CN211907948U - Semiconductor laser heat abstractor - Google Patents
Semiconductor laser heat abstractor Download PDFInfo
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- CN211907948U CN211907948U CN202020789502.8U CN202020789502U CN211907948U CN 211907948 U CN211907948 U CN 211907948U CN 202020789502 U CN202020789502 U CN 202020789502U CN 211907948 U CN211907948 U CN 211907948U
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Abstract
The utility model provides a semiconductor laser heat abstractor, include water-cooling piece and heat exchanger through pipeline interconnect, still including the water pump that can make water-cooling liquid circulate between water-cooling piece and heat exchanger, the water-cooling piece is used for dispelling the heat for the laser instrument, is equipped with laser instrument installation hole site on it, and laser instrument accessible laser instrument installation hole site is fixed in the water-cooling piece. The water-cooling block contacts with the laser, and can carry out timely and effective heat dissipation and cooling on the laser through cooling media such as water-cooling liquid flowing in the water-cooling block and the internal circulation of the heat exchanger, so that the laser has higher and more stable heat dissipation efficiency compared with other heat dissipation devices. The temperature monitoring device arranged between the upper end surface of the water cooling block and the laser installation surface monitors the surface temperature of the laser in real time, and the control chip automatically adjusts the rotating speed of the water pump and the heat exchanger, so that the surface heat of the laser is taken away by the water cooling liquid more quickly, the laser is cooled in time, and the hidden trouble of overheating of the laser is solved.
Description
Technical Field
The utility model relates to a semiconductor laser technical field, in particular to semiconductor laser heat abstractor.
Background
Semiconductor lasers are lasers using semiconductor materials as working substances, and the working principle is that electric energy is converted into optical energy. For a high-power laser device, the electro-optic conversion efficiency is about 50%, and the rest of the electric energy can generate waste heat, so that the temperature of a semiconductor chip is rapidly increased. The light-emitting wavelength of the semiconductor laser changes along with the temperature, and the light-emitting intensity of the semiconductor laser is correspondingly reduced along with the increase of the spectral width and the temperature rise; when the temperature of the chip is increased rapidly due to the failure of heat dissipation, the chip is damaged, and the working efficiency is greatly reduced.
At present, various heat dissipation methods mainly comprise air cooling and water cooling. The air cooling is to take away the waste heat generated by the laser through different wind speeds by a small fan arranged on the laser, but the cooling mode is only suitable for the low-power optical fiber laser. The better heat dissipation mode of the semiconductor laser with higher power still adopts water cooling. How to further stabilize the working temperature of the semiconductor laser based on the water cooling basis and to take away the heat generated by the laser as soon as possible becomes a problem that needs to be continuously explored and researched at present.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor laser heat abstractor can carry out timely effectual heat dissipation to high power semiconductor laser.
The utility model provides a semiconductor laser heat abstractor, include water-cooling piece and heat exchanger through pipeline interconnect, still including making water-cooling liquid be in the water-cooling piece with the water pump that circulates between the heat exchanger, the water-cooling piece is used for radiating for the laser instrument, is equipped with laser instrument installation hole site on it, the laser instrument accessible laser instrument installation hole site is fixed in the water-cooling piece.
Furthermore, a heat conduction indium sheet is arranged on the end face, provided with the laser mounting hole, of the water cooling block, and after the laser is mounted, the heat conduction indium sheet is located between the end face of the water cooling block and the laser mounting face.
Further, the heat conduction indium sheet is arranged in the range of the laser installation hole positions.
Furthermore, the water cooling block is provided with a temperature monitoring device on the end face of the laser mounting hole, and after the laser is mounted, the temperature monitoring device is positioned between the end face of the water cooling block and the laser mounting face and used for monitoring the surface temperature of the laser.
Further, the temperature monitoring device is fixed to the heat conduction indium sheet and used for monitoring the surface temperature of the laser by monitoring the temperature of the heat conduction indium sheet.
