CN116013875A

CN116013875A - IGBT module with multiple cooling structures and working method thereof

Info

Publication number: CN116013875A
Application number: CN202310073709.3A
Authority: CN
Inventors: 王新强; 王丕龙; 张永利; 刘�文
Original assignee: Qingdao Jiaen Semiconductor Co ltd
Current assignee: Qingdao Jiaen Semiconductor Co ltd
Priority date: 2023-02-07
Filing date: 2023-02-07
Publication date: 2023-04-25

Abstract

The invention provides an IGBT module with various cooling structures and a working method thereof, and relates to the technical field of IGBT modules.

Description

IGBT module with multiple cooling structures and working method thereof

Technical Field

The invention relates to the technical field of IGBT modules, in particular to an IGBT module with various cooling structures and a working method thereof.

Background

The IGBT module is a device for power electronic conversion and control, a large amount of heat can be generated in the operation process of the existing high-power IGBT module, a plurality of high-power IGBT modules are generally connected with a heat dissipation structure for use in daily use, damage to the IGBT module caused by the generated high temperature in the use process is prevented, the working conditions of different IGBT modules are inconsistent, the heat productivity is also different, the heat dissipation structure is used for keeping the temperature of all the IGBT modules in a safe range, the heat dissipation structure needs to operate at full speed, the waste of energy is caused, and meanwhile, the heat dissipation mode of the existing heat dissipation structure cannot be adjusted according to the temperature of the IGBT module when the existing heat dissipation structure is used for a single IGBT module, so that the problem that the heat generated when the IGBT module is in high-power operation for a period of time cannot be timely discharged exists.

Disclosure of Invention

The embodiment of the invention provides an IGBT module with various cooling structures and a working method thereof, which solve the problems that the heat dissipation structure of the traditional IGBT module wastes resources and the heat dissipation mode cannot be adjusted according to the change of temperature.

In view of the above problems, the technical scheme provided by the invention is as follows:

the utility model provides an IGBT module that possesses multiple cooling structure, includes the shell and sets up the inside circuit module of shell to and the base plate of setting in circuit module both sides, one side of shell is provided with second cooling device the inside of shell still is provided with first cooling device and adjusting device, first cooling device with second cooling device is connected with the base plate respectively, adjusting device includes thermocouple and controller, the thermocouple sets up and detects on the base plate the change of base plate temperature, the controller is used for according to the temperature variation situation control first cooling device's that the thermocouple detected operation.

In order to better realize the technical scheme of the invention, the following technical measures are adopted.

Further, the first cooling device comprises a connecting piece, the connecting piece comprises a frame a and a frame b which are arranged on two sides of the substrate, heat-conducting silicone grease is respectively filled in the frame a and the frame b, a refrigerating sheet a and a refrigerating sheet b are also respectively arranged in the frame a and the frame b, a liquid storage box a is arranged on one side of the frame a, a liquid storage box b is arranged on one side of the frame b, the liquid storage box a and two sides of the liquid storage box b are respectively communicated through a connecting pipe a and a connecting pipe b, a water pump is arranged on one side of the inner part of the shell, an outlet of the water pump is communicated with the connecting pipe a, an inlet of the water pump is connected with a water inlet pipe, and the connecting pipe b is connected with a water outlet pipe.

Further, the interiors of the liquid storage box a and the liquid storage box b are filled with cooling liquid.

Further, the first cooling device further comprises a heat dissipation piece, the heat dissipation piece comprises a fan frame, the fan frame is connected with the other side of the shell through a connecting rod, a fan is arranged in the fan frame, a heat dissipation fin is arranged on one side, far away from the shell, of the fan frame, the heat dissipation fin is connected in series through a heat dissipation pipe, and two ends of the heat dissipation pipe are respectively communicated with the water inlet pipe and the water outlet pipe.

Further, a gap is provided between the fan frame and the other side of the housing.

Further, the second cooling device comprises a heat dissipation base, the heat dissipation base is fixedly arranged on one side of the shell, a heat conduction column a is arranged on the heat dissipation base, one end of the heat conduction column a is connected with the substrate, and the other end of the heat conduction column a sequentially penetrates through the frame a, the refrigerating sheet a, the liquid storage box a, the shell and the heat dissipation base and extends to the outside of the heat dissipation base.

