CN216650319U - Heat dissipation device with multistage heat dissipation function - Google Patents
Heat dissipation device with multistage heat dissipation function Download PDFInfo
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- CN216650319U CN216650319U CN202122536151.7U CN202122536151U CN216650319U CN 216650319 U CN216650319 U CN 216650319U CN 202122536151 U CN202122536151 U CN 202122536151U CN 216650319 U CN216650319 U CN 216650319U
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Abstract
The utility model provides a heat dissipation device with a multistage heat dissipation function, which comprises a heat absorption water tank, a liquid cooling plate, a water pump, a water cooling bar, a fan and a refrigerator, wherein the heat absorption water tank is arranged on a packaged chip; the heat absorption water tank is communicated with the water cooling bar through a water pump, the water cooling bar is communicated with the heat absorption water tank through a liquid return pipeline, and the fan is positioned above the water cooling bar; and a semiconductor refrigerator is arranged on the outer surface of the liquid return pipeline between the water cooling drain and the heat absorption water tank. By adopting the technical scheme of the utility model, when different temperatures are generated for the chip, the heat dissipation mode of the corresponding grade is correspondingly adopted for heat dissipation, and the utility model has the effects of energy saving, environmental protection and high-efficiency heat dissipation.
Description
Technical Field
The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation device with a multistage heat dissipation function.
Background
In a chip heat sink, the selection and combination of suitable convection, conduction or radiation heat conduction modes can benefit the service performance and prolong the service life of the chip. The conventional method for solving the heat dissipation problem of the chip by using the heat conduction principle generally increases the bending times of the heat pipe to increase the heat dissipation area of the heat conduction. In addition, in a common chip heat dissipation method, only a simple mechanical combination of a heat pipe, a semiconductor cooling fin, a heat dissipation fin, a fan and the like is used, and the arrangement of graded heat dissipation for the temperature change of the chip cannot be performed.
SUMMERY OF THE UTILITY MODEL
In view of the above technical problems, the present invention discloses a heat dissipation device with multi-stage heat dissipation function, which can dissipate heat at different heating temperatures of a chip by using different stages of heat dissipation methods, thereby achieving the purposes of energy saving, environmental protection, efficient heat dissipation and intelligent control.
In contrast, the technical scheme of the utility model is as follows:
a heat dissipation device with a multi-stage heat dissipation function comprises a heat absorption water tank, a liquid cooling plate, a water pump, a water cooling bar, a fan and a refrigerator, wherein the heat absorption water tank is used for being arranged on a packaged chip;
the heat absorption water tank is communicated with the water cooling bar through a water pump, the water cooling bar is communicated with the heat absorption water tank through a liquid return pipeline, and the fan is positioned above the water cooling bar;
and a semiconductor refrigerator is arranged on the outer surface of the liquid return pipeline between the water cooling drain and the heat absorption water tank.
By adopting the technical scheme, the upper surface of the heat absorption water tank is provided with the liquid cooling plate, the lower surface of the liquid cooling plate is adjacent to the upper surface of the heat absorption water tank, and a first-stage heat dissipation system is formed between the liquid cooling plate and the heat absorption water tank. Furthermore, the heat absorption water tank is communicated with the water cooling row, the cooling liquid in the heat absorption water tank can be communicated to the water cooling row, a fan is arranged on the water cooling row to cool the water cooling row, the cooling liquid with higher temperature in the heat absorption water tank can be pumped out by a water pump and is transmitted to the water cooling row, and therefore a second-stage heat dissipation system of a closed-loop channel is formed among the heat absorption water tank, the water pump, the fan, the water cooling row and the connecting pipeline. In addition, a semiconductor refrigerator is arranged on the outer surface of a liquid return pipeline between the water cooling row and the heat absorption water tank, and the semiconductor refrigerator, the heat absorption water tank, the second pipeline, the water pump and the water cooling row are combined into a third-stage heat dissipation system of the multi-stage heat radiator. Therefore, the switches of the water pump and the semiconductor refrigerator can be respectively controlled to realize multi-stage heat dissipation control according to requirements.
Furthermore, the heat absorption water tank is communicated with the water cooling row through an output pipeline, and the output pipeline is connected with a water pump.
Further, the liquid return pipeline penetrates through the semiconductor refrigerator.