Further, laser instrument installation hole site is located the up end of water-cooling piece, be equipped with total water inlet on the up end of water-cooling piece, external water-cooling liquid passes through total water inlet gets into the water-cooling piece, be provided with water-cooling water inlet and water-cooling delivery port on the relative both sides face that sets up of water-cooling piece respectively, what stagger was provided with heat transfer water inlet and heat transfer delivery port from top to bottom on the same terminal surface of heat exchanger, the heat transfer delivery port is located the top of heat transfer water inlet, the water-cooling delivery port passes through the water pump is connected the heat transfer water inlet, water-cooling water inlet lug connection the heat transfer delivery port.
Further, the total water inlet is closer to the water-cooled water inlet than the water-cooled water outlet, and the water-cooled water outlet and the water-cooled water inlet are at the same height.
Further, the heat exchanger comprises a serpentine channel and a heat dissipation piece, wherein an outlet and an inlet of the serpentine channel are respectively the heat exchange water outlet and the heat exchange water inlet, and the heat dissipation piece is used for dissipating heat of water cooling liquid in the serpentine channel.
Further, the heat dissipation member includes a heat dissipation fan located at one side of the serpentine channel.
Furthermore, the temperature monitoring device, the cooling fan and the water pump are all connected with a control chip, and the control chip has a function of controlling the rotating speed or power of the water pump and the cooling fan according to the surface temperature of the laser.
Further, the storage capacity of the water-cooling liquid in the water-cooling block is more than that of the water-cooling liquid in the heat exchanger.
The beneficial effects of the utility model are that:
(1) the water-cooling piece contacts with the laser instrument each other, through at cooling medium such as water-cooling liquid that water-cooling piece and heat exchanger inner loop flow, can carry out timely effectual heat dissipation cooling to the laser instrument, other heat abstractor relatively, the utility model provides a semiconductor laser heat abstractor has higher, more stable radiating efficiency.
(2) The temperature monitoring device arranged between the upper end surface of the water cooling block and the laser installation surface monitors the surface temperature of the laser in real time, and the control chip automatically adjusts the rotating speed of the heat dissipation fan on the water pump and the heat exchanger, so that the surface heat of the laser is taken away by the water cooling liquid more quickly, the laser is dissipated timely, and the hidden trouble of overheating of the laser is solved.
Drawings
Fig. 1 is a front view of a heat dissipation device of a semiconductor laser according to the present invention;
fig. 2 is a top view of a heat dissipation device of a semiconductor laser according to the present invention;
fig. 3 is a rear view of a heat sink for a semiconductor laser according to the present invention;
in the figure: 1. a water-cooling block; 2. a heat exchanger; 3. a water pump; 4. a heat conductive indium sheet; 5. a temperature monitoring device; 11. water cooling water outlet; 12. a water-cooled water inlet; 13. a main water inlet; 14. a laser mounting hole site; 21. a serpentine channel; 22. a heat dissipation fan.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be further described below with reference to the accompanying drawings.
Referring to fig. 1 to 3, the present invention provides a heat dissipation device for a semiconductor laser, including a water cooling block 1 and a heat exchanger 2 connected to each other through a pipe, and further including a water pump 3 for circulating water cooling liquid between the water cooling block 1 and the heat exchanger 2. The water cooling block 1 is used for radiating the laser, water cooling liquid with an excellent water cooling effect is stored in the water cooling block 1, a laser mounting hole position 14 is arranged outside the water cooling block, and the laser can be fixed on the water cooling block 1 through the laser mounting hole position 14, so that the laser can be directly mounted on the water cooling block 1 and directly radiated by the water cooling liquid in the water cooling block 1. The temperature of the water cooling liquid in the water cooling block 1 rises after absorbing the heat of the laser, then enters the heat exchanger 2 under the action of the water pump 3, is cooled by the heat exchanger 2 and then enters the water cooling block 1 again to continue radiating the laser. In this embodiment, the volume of water-cooling piece 1 is greater than heat exchanger 2's volume, the water-cooling liquid that stores up in the water-cooling piece 1 is more than the water-cooling liquid that holds in the heat exchanger 2 compares and adopts heat exchanger to give the laser instrument heat dissipation or adopt other modes to give the laser instrument heat dissipation, has more water-cooling liquid in the water-cooling piece 1, and its heat dissipation is more timely, more stable, and the radiating effect is better.
