of electronic temperature control, in particular to a heat dissipation device in a computer, and particularly relates to a phase-change liquid cooling heat dissipation device for heat dissipation in an overload state of a CPU.
Background
A Central Processing Unit (CPU) is one of the core electronic components of a computer, and as the demand for computer power increases and various large-scale software and games are rapidly developed, the CPU has an increasing computational load. At present, the CPU power consumption of a computer reaches about 80W, and a high-power and high-frequency computer can cause the temperature of the CPU to rise, shorten the service life of the CPU and reduce the performance of the CPU.
The normal operating temperature of the CPU is typically maintained between 45 c and 55 c. At present, heat dissipation equipment in the existing computer mainly comprises heat dissipation aluminum and a fan, wherein a power supply is used for driving the fan in the use process so as to achieve the purpose of rapid heat dissipation, and the mode is high in electric energy consumption and high in power. The most important point is that when the CPU exceeds the state that the heat sink can dissipate heat, the following steps are carried out: when the heat dissipation device cannot meet the condition that the CPU is overheated, namely the CPU can work continuously in an overload state sometimes, the heat generated by the CPU exceeds the preset temperature, the heat dissipation fan cannot take away the heat quickly, and the CPU works at a higher temperature, so that the technical problems of CPU performance reduction and service life reduction are caused. The invention solves the technical problem that the CPU in the computer can not be normally used because the CPU can not rapidly dissipate heat under the overload state, thereby reducing the performance of the CPU and the service life of the CPU. In view of the above problems, no effective solution has been proposed.
Disclosure of Invention
The main objective of the present application is to provide a phase change liquid cooling heat dissipation device to solve the technical problem that the CPU performance of the CPU and the service life of the CPU are reduced due to the inability of the CPU to dissipate heat quickly under an overload state, thereby causing the inability of the computer to be used normally. The invention can effectively solve the technical problem that the CPU can not rapidly dissipate heat in an overload working state, and can effectively prevent the damage of the CPU caused by the failure of timely heat dissipation in an overheat state.
In order to achieve the above object, according to one aspect of the present application, there is provided a phase-change liquid-cooled heat sink comprising, in order from top to bottom: the heat absorption mechanism of the water cooling module is fixedly arranged with the phase change energy storage module and the heat conduction cavity from top to bottom respectively, and the heat conduction cavity is arranged on the CPU; the heat conduction cavity is filled with water, the ratio of the addition amount of the water to the volume in the heat conduction cavity is 0.2-0.9, and the heat conduction cavity is made of red copper; and the phase-change energy storage module is filled with phase-change materials. The heat conducting cavity mainly transfers heat to the water cooling module through liquid water in the heat conducting cavity and the wall of the heat conducting cavity, a heat absorbing mechanism of the water cooling module is mainly arranged between the phase change energy storage module and the heat conducting cavity, and heat is dissipated through a heat dissipating mechanism of the water cooling module after heat absorption. When the CPU is in an overload state, the phase change energy storage module starts to play a role, the phase change material in the phase change energy storage module can absorb heat, when the CPU recovers to a normal state, the phase change material releases the heat to the water cooling module, the normal state is recovered, and the buffer protection effect of the CPU at the overload peak moment is achieved. Fill water and the addition of water and the volume ratio in the heat conduction cavity is 0.2 ~ 0.9, has liquid water and air bed in the heat conduction cavity promptly, adopts liquid water evaporation back, gives the water-cooling module through vapor transmission, and efficiency is higher. The heat conduction cavity is made of red copper, and the red copper has good heat conductivity, is not easy to rust, and has long service time and good durability. The upper part and the lower part of the heat absorption mechanism of the water cooling module are fixedly installed with the phase change energy storage module and the heat conduction cavity in an attached mode by using strong glue, and other fixing modes are not limited to be fixed. The water cooling module may also be referred to as a liquid cooling module.
Preferably, the phase change energy storage module comprises a closed energy storage cavity and a first radiating fin, the first radiating fin is arranged in the energy storage cavity, and the phase change material is filled in the energy storage cavity.
Preferably, the first heat dissipation fin and the energy storage cavity are integrally formed.
Preferably, the phase change material in the phase change energy storage module is a phase change material with a phase change point of 56-75 ℃, and further preferably, the phase change material with a phase change point of 56-65 ℃. Of course, when the phase-change material is selected, the selection is carried out according to the normal temperature of the CPU and the limit temperature of the CPU, and generally, the temperature is 5-10 ℃ higher than the normal working temperature of the CPU. The normal working temperature of a general CPU is 45-55 ℃, so that a phase change material with a phase change point of 56-65 ℃ is selected.
