CN211698862U - Be applied to radiator of computer - Google Patents

Be applied to radiator of computer Download PDF

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Publication number
CN211698862U
CN211698862U CN202020417619.3U CN202020417619U CN211698862U CN 211698862 U CN211698862 U CN 211698862U CN 202020417619 U CN202020417619 U CN 202020417619U CN 211698862 U CN211698862 U CN 211698862U
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China
Prior art keywords
heat
pipe
fixed mounting
computer
fan
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CN202020417619.3U
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Chinese (zh)
Inventor
胡艳辉
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Henan Branch Of National Prosecutions College
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Henan Branch Of National Prosecutions College
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Priority to CN202020417619.3U priority Critical patent/CN211698862U/en
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Abstract

The utility model discloses a be applied to radiator of computer, including heat pipe, set casing, heat abstractor, base and radiator fan, there are two sets of heat pipes in the inside of base through heated tube fixed mounting, the inside of heat pipe is provided with two sets of copper pipes, one side of copper pipe is provided with the side pipe, the side pipe has the pressure release accumulator with being connected out fixed mounting of copper pipe, the inside parcel of heat pipe has the protective layer, fixed mounting has heat abstractor between the heat pipe, there is the set casing one side of heat abstractor through bolt fixed mounting, the inside fixed mounting of set casing has radiator fan. The utility model discloses an at the inside coolant liquid that fills of heat pipe, compare in the traditional combination that only adopts heat-conducting plate and fin, can effectual elimination heat, compare simultaneously in the cost ratio of water cooling system than higher, the volume ratio is bigger simultaneously, and this device practicality is better.