Please refer to fig. 1 to 3, in the utility model, for better bearing and more convenient loading and unloading laser machine, laser installation hole site 14 is located the up end of water-cooling piece 1, be equipped with total water inlet 13 on the up end of water-cooling piece 1, external water-cooling liquid passes through total water inlet 13 gets into water-cooling piece 1, be provided with water-cooling water inlet 12 and water-cooling delivery port 11 on the relative both sides face that sets up of water-cooling piece 1 respectively, heat exchanger 2 is provided with heat transfer water inlet and heat transfer delivery port with the terminal surface stagger from top to bottom, the heat transfer delivery port is located the top of heat transfer water inlet, the water-cooling delivery port passes through water pump 3 connects the heat transfer water inlet, water-cooling water inlet lug connection the heat transfer delivery port. Preferably, the total inlet 13 is closer to the water-cooled inlet 12 than the water-cooled outlet 11, and the water-cooled outlet 11 is at the same height as the water-cooled inlet 12.
The water cooling piece 1 with heat exchanger 2 has all seted up the leakage fluid dram for excrete water cooling piece 1 with the water-cooling liquid in the heat exchanger 2, through total water inlet 13 can to water cooling piece 1 in time make up water-cooling liquid, avoid the water-cooling liquid not enough and lead to the radiating effect not good enough. The total water inlet 13 can also be used for measuring the hydraulic pressure.
The heat exchanger 2 comprises a serpentine channel 21 and a heat dissipation piece, wherein an outlet and an inlet of the serpentine channel are respectively a heat exchange water outlet and a heat exchange water inlet, water cooling liquid can flow in the serpentine channel 21 in a winding mode under the driving of the water pump 3, and the heat dissipation piece is used for dissipating heat of the water cooling liquid in the serpentine channel. In this embodiment, the heat dissipation member includes a heat dissipation fan 22, is located on one side of the serpentine channel 21, and cools the serpentine channel 21 by fanning the serpentine channel 21, so that the water-cooling liquid in the serpentine channel 21 is cooled. The heat sink may also comprise semiconductor cold fins and/or heat sinks or the like connected to the serpentine channel 21.
The end face, provided with the laser mounting hole position 14, of the water cooling block 1 is provided with a heat conduction indium sheet 4, and after a laser is mounted, the heat conduction indium sheet 4 is located between the upper end face of the water cooling block 1 and a laser mounting face. Preferably, the heat conductive indium plate 4 is disposed within the laser mounting hole site 14. The heat conduction indium sheet 4 is made of indium-containing metal and is a high-performance soft metal heat conduction material manufactured by adopting a special process, and can provide an excellent cooling effect for high-grade devices needing to be cooled. The thermal conductivity of the InS soft metal (90W/mK) is an order of magnitude higher than most other thermally conductive interface materials. The InS soft metal heat conduction material has excellent ductility between two surfaces, can reduce the thermal resistance of the surfaces, has excellent self cold welding property, higher heat conduction performance, excellent compressibility and ductility and is convenient to use. When the soft metal high-performance heat conducting fin is subjected to smaller stress, the heat resistance is uniform. Because the soft metal has ductility, the thermal resistance of the surface is reduced, and the heat transfer performance is enhanced. When the heat sink is used on a radiator interface, the processed and flat surface is beneficial to exerting the efficiency of the heat conducting fin.
The water cooling block 1 is provided with a temperature monitoring device 5 on the end face of the laser mounting hole site 14, and after the laser is mounted, the temperature monitoring device 5 is positioned between the upper end face of the water cooling block 1 and the laser mounting face and used for monitoring the surface temperature of the laser. In this embodiment, the temperature monitoring device 5 is fixed to the heat conductive indium plate 4, and is configured to monitor the surface temperature of the laser by monitoring the temperature of the heat conductive indium plate 4. The temperature monitoring device 5, the heat radiation fan 22 and the water pump 3 are all connected with a control chip, and the control chip has a function of controlling the rotating speed or power of the water pump 3 and the heat radiation fan 22 according to the surface temperature of the laser.