Further, the second cooling device further comprises a heat conducting column b and a serial connection rod, one end of the heat conducting column b is connected with the substrate, the other end of the heat conducting column b sequentially penetrates through the frame b, the refrigerating sheet b and the liquid storage box b and extends to the outside of the liquid storage box b, one end of the serial connection rod is connected with the heat conducting column a, and the other end of the serial connection rod is connected with the heat conducting column b.

Further, the signal output end of the controller is respectively in communication connection with the signal input ends of the refrigerating sheet a, the refrigerating sheet b, the water pump and the fan, and the signal output end of the controller is in communication connection with the signal output end of the thermocouple.

Further, the direction of the fan driving airflow is from the housing to the heat dissipation fins.

An operating method of an IGBT module with a plurality of cooling structures comprises the following steps:

step 1, temperature monitoring: the temperature of the substrate is detected by the thermocouple in real time, and a temperature signal of the thermocouple is obtained by the controller in real time;

step 2, passive temperature adjustment: when the temperature of the substrate is lower than a first preset value, the controller does not start a water pump, a fan and heat generated at the substrate in the first cooling device, and mainly radiates heat through the second cooling device, and the second cooling device radiates heat in an auxiliary way;

step 3, active temperature adjustment a: when the temperature of the substrate is higher than a first preset value and lower than a second preset value, the controller starts a fan of the first cooling device, and heat generated at the substrate is subjected to first-mode heat dissipation through the second cooling device and the first cooling device;

step 4, active temperature adjustment b: when the temperature of the substrate is higher than a second preset value and lower than a third preset value, the controller starts a fan and a water pump of the first cooling device, and heat generated at the substrate is subjected to second mode heat dissipation through the second cooling device and the second cooling device;

step 5, active temperature adjustment c: when the temperature of the base plate is higher than a third preset value, the controller starts a fan, a water pump, a refrigerating sheet a and a refrigerating sheet b of the first cooling device, and heat generated at the base plate is subjected to third-mode heat dissipation through the second cooling device and the second cooling device.

Compared with the prior art, the invention has the beneficial effects that: the temperature monitoring is carried out on the base plate of the IGBT module by adopting the thermocouple, the IGBT module is radiated by different radiating modes under different temperature conditions, the resource is saved, the temperature of the IGBT module can be kept within a safe range under different working conditions of the IGBT module, and the problems that the existing radiating structure of the IGBT module wastes the resource and the radiating mode cannot be adjusted according to the change of the temperature are solved.

The foregoing description is only an overview of the present invention, and is intended to be implemented in accordance with the teachings of the present invention in order that the same may be more clearly understood and to make the same and other objects, features and advantages of the present invention more readily apparent.

Drawings

Fig. 1 is a schematic structural diagram of an IGBT module with multiple cooling structures according to an embodiment of the present disclosure;

fig. 2 is a schematic cross-sectional structure diagram of an IGBT module with multiple cooling structures according to an embodiment of the invention;

FIG. 3 is an enlarged schematic view of the structure of FIG. 2A;

FIG. 4 is an enlarged schematic view of the structure of FIG. 2B;

fig. 5 is a communication block diagram of an IGBT module with multiple cooling structures according to an embodiment of the invention;

fig. 6 is a schematic flow chart of an operating method of an IGBT module with multiple cooling structures according to an embodiment of the invention.

Reference numerals: 1. a circuit module; 2. a substrate; 3. a housing; 4. a first cooling device; 41. a connecting piece; 411. a frame a; 412. a frame b; 42. heat conductive silicone grease; 43. a refrigerating sheet a; 44. a refrigerating sheet b; 45. a liquid storage box a; 46. a liquid storage box b; 47. a water pump; 48. a heat sink; 481. a fan frame; 482. a fan; 483. a connecting rod; 484. a heat radiation fin; 485. a heat radiating pipe; 49. a connecting pipe a; 410. a water inlet pipe; 412. a water outlet pipe; 413. a connecting pipe b; 5. a second cooling device; 51. a heat dissipation base; 52. a heat conduction column a; 53. a heat conduction column b; 54. a connecting rod is connected in series; 6. an adjusting device; 61. a thermocouple; 62. and a controller.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.