Further, the cooling liquid and the liquid cooling liquid are propylene glycol, alcohol, distilled water, deionized water and the like and mixtures thereof.
As a further improvement of the utility model, the lower surface of the heat absorption water tank is provided with a heat conduction silicone layer. The lower surface is used for connection with a packaged chip. By adopting the technical scheme, the heat-conducting silicone grease layer can remove air between the packaged chip and the heat dissipation water tank, so that heat dissipation is better.
As a further improvement of the utility model, 10-30% of the volume in the liquid cooling plate is negative pressure or vacuum, and the rest is filled with liquid cooling liquid.
As a further improvement of the utility model, the upper surface of the heat absorption water tank and the lower surface of the liquid cooling plate are in the same plane.
As a further improvement of the utility model, the material of the lower surface of the heat absorption water tank is Cu, Al, Cu alloy or Al alloy.
As a further improvement of the utility model, the inner diameter of the pipeline in the water-cooling row is 6-12 mm.
As a further improvement of the utility model, the water cooling row comprises inner cavities of regularly arranged star-shaped radiation structures.
As a further improvement of the utility model, the upper surface of the semiconductor refrigerator is a semiconductor refrigeration piece, the inner wall of the semiconductor refrigeration piece is a refrigeration end, and the outer surface of the semiconductor refrigeration piece is a heating end.
As a further improvement of the utility model, the semiconductor refrigerating sheet is arranged in parallel with the fan.
As a further improvement of the utility model, the heat dissipation device with the multi-stage heat dissipation function comprises a controller and a temperature sensor arranged on the surface of a chip, wherein the water pump, the fan, the semiconductor refrigerator and the temperature sensor are connected with the controller. By adopting the technical scheme, the controller respectively controls the switch of the water pump and the semiconductor refrigerator according to the temperature information fed back by the temperature sensor, so that the graded heat dissipation control can be realized, and the energy is better saved.
Compared with the prior art, the utility model has the beneficial effects that:
by adopting the technical scheme of the utility model, when different temperatures are generated by the chips, the corresponding grade of heat dissipation mode is correspondingly adopted for heat dissipation, and the utility model has the effects of energy saving, environmental protection and high-efficiency heat dissipation.
Furthermore, in the first-stage heat dissipation system, the cooling liquid with the phase change capability in the liquid cooling plate has great heat storage capability, and the temperature of the cooling liquid gradually rises along with the input of heat until the temperature reaches the phase change temperature point. At the phase transition point, the cooling fluids exhibit the unique ability to absorb large amounts of heat at a constant temperature because they will transition from one phase state to another, which greatly reduces the volume required by conventional heat dissipating materials, while the heat dissipating system does not generate any energy consumption, resulting in energy savings and environmental benefits.
Secondly, the inside starlike radiation structure that is arranged neatly of water-cooling calandria way, this structure is compared in conventional hollow pipeline, and greatly increased coolant liquid carries out the area of heat exchange with the pipeline, and is unlikely to cause network structure to block the speed that the coolant liquid passes through under the corresponding power centre gripping of pump to reach high-efficient radiating beneficial effect.
In addition, the semiconductor refrigerator is arranged to be far away from the chip heating end, the refrigerating end of the semiconductor refrigerating piece is arranged to be the inner wall and is attached to the cooling liquid, and the structure can effectively reduce condensed water generated by reduction of saturated steam in the nearby environment due to local temperature reduction of the refrigerating end of the semiconductor refrigerating piece during working and protect electronic components from short circuit caused by the condensed water.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation device with multi-stage heat dissipation function according to the present invention.
Fig. 2 is an exploded view of a heat dissipation device with multi-stage heat dissipation function according to the present invention.
Figure 3 is an enlarged schematic cross-sectional view of a straight tube portion of the water cooled bank shown in figure 2.
The reference numerals include:
1-heat absorption water tank, 2-liquid cooling plate, 3-water pump, 4-output pipeline, 5-water cooling discharge, 6-fan, 7-semiconductor refrigerator, 8-liquid return pipeline.