The utility model provides a semiconductor laser heat abstractor, before starting water pump 3, at total water inlet 13 injected water cooling liquid earlier, then starting water pump 3, the water pump motor rotates and makes the water cooling liquid get into heat exchanger 2, flows into water cooling piece 1 after the cooling. The temperature monitoring device 5 arranged between the upper end surface of the water cooling block 1 and the laser installation surface monitors the surface temperature of the laser in real time, and when the surface temperature of the laser exceeds a set value, the control chip automatically adjusts the rotating speed of the heat dissipation fan 22 on the water pump 3 and the heat exchanger 2, so that the surface heat of the laser is taken away by the water cooling liquid more quickly, the laser is dissipated in time, and the hidden danger of overheating of the laser is solved.
The features of the embodiments and embodiments described herein above may be combined with each other without conflict.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. A semiconductor laser heat dissipation device is characterized in that: including water-cooling piece and heat exchanger through pipeline interconnect, still including making water-cooling liquid be in the water-cooling piece with circulating water pump between the heat exchanger, the water-cooling piece is used for giving the laser instrument heat dissipation, is equipped with laser instrument installation hole site on it, and the laser instrument accessible laser instrument installation hole site is fixed in the water-cooling piece.
2. The semiconductor laser heat sink of claim 1, wherein: the water cooling block is provided with a heat conduction indium sheet on the end face of the laser mounting hole, and after the laser is mounted, the heat conduction indium sheet is located between the end face of the water cooling block and the laser mounting face.
3. A semiconductor laser heat sink as claimed in claim 2, wherein: the heat conduction indium sheet is arranged in the range of the laser installation hole site.
4. A semiconductor laser heat sink as claimed in claim 2, wherein: the water cooling block is provided with a temperature monitoring device on the end face of the laser mounting hole, and after the laser is mounted, the temperature monitoring device is located between the end face of the water cooling block and the laser mounting face and used for monitoring the surface temperature of the laser.
5. The semiconductor laser heat sink of claim 4, wherein: the temperature monitoring device is fixed on the heat conduction indium sheet and used for monitoring the surface temperature of the laser through monitoring the temperature of the heat conduction indium sheet.
6. The semiconductor laser heat sink of claim 4, wherein: the utility model discloses a laser instrument, including heat exchanger, water-cooling piece, water-cooling inlet and heat exchange delivery port, laser instrument installation hole site is located the up end of water-cooling piece, be equipped with total water inlet on the up end of water-cooling piece, external water-cooling liquid passes through total water inlet gets into the water-cooling piece, be provided with water-cooling water inlet and water-cooling delivery port on the relative both sides face that sets up of water-cooling piece respectively, what stagger from top to bottom was provided with heat transfer water inlet and heat transfer delivery port on the same terminal surface of heat exchanger, the heat transfer delivery port is located the top of heat transfer.
7. The semiconductor laser heat sink of claim 6, wherein: relative to the water-cooled water outlet, the total water inlet is closer to the water-cooled water inlet, and the water-cooled water outlet and the water-cooled water inlet are at the same height.
8. The semiconductor laser heat sink of claim 6, wherein: the heat exchanger comprises a serpentine channel and a heat dissipation piece, wherein an outlet and an inlet of the serpentine channel are respectively a heat exchange water outlet and a heat exchange water inlet, the heat dissipation piece is used for dissipating heat of water cooling liquid in the serpentine channel, and the heat dissipation piece comprises a heat dissipation fan and is located on one side of the serpentine channel.
9. The semiconductor laser heat sink of claim 8, wherein: the temperature monitoring device, the cooling fan and the water pump are all connected with a control chip, and the control chip has the function of controlling the rotating speed or power of the water pump and the cooling fan according to the surface temperature of the laser.
10. The semiconductor laser heat sink of claim 1, wherein: the reserve volume of the water-cooling liquid in the water-cooling block is more than that of the water-cooling liquid in the heat exchanger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020789502.8U CN211907948U (en) | 2020-05-13 | 2020-05-13 | Semiconductor laser heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020789502.8U CN211907948U (en) | 2020-05-13 | 2020-05-13 | Semiconductor laser heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211907948U true CN211907948U (en) | 2020-11-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020789502.8U Active CN211907948U (en) | 2020-05-13 | 2020-05-13 | Semiconductor laser heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211907948U (en) |
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2020
- 2020-05-13 CN CN202020789502.8U patent/CN211907948U/en active Active
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