Preferably, the water cooling module includes: the heat absorption mechanism is used for absorbing heat transferred by the heat conduction cavity, the heat absorption mechanism, the cooling liquid pump and the heat dissipation mechanism are connected through hoses, and the cooling liquid pump drives water in the heat absorption mechanism and water in the heat dissipation mechanism to circulate.
Preferably, the heat absorbing mechanism includes: the liquid water is filled in the heat transfer cavity, and the heat transfer cavity is made of red copper. The heat absorption mechanism is mainly used for absorbing heat transferred by the heat conduction cavity.
Preferably, a temperature sensor is mounted in the heat transfer cavity of the heat sink mechanism. The temperature sensor can measure the heat in the heat absorption mechanism, and the gear size of a fan in the heat dissipation mechanism can be adjusted conveniently.
Preferably, the heat dissipation mechanism includes: the liquid water is filled in the metal pipeline, and the fan releases the heat of the third radiating fin and the metal pipeline into the air.
Preferably, the third fin is a "W-shaped" fin. The W-shaped radiating fins can radiate heat more quickly.
Preferably, the ratio of the addition amount of water in the heat conduction cavity to the volume in the heat conduction cavity is 0.4-0.6, and the air pressure in the heat conduction cavity is less than 1.01 multiplied by 105Pa. I.e. heat conductionThe air in the cavity is pumped to low pressure which is less than the standard atmospheric pressure, and the temperature of the liquid water vaporization is reduced. In the heat transfer process, the water in the heat conduction cavity continuously generates vaporization and liquefaction reactions, continuously absorbs and releases heat, and the overall heat dissipation and heat conduction efficiency is improved.
The basic working process of the phase-change liquid cooling heat dissipation device is as follows: when the temperature of the CPU rises, heat is transferred to the water cooling module through liquid water and water vapor in the heat conduction cavity, and heat is dissipated through the water cooling module. When the temperature exceeds the radiating temperature of the water cooling module, the CPU is in an overload state, and when the temperature exceeds the phase change point of the phase change material in the phase change energy storage module, the phase change energy storage module starts to work, the phase change material is liquefied, a large amount of heat is quickly absorbed, and the temperature of the water cooling module is prevented from rising. When the CPU recovers the normal load, the water cooling module can return to the normal temperature zone below the phase change point. And the liquefied phase-change material releases heat to be solidified again along with the temperature reduction, the heat absorbed during the peak is returned to the water cooling module, and the heat is dissipated in the air through the heat dissipation mechanism of the water cooling module. In the process, the phase change material absorbs or releases partial heat through phase state change to prevent the temperature of the CPU from rising, so that the stable operation of the system is protected.
In this application, adopt the mode of phase change energy storage module, water-cooling module, the three-layer structure of heat conduction cavity, through the produced effect of phase change energy storage module, reached CPU under overload state, reduced CPU's temperature, make CPU can normally work under normal temperature, solved the CPU in the computer, because CPU under overload state, CPU performance, the CPU life that leads to can't dispel the heat fast all descend, and then lead to the unable technical problem of normal use of computer.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, serve to provide a further understanding of the application and to enable other features, objects, and advantages of the application to be more apparent. The drawings and their description illustrate the embodiments of the invention and do not limit it. In the drawings:
FIG. 1 is a schematic diagram of a phase change, liquid cooled heat sink according to the present application;
fig. 2 is a structural view of the inside of a heat absorbing mechanism of a phase-change liquid-cooled heat dissipating device according to an embodiment of the present application;
fig. 3 is an internal structure view of a phase change energy storage module of a phase change liquid cooling heat dissipation device according to an embodiment of the present application;
wherein the reference numerals in the figures denote: 1. a phase change energy storage module; 2. a water cooling module; 3. a heat conducting cavity; 4. a CPU; 5. an energy storage cavity; 6. a first heat sink; 7. a heat absorbing mechanism; 8. a coolant pump; 9. a heat dissipation mechanism; 10. a hose; 11. a heat transfer cavity; 12. a second heat sink; 13. a third heat sink; 14. a metal pipe; 15. a fan; 16. a main board; 17. a temperature sensor; 18. a power source; 19. a control panel; 20. and a guide isolation plate.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the term "comprising" is intended to cover a non-exclusive inclusion.