Detailed Description
Preferred embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
As shown in fig. 1 to 3, a heat dissipation device with a multistage heat dissipation function includes a heat absorption water tank 1, a liquid cooling plate 2, a water pump 3, a water cooling bar 5, a fan 6 and a refrigerator, wherein the heat absorption water tank 1 is filled with a cooling liquid, the liquid cooling plate 2 is located on the upper surface of the heat absorption water tank 1, the liquid cooling plate 2 is filled with a liquid cooling liquid, and the upper surface of the heat absorption water tank 1 and the lower surface of the liquid cooling plate 2 are the same surface.
The heat absorption water tank 1 is communicated with a water cooling row 5 through an output pipeline 4, and the output pipeline 4 is connected with a water pump 3. The water cooling bar 5 is connected with the heat absorption water tank 1 through a liquid return pipeline 8, and the fan 6 is positioned above the water cooling bar 5; and a semiconductor refrigerator 7 is arranged on the outer surface of a liquid return pipeline 8 between the water cooling drain 5 and the heat absorption water tank 1, namely the liquid return pipeline 8 penetrates through the semiconductor refrigerator 7.
The lower surface of the heat absorption water tank 1 is provided with a heat conduction silicone grease layer.
The heat dissipation device with the multi-stage heat dissipation function comprises a controller and a temperature sensor arranged on the surface of a chip, wherein the water pump 3, the fan 6, the semiconductor refrigerator 7 and the temperature sensor are connected with the controller.
Further, 10-30% of the volume in the liquid cooling plate 2 is negative pressure or vacuum, and the rest is filled with liquid cooling liquid.
Further, the cooling liquid and the liquid cooling liquid are propylene glycol, alcohol, distilled water, deionized water and the like and mixtures thereof.
Further, the material of the lower surface of the heat absorption water tank 1 is Cu, Al, Cu alloy or Al alloy.
Further, the inner diameter of the pipeline in the water cooling row 5 is 6-12 mm.
Further, the water cooling row 5 comprises inner cavities of regular star-shaped radiation structures, which are shown in detail in fig. 3.
Further, the upper surface of the semiconductor refrigerator 7 is a semiconductor refrigeration piece, the inner wall of the semiconductor refrigeration piece is a refrigeration end, and the outer surface of the semiconductor refrigeration piece is a heating end. Further, the semiconductor refrigeration piece is arranged in parallel with the fan 6.
By adopting the technical scheme, the heat-conducting silicone layer can tightly bond the packaged chip and the heat absorption water tank 1 into a whole; the outlet of the heat absorption water tank 1 penetrates through the water pump 3 through the output pipeline 4 and is communicated to the water cooling drain 5, the fan 6 is arranged on the water cooling drain to cool the water cooling drain, the cooling liquid is pumped out by the water pump 3 after flowing out of the water cooling drain 5 and flows into the liquid return pipeline 8, and after being cooled by the semiconductor refrigerator 7, the cooling liquid flows back to the heat absorption water tank 1.
The following describes the use of the heat sink function with multi-stage heat dissipation function in conjunction with a specific application scenario.
When a computer or a server enters a low-power-consumption waiting state in a closed or dormant state or just starts, the temperature sensor feeds back the temperature of the chip, the temperature of the chip changes from room temperature, if the temperature is more than or equal to 0 and T is less than 40 ℃, the first-stage heat dissipation system is triggered, the cooling liquid in the liquid cooling plate 2 is subjected to gas-liquid phase conversion and exchanges heat with the outside, and at the moment, the heat dissipation system does not generate any energy consumption. When the computer or the server is at the service temperature of more than or equal to 40 and T <60 ℃, the controller starts the second-stage heat dissipation system, the water pump 3 is started, the water pump 3 drives the cooling liquid in the heat absorption water tank 1 to flow into the water cooling row 5 at the moment, the cooling liquid is fully contacted with the inner cavity of the star-shaped radiation structure and then conducts heat to the pipeline wall, the fan 6 carries out air cooling on the cooling liquid, and the cooled cooling liquid flows back to the heat absorption water tank 1 through the liquid return pipeline 8. When the computer or the server carries out higher power consumption operation, the temperature is more than or equal to 60 and T is less than 90 ℃, the controller starts the third-stage heat dissipation system to send an instruction, the water pump 3 is started, the semiconductor refrigerator 7 is also started, the semiconductor refrigeration piece of the refrigerator further cools the cooling liquid flowing back from the water cooling discharge 5, and the cooling liquid is sent back to the heat absorption water tank 1 under the action of the water pump 3. When the temperature exceeds 90 ℃, the controller can give an early warning prompt.