Description

Be applied to radiator of computer
Technical Field
The utility model relates to a computer technology field specifically is a be applied to radiator of computer.
Background
The computer is commonly called computer, is an electronic computer for high-speed calculation, can perform numerical calculation and logic calculation, and also has the function of storage and memory. The intelligent electronic device can be operated according to a program, and can automatically process mass data at a high speed. The computer without any software is called a bare computer, the computer is provided with an electronic element such as a CPU, the surface area of the CPU is usually less than 2 square centimeters, but the power consumption reaches dozens of watts and hundreds of watts, if the heat cannot be conducted out in time, once the heat is accumulated in the CPU, the CPU is burnt and damaged, and therefore a radiator is needed to be adopted for auxiliary heat dissipation
The existing computer heat dissipation has the defects that:
the existing radiator simply adopts the combination of the heat conducting plate and the radiating fins, has a simple structure but poor radiating effect, and cannot well radiate the temperature of an electronic element, so that the working efficiency and the service life of the electronic element are influenced due to overhigh temperature of the electronic element during working;
and meanwhile, the existing heat dissipation device can also adopt a complex water cooling system, but the system has higher cost and larger volume, and cannot adapt to various different cases, so that the problem of low practicability is caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a be applied to radiator of computer to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a be applied to radiator of computer, includes heat pipe, set casing, heat abstractor, base and cooling fan, there are two sets of heat pipes in the inside of base through receiving thermal tube fixed mounting, the inside of heat pipe is provided with two sets of copper pipes, one side of copper pipe is provided with the side pipe, the side pipe has the pressure release accumulator with being connected out fixed mounting of copper pipe, the inside parcel of heat pipe has the protective layer, fixed mounting has heat abstractor between the heat pipe, there is the set casing one side of heat abstractor through bolt fixed mounting, the inside fixed mounting of set casing has cooling fan.
Preferably, the inside of base is provided with the fixed plate, and the bottom of fixed plate distributes has the fixed slot, and the both sides fixed mounting of fixed plate has the mounting panel.
Preferably, the heat dissipation device is internally provided with a framework, and fins are welded on two sides of the framework.
Preferably, the inside of set casing is provided with the protective housing, and the front butt fusion of protective housing has the pin, is provided with the mounting hole around the protective housing is positive.
Preferably, the heat dissipation fan is internally provided with a fan, and fan blades are distributed on the side surface of the fan.
Preferably, the heat transfer pipe is filled with a coolant.
Compared with the prior art, the beneficial effects of the utility model are that: this be applied to radiator of computer can effectual improvement device inside air flow rate through the radiator fan that is provided with, thereby make its device and air can be better carry out the heat exchange, simultaneously can be with the heat conduction of device inside to heat abstractor in the middle of through the heat pipe that is provided with, adopt pure copper to make simultaneously, can effectually conduct the inside heat of device, and the aluminum alloy that fin adopted makes, the effectual weight that reduces the device has saved the cost, adopt the heat pipe can lead out electronic component with the heat conduction simultaneously, thereby solved and led to the problem that the fin volume can not be too big because of the electronic component area is less, thereby can be fine give off electronic component's heat, the temperature of electronic component during operation has been reduced.
The utility model discloses an at the inside coolant liquid that fills of heat pipe, and when in-service use, the coolant liquid can be heated to the temperature risees, and the volume grow, thereby can make the liquid come-up of being heated take away the heat, compare in the traditional combination that only adopts heat-conducting plate and fin, can effectual elimination heat, compare in water cooling system's cost ratio simultaneously, the volume ratio is bigger simultaneously, this device practicality is better.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic side view of the present invention;
FIG. 3 is a schematic view of the structure of the heat pipe of the present invention;
fig. 4 is a schematic view of the structure of the base of the present invention.
In the figure: 1. a heat conducting pipe; 101. a copper pipe; 102. a heated tube; 103. a pressure relief reservoir; 104. a side tube; 105. a protective layer; 2. a stationary case; 201. a protective shell; 202. a stop lever; 203. mounting holes; 3. a heat sink; 301. a fin; 302. a framework; 4. a base; 401. a fixing plate; 402. fixing grooves; 403. mounting a plate; 5. a heat radiation fan; 501. a fan; 502. a fan blade.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, the present invention provides an embodiment: a heat sink applied to computer, including heat conduction pipe 1, fixed shell 2, heat dissipating double-fuselage 3, base 4 and cooling blower 5, the inside of the base 4 is fitted with two groups of heat conduction pipes 1 fixedly through the heated tube 102, the heat conduction pipe 1 can conduct the heat of the bottom of the apparatus to the heat dissipating double-fuselage 3 of the top, there are two groups of copper pipes 101 in the inside of the heat conduction pipe 1, the copper pipe 101 is made of pure copper, and the coefficient of thermal conductivity is 401W/MK, have good heat conductivity compared with the traditional aluminium tube that adopts, there is a side pipe 104 on one side of the copper pipe 101, the side pipe 104 can increase the contact area of heat conduction pipe 1 and heat dissipating double-fuselage 3, make it better conduct the heat stored in the heat conduction pipe 1 to the heat dissipating double-fuselage 3, the connection of the side pipe 104 and copper pipe 101 has a pressure relief reservoir 103 fixedly mounted, the pressure relief reservoir 103 makes its apparatus have, the inside parcel of heat pipe 1 has protective layer 105, protective layer 105 improves the leakproofness of device, prevent the problem of coolant liquid play device, fixed mounting has heat abstractor 3 between the heat pipe 1, heat abstractor 3 can effectually distribute out the heat in the middle of the device, there is set casing 2 one side of heat abstractor 3 through bolt fixed mounting, set casing 2 is used for fixed radiator fan 5, the stability of improving device, the inside fixed mounting of set casing 2 has radiator fan 5, radiator fan 5 can the inside air flow rate of effectual improvement device, thereby make its device and the air can be better carry out the heat exchange.
Further, a fixing plate 401 is arranged inside the base 4, the fixing plate 401 is used for fixing the device in an electronic component, fixing grooves 402 are distributed on the bottom of the fixing plate 401, the fixing grooves 402 can facilitate installation of the heated tube 102, mounting plates 403 are fixedly arranged on two sides of the fixing plate 401, and the mounting plates 403 are used for fixing the device and preventing the device from displacement.
Further, the framework 302 is arranged inside the heat dissipation device 3, the framework 302 can be used for fixing the fins 301, the problem of deformation of the fins 301 is effectively solved, the fins 301 are welded on two sides of the framework 302, the contact area of the device and air is increased by the fins 301, and the heat dissipation efficiency of the device is improved.
Further, the inside of set casing 2 is provided with protective housing 201, and protective housing 201 is used for the inside cooling fan 5 of fixed mounting, and the front welding of protective housing 201 has pin 202, and pin 202 can block object contact cooling fan 5, improves the security of device to and life, protective housing 201 are provided with mounting hole 203 around openly.
Further, a fan 501 is arranged inside the heat dissipation fan 5, the fan 501 can be turned by switching on a power supply, fan blades 502 are distributed on the side surface of the fan 501, and the fan blades 502 are used for driving air to flow.
Further, the inside of the heat conduction pipe 1 is filled with the coolant, thereby improving the heat conduction performance of the device.
The working principle is as follows: when the device is used, the device is firstly installed in a CPU (central processing unit) for calculation, meanwhile, the device can be fixed through the base 4, then the heat dissipation fan 5 is powered on, when the heated tube 102 is heated, heat can be conducted to the copper tube 101, the side tube 104 and cooling liquid, the copper tube 101 and the side tube 104 can gradually conduct the heat to the fins 301 inside the heat dissipation device 3, then the heat is taken away through the heat exchange between the fins 301 and air, meanwhile, the fan 501 inside the heat dissipation fan 5 rotates, therefore, the air circulation efficiency is improved, the heat exchange efficiency between the fins 301 and the air is increased, the cooling liquid can be heated, the temperature is increased, the size is increased, and the heated liquid can float upwards to take away the heat.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (6)