In the present application, the terms "upper" and "lower" indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the specific orientation of the indicated devices or components.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1 to 3, the present application relates to a phase-change liquid-cooled heat sink, which comprises, in order from top to bottom: the heat absorption mechanism 7 of the water cooling module is fixedly arranged with the phase change energy storage module and the heat conduction cavity respectively from top to bottom, and the heat conduction cavity is arranged on the CPU 4; the heat conduction cavity is filled with water, the ratio of the addition amount of the water to the volume in the heat conduction cavity is 0.2-0.9, and the heat conduction cavity is made of red copper; and the phase-change energy storage module is filled with phase-change materials. The heat conducting cavity mainly transfers heat to the water cooling module through liquid water in the heat conducting cavity and the wall of the heat conducting cavity, a heat absorbing mechanism of the water cooling module is mainly arranged between the phase change energy storage module and the heat conducting cavity, and heat is dissipated through a heat dissipating mechanism of the water cooling module after heat absorption. When the CPU is in an overload state, the phase change energy storage module starts to play a role, the phase change material in the phase change energy storage module can absorb heat, when the CPU recovers to a normal state, the phase change material releases the heat to the water cooling module, the normal state is recovered, and the buffer protection effect of the CPU at the overload peak moment is achieved. Fill water and the addition of water and the internal volume ratio of heat conduction cavity are 0.5 in the heat conduction cavity, have liquid water and air bed in the heat conduction cavity promptly, adopt liquid water evaporation back, give the water-cooling module through vapor transmission, efficiency is higher. The heat conduction cavity is made of red copper, and the red copper has good heat conductivity, is not easy to rust, and has long service time and good durability. The CPU is mounted on the motherboard 16.
As shown in fig. 1-3, the phase change energy storage module includes a sealed energy storage cavity 5 and a first heat sink 6, the first heat sink is disposed in the energy storage cavity, and the phase change material is filled in the energy storage cavity. The first radiating fin and the energy storage cavity are integrally formed.
The phase change material in the phase change energy storage module has a phase change point of 59 ℃. The phase change material with the phase change point of 59 ℃ can ensure that the CPU works normally and efficiently, the normal working temperature range of the CPU is 45-55 ℃, and when the temperature exceeds 59 ℃, the phase change energy storage module plays a role.
As shown in fig. 1 to 3, the water cooling module includes: the heat absorption mechanism 7, the cooling liquid pump 8 and the heat dissipation mechanism 9 are connected through a hose 10, and the cooling liquid pump drives water in the heat absorption mechanism and water in the heat dissipation mechanism to realize circulation. The cooling liquid pump 8 is electrically connected with a power supply 18, the power supply 18 is electrically connected with a control panel 19, the control panel is used for controlling the gear of the fan and the switch of the cooling liquid pump, the temperature sensor 17 is electrically connected with the control panel, and the control panel is electrically connected with the power supply.
As shown in fig. 2, the heat absorbing mechanism includes: the heat transfer cavity body 11 and second fin 12, the second fin is fixed in the heat transfer cavity body, and liquid water fills in the heat transfer cavity body, and the heat transfer cavity body is made for red copper material. The heat absorption mechanism is mainly used for absorbing heat transferred by the heat conduction cavity. In figure 2, 2 guide isolation plates 20 are further arranged, the length of each guide isolation plate is smaller than that of the second radiating fin, and the guide isolation plates mainly play a role in backflow of liquid water.
A temperature sensor can be arranged in the heat transfer cavity of the heat absorption mechanism. The temperature sensor can measure the heat in the heat absorption mechanism, and the gear size of a fan in the heat dissipation mechanism can be conveniently adjusted through the control panel. The temperature sensor is electrically connected with the control panel, and when the temperature sensor exceeds the normal temperature, the gear of the fan is adjusted, the operation of the fan is accelerated, and the heat dissipation capacity is increased.
As shown in fig. 1 to 3, the heat dissipation mechanism includes: the heat dissipation device comprises a third heat dissipation fin 13, a metal pipeline 14, a fan 15 and a control panel, wherein the control panel is a small-sized controller, liquid water is filled in the metal pipeline, and the fan dissipates heat of the third heat dissipation fin and the metal pipeline into air. The third radiating fin is a W-shaped radiating fin. The W-shaped radiating fins can radiate heat more quickly.
As shown in FIG. 1, the air pressure in the heat-conducting cavity is less than 0.8 × 105Pa. Namely, the air in the heat conduction cavity is pumped into low pressure which is less than the standard atmospheric pressure, and the temperature of the liquid water vaporization is reduced. In the heat transfer process, the water in the heat conduction cavity continuously generates vaporization and liquefaction reactions, continuously absorbs and releases heat, and the overall heat dissipation and heat conduction efficiency is improved.