If the temperature of the chip falls back, the temperature is reduced to T <90 ℃ which is more than or equal to 60 ℃, at the moment, the controller controls the water pump 3 and the semiconductor refrigerator 7 to continuously work together, the temperature of the computer or the server is further reduced, when the temperature is reduced to T <60 ℃ which is more than or equal to 40, the controller closes the third-stage heat dissipation system, namely the semiconductor refrigerator 7 is closed, no current passes through the semiconductor refrigeration piece, and only the first-stage heat dissipation system and the second-stage heat dissipation system play a role; when the power consumption of the computer or the server is further reduced and the temperature is reduced to be more than or equal to 0 and T is less than 40 ℃, the second-stage heat dissipation system is closed, the water pump 3 and the fan 6 do not work at the moment, and only the first-stage heat dissipation system plays a role; still further, when the temperature of the chip is reduced to be lower than 0 ℃, the controller can give an early warning again.
The above-mentioned embodiments are preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, and the equivalent changes in shape and structure according to the present invention are within the protection scope of the present invention.
Claims (10)
1. A heat sink with multi-stage heat dissipation function is characterized in that: the chip packaging structure comprises a heat absorption water tank, a liquid cooling plate, a water pump, a water cooling bar, a fan and a refrigerator, wherein the heat absorption water tank is arranged on a packaged chip;
the heat absorption water tank is communicated with the water cooling bar through a water pump, the water cooling bar is communicated with the heat absorption water tank through a liquid return pipeline, and the fan is positioned above the water cooling bar;
and a semiconductor refrigerator is arranged on the outer surface of the liquid return pipeline between the water cooling drain and the heat absorption water tank.
2. The heat dissipating device with multi-stage heat dissipating function as claimed in claim 1, wherein: and a heat-conducting silicone grease layer is arranged on the lower surface of the heat absorption water tank, which is used for being connected with the packaged chip.
3. The heat dissipating device with multi-stage heat dissipating function as claimed in claim 1, wherein: and 10-30% of the volume in the liquid cooling plate is negative pressure or vacuum, and the rest is filled with liquid cooling liquid.
4. The heat dissipating device with multi-stage heat dissipating function as claimed in claim 1, wherein: the upper surface of the heat absorption water tank and the lower surface of the liquid cooling plate are in the same plane.
5. The heat dissipating device with multi-stage heat dissipating function as claimed in claim 4, wherein: the lower surface of the heat absorption water tank is made of Cu, Al, Cu alloy or Al alloy.
6. The heat dissipating device with multi-stage heat dissipating function as claimed in claim 1, wherein: the inner diameter of the pipeline in the water-cooling row is 6-12 mm.
7. The heat dissipating device with multi-stage heat dissipating function as claimed in claim 6, wherein: the water cooling row comprises inner cavities of regularly arranged star-shaped radiation structures.
8. The heat dissipating device with multi-stage heat dissipating function as claimed in claim 1, wherein: the upper surface of the semiconductor refrigerator is a semiconductor refrigeration piece, the inner wall of the semiconductor refrigeration piece is a refrigeration end, and the outer surface of the semiconductor refrigeration piece is a heating end.
9. The heat dissipating device with multi-stage heat dissipating function as claimed in claim 8, wherein: the semiconductor refrigerating sheet is arranged in parallel with the fan.
10. The heat dissipating device with multi-stage heat dissipating function according to any one of claims 1 to 9, wherein: the water pump, the fan, the semiconductor refrigerator and the temperature sensor are connected with the controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122536151.7U CN216650319U (en) | 2021-10-21 | 2021-10-21 | Heat dissipation device with multistage heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122536151.7U CN216650319U (en) | 2021-10-21 | 2021-10-21 | Heat dissipation device with multistage heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216650319U true CN216650319U (en) | 2022-05-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122536151.7U Active CN216650319U (en) | 2021-10-21 | 2021-10-21 | Heat dissipation device with multistage heat dissipation function |
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| CN (1) | CN216650319U (en) |
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2021
- 2021-10-21 CN CN202122536151.7U patent/CN216650319U/en active Active
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