Referring to fig. 1-5, an IGBT module with multiple cooling structures includes a housing 3 and a circuit module 1 disposed inside the housing 3, the circuit module 1 includes an IGBT chip and other electronic components bonded together, and a substrate 2 disposed on two sides of the circuit module 1, the substrate 2 is welded on two sides of the circuit module 1, heat generated by operation of the circuit module 1 is transferred from the substrate 2 to the outside, a second cooling device 5 is disposed on one side of the housing 3, the second cooling device 5 adopts passive heat dissipation, which dissipates the generated heat of the substrate 2 into air through heat transfer, for dissipating heat of the IGBT module when operating conditions of the IGBT module are in low power operation, a first cooling device 4 and a regulating device 6 are disposed inside the housing 3, the first cooling device 4 and the second cooling device 5 are respectively connected with the substrate 2, the regulating device 6 includes a thermocouple 61 and a controller 62, the thermocouple 61 is disposed on the substrate 2 to detect a change in temperature of the substrate 2, and the controller 62 is used for controlling operation of the first cooling device 4 according to the temperature change detected by the thermocouple 61, and controlling the first cooling device 4 to be in different heat dissipation modes according to the temperature change detected by the thermocouple 61.

Referring to fig. 1-4, in the embodiment of the present invention, the second cooling device 5 includes a heat dissipation base 51, the heat dissipation base 51 is fixedly disposed on one side of the housing 3, a heat conduction column a52 is disposed on the heat dissipation base 51, one end of the heat conduction column a52 is connected with the substrate 2, the other end of the heat conduction column a52 sequentially penetrates through the frame a411, the cooling fin a43, the liquid storage box a45, the housing 3 and the heat dissipation base 51 and extends to the outside of the heat dissipation base 51, the second cooling device 5 further includes a heat conduction column b53 and a serial connection rod 54, one end of the heat conduction column b53 is connected with the substrate 2, the other end of the heat conduction column b53 sequentially penetrates through the frame b412, the cooling fin b44 and the liquid storage box b46 and extends to the outside of the liquid storage box b46, one end of the serial connection rod 54 is connected with the heat conduction column a52, and the other end of the serial connection rod 54 is connected with the heat conduction column b 53.

Specifically, heat generated by the IGBT module is transferred from the substrate 2 to the heat conducting column a52 and the heat conducting column b53, where the heat on the heat conducting column b53 is transferred to the heat conducting column a52 through the serial connection rod 54, and is emitted to the outside through heat exchange between the heat conducting column a52 and air outside the IGBT module, so that the IGBT module is passively cooled, the second cooling device 5 is used for cooling without consuming external energy, and when the IGBT module is not in a high-power running state, the effect of cooling and heat dissipation can be achieved by using the second cooling device 5;

it should be noted that, the heat conductive silicone grease 42 filled in the frame a411 and the frame b412 can enhance the heat conductive performance of the heat conductive column a52 and the heat conductive column b53 to the substrate 2, and improve the heat dissipation effect of the second cooling device 5.

Referring to fig. 1 to 5, in the embodiment of the present invention, the first cooling device 4 includes a connection member 41, the connection member 41 includes a frame a411 and a frame b412 disposed at both sides of the base plate 2, the interiors of the frame a411 and the frame b412 are respectively filled with the heat-conductive silicone grease 42, the interiors of the frame a411 and the frame b412 are also respectively provided with a cooling sheet a43 and a cooling sheet b44, one side of the frame a411 is provided with a liquid storage box a45, one side of the frame b412 is provided with a liquid storage box b46, both sides of the liquid storage box a45 and the liquid storage box b46 are respectively communicated through a connection pipe a49 and a connection pipe b413, one side of the interior of the housing 3 is provided with a water pump 47, an outlet of the water pump 47 is communicated with the connection pipe a49, an inlet of the water pump 47 is connected with a water inlet pipe 410, and the connection pipe b413 is connected with a water outlet pipe 412.

The inside of the liquid storage box a45 and the liquid storage box b46 is filled with a cooling liquid, preferably water, and the direction of the air flow driven by the fan 482 is from the housing 3 to the heat dissipation fins 484.

As a preferred embodiment, the refrigerating piece a43 and the refrigerating piece b44 are semiconductor refrigerating pieces, and the shapes of the refrigerating piece a43 and the refrigerating piece b44 are made into wave shapes, which are used for increasing the contact area between the refrigerating piece a43 and the refrigerating piece b44 and the heat conduction silicone grease 42, enhancing the heat absorption effect of the refrigerating piece a43 and the refrigerating piece b44, and the cold ends of the refrigerating piece a43 and the refrigerating piece b44 face to the substrate 2.