The basic working process of the phase-change liquid cooling heat dissipation device is as follows: when the temperature of the CPU rises, heat is transferred to the water cooling module through liquid water and water vapor in the heat conduction cavity, and heat is dissipated through the water cooling module. When the temperature exceeds the radiating temperature of the water cooling module, the CPU is in an overload state, and when the temperature exceeds the phase change point of the phase change material in the phase change energy storage module, the phase change energy storage module starts to work, the phase change material is liquefied, a large amount of heat is quickly absorbed, and the temperature of the water cooling module is prevented from rising. When the CPU recovers the normal load, the water cooling module can return to the normal temperature zone below the phase change point. And the liquefied phase-change material releases heat to be solidified again along with the temperature reduction, the heat absorbed during the peak is returned to the water cooling module, and the heat is dissipated in the air through the heat dissipation mechanism of the water cooling module. In the process, the phase change material absorbs or releases partial heat through phase state change to prevent the temperature of the CPU from rising, so that the stable operation of the system is protected.
In this embodiment, the mode that adopts phase change energy storage module, water-cooling module, heat conduction cavity three-layer structure, through the produced effect of phase change energy storage module, reached CPU under overload state, reduced CPU's temperature, make CPU can normally work under normal temperature, solved the CPU in the computer, because CPU under overload state, CPU performance, the CPU life that leads to can't dispel the heat fast all descend, and then lead to the unable technical problem of normal use of computer.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (9)
1. A phase change liquid cooling heat sink, comprising: the phase change energy storage module (1), the water cooling module (2) and the heat conduction cavity (3), wherein a heat absorption mechanism (7) of the water cooling module is fixedly installed with the phase change energy storage module and the heat conduction cavity up and down respectively, and the heat conduction cavity is attached to the CPU (4); the heat conduction cavity is filled with water, the ratio of the addition amount of the water to the volume in the heat conduction cavity is 0.2-0.9, and the heat conduction cavity is made of red copper; the phase change energy storage module (1) is filled with phase change materials.
2. The phase-change liquid cooling heat dissipation device according to claim 1, wherein the phase-change energy storage module (1) comprises a closed energy storage cavity (5) and a first heat dissipation fin (6), the first heat dissipation fin is arranged in the energy storage cavity, and the phase-change material is filled in the energy storage cavity.
3. A phase change liquid cooled heat sink according to claim 2, wherein the first fins (6) are integrally formed with the energy storage cavity.
4. The phase-change liquid-cooled heat sink according to claim 1, wherein the water-cooling module comprises: the heat absorption mechanism is used for absorbing heat transferred by the heat conduction cavity, the heat absorption mechanism, the cooling liquid pump and the heat dissipation mechanism are connected through a hose (10), and the cooling liquid pump drives water in the heat absorption mechanism and water in the heat dissipation mechanism to circulate.
5. A phase-change liquid-cooled heat sink according to claim 4, wherein the heat-absorbing structure comprises: the heat transfer cavity body (11) and second fin (12), the second fin is fixed in the heat transfer cavity body, and liquid water fills in the heat transfer cavity body, and heat transfer cavity body (11) are made for red copper material.
6. A phase-change liquid-cooled heat sink according to claim 5, wherein a temperature sensor (17) is installed in the heat transfer chamber of the heat sink.
7. A phase-change liquid-cooled heat sink according to claim 4, wherein the heat dissipation mechanism comprises: the heat exchanger comprises a third radiating fin (13), a metal pipeline (14) and a fan (15), wherein liquid water is filled in the metal pipeline, and the fan releases heat of the third radiating fin and the metal pipeline into the air.
8. A phase-change liquid-cooled heat sink according to claim 7, wherein the third fin is a "W-shaped" fin.
9. The phase-change liquid cooling heat dissipation device as claimed in claim 1, wherein the ratio of the addition amount of water in the heat conduction cavity (3) to the volume in the heat conduction cavity is 0.4-0.6, and the air pressure in the heat conduction cavity is less than 1.01 x 105Pa。
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112201637A (en) * | 2020-11-03 | 2021-01-08 | 深圳市森若新材科技有限公司 | Phase change liquid cooling heat abstractor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112201637A (en) * | 2020-11-03 | 2021-01-08 | 深圳市森若新材科技有限公司 | Phase change liquid cooling heat abstractor |
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