1. The utility model provides a be applied to radiator of computer, includes heat pipe (1), set casing (2), heat abstractor (3), base (4) and cooling blower (5), its characterized in that: the inside of base (4) has two sets of heat pipe (1) through receiving heat pipe (102) fixed mounting, the inside of heat pipe (1) is provided with two sets of copper pipes (101), one side of copper pipe (101) is provided with side pipe (104), side pipe (104) and being connected of copper pipe (101) go out fixed mounting and have pressure release accumulator (103), the inside parcel of heat pipe (1) has protective layer (105), fixed mounting has heat abstractor (3) between heat pipe (1), there is set casing (2) one side of heat abstractor (3) through bolt fixed mounting, the inside fixed mounting of set casing (2) has radiator fan (5).
2. The heat sink applied to the computer as claimed in claim 1, wherein: the fixing device is characterized in that a fixing plate (401) is arranged in the base (4), fixing grooves (402) are distributed on the bottom of the fixing plate (401), and mounting plates (403) are fixedly mounted on two sides of the fixing plate (401).
3. The heat sink applied to the computer as claimed in claim 1, wherein: a framework (302) is arranged inside the heat dissipation device (3), and fins (301) are welded on two sides of the framework (302).
4. The heat sink applied to the computer as claimed in claim 1, wherein: the novel protective shell is characterized in that a protective shell (201) is arranged inside the fixed shell (2), a stop lever (202) is welded to the front face of the protective shell (201), and mounting holes (203) are formed in the periphery of the front face of the protective shell (201).
5. The heat sink applied to the computer as claimed in claim 1, wherein: a fan (501) is arranged in the heat dissipation fan (5), and fan blades (502) are distributed on the side face of the fan (501).
6. The heat sink applied to the computer as claimed in claim 1, wherein: the heat transfer pipe (1) is filled with a coolant.
CN202020417619.3U 2020-03-27 2020-03-27 Be applied to radiator of computer Active CN211698862U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020417619.3U CN211698862U (en) 2020-03-27 2020-03-27 Be applied to radiator of computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020417619.3U CN211698862U (en) 2020-03-27 2020-03-27 Be applied to radiator of computer

Publications (1)

Publication Number Publication Date
CN211698862U true CN211698862U (en) 2020-10-16

Family

ID=72781850

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020417619.3U Active CN211698862U (en) 2020-03-27 2020-03-27 Be applied to radiator of computer

Country Status (1)

Country Link
CN (1) CN211698862U (en)

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