Specifically, the first cooling device 4 further includes a heat dissipation member 48, the heat dissipation member 48 includes a fan frame 481, the fan frame 481 is connected with the other side of the housing 3 through a connecting rod 483, a fan 482 is disposed in the fan frame 481, a heat dissipation fin 484 is disposed on one side of the fan frame 481 far away from the housing 3, the heat dissipation fins 484 are connected in series through a heat dissipation tube 485, two ends of the heat dissipation tube 485 are respectively communicated with the water inlet tube 410 and the water outlet tube 412, and a gap is disposed between the fan frame 481 and the other side of the housing 3 for guiding in cold air outside the heat dissipation member 48.

Referring to fig. 1-5, in an embodiment of the present invention, the signal output of the controller 62 is communicatively coupled to the signal inputs of the cooling fin a43, the cooling fin b44, the water pump 47 and the fan 482, respectively, and the signal output of the controller is communicatively coupled to the signal output of the thermocouple 61.

Referring to fig. 1-6, the invention further provides an operating method of the IGBT module with various cooling structures, including the following steps:

step 1, temperature monitoring: the thermocouple 61 detects the temperature of the substrate 2 in real time, and the controller 62 acquires a temperature signal of the thermocouple 61 in real time;

specifically, the number of thermocouples 61 is a plurality, and the thermocouples are uniformly distributed on the substrates 2 at both sides, the temperatures of the substrates 2 at both sides are detected in real time, and the controller 62 collects all the temperature signals of the thermocouples 61 and calculates the average temperatures of the substrates 2 at both sides, respectively.

Step 2, passive temperature adjustment: when the temperature of the substrate 2 is lower than the first preset value, the controller 62 does not start the water pump 47, the fan 482 and the heat generated at the substrate 2 in the first cooling device 4 to mainly dissipate the heat through the second cooling device 5, and the second cooling device 5 performs auxiliary heat dissipation;

specifically, the controller 62 compares the calculated temperature with a preset first preset value, when the temperature of the substrate 2 is lower than the first preset value, the substrate is in a passive heat dissipation mode at this time, heat generated by the operation of the IGBT module is transferred and dissipated through the heat conducting column a52 and the heat conducting column b53, meanwhile, the heat generated by the operation of the IGBT module also heats the cooling liquid in the liquid storage box a45 and the liquid storage box b46, and dissipates heat through the heat dissipating tube 485 communicated with the heat dissipating tube and the heat dissipating fins 484 connected together, at this time, the heat generated at the substrate 2 is mainly dissipated through the second cooling device 5, and the second cooling device 5 is used for assisting in dissipating heat.

Step 3, active temperature adjustment a: when the temperature of the substrate 2 is higher than a first preset value and lower than a second preset value, the controller 62 starts the fan 482 of the first cooling device 4, and heat generated at the substrate 2 is radiated in a first mode through the second cooling device 5 and the first cooling device 4;

specifically, the controller 62 compares the calculated temperature with a preset first preset value and a preset second preset value, when the temperature of the substrate 2 is higher than the first preset value and lower than the second preset value, the substrate is in a first mode for heat dissipation, heat generated by the operation of the IGBT module is transferred and dissipated through the heat conducting column a52 and the heat conducting column b53, meanwhile, the heat generated by the operation of the IGBT module also heats the cooling liquid in the liquid storage box a45 and the liquid storage box b46, and dissipates heat through the heat dissipating tube 485 communicated with the liquid storage box a45 and the cooling fins 484 connected with the liquid storage box b, the heat dissipating capacity of the cooling fins 484 is enhanced after the fan 482 is started, and heat generated at the substrate 2 is dissipated through the second cooling device 5 and the first cooling device 4.

Step 4, active temperature adjustment b: when the temperature of the substrate 2 is lower than the third preset value when the temperature is higher than the second preset value, the controller 62 starts the fan 482 and the water pump 47 of the first cooling device 4, and heat generated at the substrate 2 is radiated in the second mode through the second cooling device 5 and the second cooling device 5;

specifically, the controller 62 compares the calculated temperature with a preset second preset value and a preset third preset value, when the temperature of the substrate 2 is higher than the second preset value and lower than the third preset value, the substrate is in a second mode to dissipate heat, heat generated by the operation of the IGBT module is transferred and dissipated through the heat conducting column a52 and the heat conducting column b53, meanwhile, the heat generated by the operation of the IGBT module also heats the cooling liquid in the liquid storage box a45 and the liquid storage box b46, and dissipates heat through the heat dissipating tube 485 communicated with the heat storage box a45 and the cooling liquid in the liquid storage box b46 and the cooling fins 484 connected with the heat storage box a45 and the cooling liquid in the liquid storage box b46, after the fan 482 and the water pump 47 are started, the cooling liquid in the liquid storage boxes a45 and the cooling liquid in the liquid storage box b46 on two sides of the substrate 2 starts to circulate through the water pump 47, the heat is taken away, and the heat generated at the substrate 2 is dissipated through the second cooling device 5 and the first cooling device 4.

Step 5, active temperature adjustment c: when the temperature of the substrate 2 is higher than the third preset value, the controller 62 activates the fan 482, the water pump 47, the cooling fin a43 and the cooling fin b44 of the first cooling device 4, and the heat generated at the substrate 2 is dissipated in the third mode through the second cooling device 5 and the second cooling device 5.

Specifically, the controller 62 compares the calculated temperature with a preset third preset value, when the temperature of the substrate 2 is higher than the third preset value, the substrate is in a third mode to dissipate heat at this time, when the heat generated by the operation of the IGBT module is transferred and dissipated through the heat conducting column a52 and the heat conducting column b53, the heat generated by the operation of the IGBT module also heats the cooling liquid in the liquid storage box a45 and the liquid storage box b46, the cooling liquid is dissipated through the heat dissipating tube 485 communicated with the cooling liquid storage box a45 and the heat dissipating fins 484 connected with the cooling liquid, after the fan 482 and the water pump 47 are started, besides the heat dissipating capacity of the heat dissipating fins 484 is enhanced, the cooling liquid in the liquid storage box a45 and the liquid storage box b46 at two sides of the substrate 2 is enabled to begin to circulate through the water pump 47, the heat is taken away and dissipated through the heat dissipating fins 484, when the temperature of the substrate 2 is higher than the third preset value, at this time, the temperature of the substrate 2 is far beyond the normal range, at this time, after the opening of the cooling fin a43 and the cooling fin b44, the cold ends of the cooling fin a43 and the cooling fin b44 rapidly reduce the temperature of the substrate 2, and the liquid storage box 484 and the cooling liquid is transferred to the liquid storage box a45 and the cooling liquid storage box 484, the cooling device 2, and the cooling device can be cooled by the cooling device 2, and the cooling device 2 at the first end and the second end 5 and the cooling device is further cooled.

It should be noted that, specific data of the first preset value, the second preset value and the third preset value are set according to actual requirements, and no specific limitation is made here, the values of the first preset value, the second preset value and the third preset value are sequentially increased, and the energy consumed by the passive heat dissipation mode, the first heat dissipation mode, the second heat dissipation mode and the third heat dissipation mode are sequentially increased.

It should be noted that, specific model specifications of the cooling fin a43, the cooling fin b44, the water pump 47, the fan 482, the thermocouple 61 and the controller 62 need to be determined by selecting a model according to actual specifications of the device, and a specific model selection calculation method adopts the prior art in the field, so that detailed description thereof is omitted.

The power supply of the cooling fin a43, the cooling fin b44, the water pump 47, the fan 482, the thermoelement 61 and the controller 62 and the principle thereof will be apparent to those skilled in the art, and will not be described in detail herein.

It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims

1. The utility model provides an IGBT module that possesses multiple cooling structure, includes shell (3) and sets up circuit module (1) of shell (3) inside to and set up base plate (2) in circuit module (1) both sides, a serial communication port, one side of shell (3) is provided with second cooling device (5) the inside of shell (3) still is provided with first cooling device (4) and adjusting device (6), first cooling device (4) with second cooling device (5) are connected with base plate (2) respectively, adjusting device (6) include thermocouple (61) and controller (62), thermocouple (61) set up detect on base plate (2) the change of base plate (2) temperature, controller (62) are used for according to the temperature variation situation that thermocouple (61) detected first cooling device (4) moves.

2. The IGBT module having a plurality of cooling structures according to claim 1, wherein: the first cooling device (4) comprises a connecting piece (41), the connecting piece (41) comprises a frame a (411) and a frame b (412) which are arranged on two sides of a base plate (2), the heat-conducting silicone grease (42) is filled in the frame a (411) and the frame b (412) respectively, a refrigerating sheet a (43) and a refrigerating sheet b (44) are further arranged in the frame a (411) and the frame b (412), a liquid storage box a (45) is arranged on one side of the frame a (411), a liquid storage box b (46) is arranged on one side of the frame b (412), the liquid storage box a (45) is communicated with two sides of the liquid storage box b (46) through a connecting pipe a (49) and a connecting pipe b (413) respectively, a water pump (47) is arranged on one side of the inner part of the shell (3), an outlet of the water pump (47) is communicated with the connecting pipe a (49), and an inlet of the water pump (47) is connected with a water inlet pipe (410).

3. The IGBT module having a plurality of cooling structures according to claim 2, wherein: the interiors of the liquid storage box a (45) and the liquid storage box b (46) are filled with cooling liquid.

4. The IGBT module having a plurality of cooling structures according to claim 2, wherein: the first cooling device (4) further comprises a heat radiating piece (48), the heat radiating piece (48) comprises a fan frame (481), the fan frame (481) is connected with the other side of the shell (3) through a connecting rod (483), a fan (482) is arranged in the fan frame (481), a radiating fin (484) is arranged on one side, away from the shell (3), of the fan frame (481), the radiating fins (484) are connected in series through radiating pipes (485), and two ends of each radiating pipe (485) are respectively communicated with the water inlet pipe (410) and the water outlet pipe (412).

5. The IGBT module with multiple cooling structures according to claim 4, wherein: a gap is provided between the fan frame (481) and the other side of the housing (3).

6. The IGBT module having a plurality of cooling structures according to claim 2, wherein: the second cooling device (5) comprises a heat dissipation base (51), the heat dissipation base (51) is fixedly arranged on one side of the shell (3), a heat conduction column a (52) is arranged on the heat dissipation base (51), one end of the heat conduction column a (52) is connected with the substrate (2), the other end of the heat conduction column a (52) sequentially penetrates through the frame a (411), the refrigerating sheet a (43), the liquid storage box a (45), the shell (3) and the heat dissipation base (51) and extends to the outside of the heat dissipation base (51).

7. The IGBT module with multiple cooling structures according to claim 6, wherein: the second cooling device (5) further comprises a heat conduction column b (53) and a series connection rod (54), one end of the heat conduction column b (53) is connected with the base plate (2), the other end of the heat conduction column b (53) sequentially penetrates through the frame b (412), the refrigerating sheet b (44), the liquid storage box b (46) and extends to the outside of the liquid storage box b (46), one end of the series connection rod (54) is connected with the heat conduction column a (52), and the other end of the series connection rod (54) is connected with the heat conduction column b (53).

8. The IGBT module with multiple cooling structures according to claim 4, wherein: the signal output end of the controller (62) is respectively in communication connection with the signal input ends of the refrigerating sheet a (43), the refrigerating sheet b (44), the water pump (47) and the fan (482), and the signal output end of the controller is in communication connection with the signal output end of the thermocouple (61).

9. The IGBT module with multiple cooling structures according to claim 5, wherein: the fan (482) drives the air flow in a direction from the housing (3) to the heat sink fins (484).

10. A method for operating an IGBT module having a plurality of cooling structures, applying an IGBT module having a plurality of cooling structures as claimed in claim 4, characterized in that: the method comprises the following steps:

step 1, temperature monitoring: the thermocouple (61) detects the temperature of the substrate (2) in real time, and the controller (62) acquires a temperature signal of the thermocouple (61) in real time;

step 2, passive temperature adjustment: when the temperature of the substrate (2) is lower than a first preset value, the controller (62) does not start the water pump (47), the fan (482) and the heat generated at the substrate (2) in the first cooling device (4) to mainly dissipate heat through the second cooling device (5), and the second cooling device (5) is used for assisting in heat dissipation;

step 3, active temperature adjustment a: when the temperature of the substrate (2) is higher than a first preset value and lower than a second preset value, the controller (62) starts a fan (482) of the first cooling device (4), and heat generated at the substrate (2) is radiated in a first mode through the second cooling device (5) and the first cooling device (4);

step 4, active temperature adjustment b: when the temperature of the substrate (2) is higher than a second preset value and lower than a third preset value, the controller (62) starts a fan (482) and a water pump (47) of the first cooling device (4), and heat generated at the substrate (2) is radiated in a second mode through the second cooling device (5) and the second cooling device (5);

step 5, active temperature adjustment c: when the temperature of the base plate (2) is higher than a third preset value, the controller (62) starts a fan (482), a water pump (47), a refrigerating sheet a (43) and a refrigerating sheet b (44) of the first cooling device (4), and heat generated at the base plate (2) is radiated in a third mode through the second cooling device (5) and the second cooling device (5).