CN220629902U - Water-cooling heat dissipation device of full-immersion type server - Google Patents
Water-cooling heat dissipation device of full-immersion type server Download PDFInfo
- Publication number
- CN220629902U CN220629902U CN202322204107.5U CN202322204107U CN220629902U CN 220629902 U CN220629902 U CN 220629902U CN 202322204107 U CN202322204107 U CN 202322204107U CN 220629902 U CN220629902 U CN 220629902U
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- water
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- box
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- 238000001816 cooling Methods 0.000 title claims abstract description 33
- 238000007654 immersion Methods 0.000 title claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 title abstract description 13
- 238000012545 processing Methods 0.000 claims abstract description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 19
- 238000005057 refrigeration Methods 0.000 claims abstract description 9
- 238000010521 absorption reaction Methods 0.000 claims abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 36
- 238000005086 pumping Methods 0.000 claims description 20
- 239000000428 dust Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 9
- 239000007788 liquid Substances 0.000 abstract description 7
- 238000012546 transfer Methods 0.000 abstract description 6
- 238000012423 maintenance Methods 0.000 abstract description 3
- 239000002826 coolant Substances 0.000 abstract 3
- 239000000110 cooling liquid Substances 0.000 description 26
- 238000005265 energy consumption Methods 0.000 description 2
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a water-cooling heat dissipation device of a full-immersion type server, which belongs to the technical field of server heat dissipation and comprises a bearing box, wherein the bearing box is provided with an upper opening, a treatment box is arranged below one side of the bearing box, a heat conduction column is fixed on one side of the treatment box, the heat conduction column penetrates through one side wall of the treatment box and one side wall of the bearing box, a semiconductor refrigerating sheet is fixed in the middle part in the treatment box, and the heat absorption end face of the semiconductor refrigerating sheet guides the heat conduction column. Through setting up processing case, heat conduction post, semiconductor refrigeration piece and radiator fan, can be when circulation system maintains, the heat conduction post on the processing case can absorb the heat in the coolant liquid and with it transfer to the processing incasement, and the semiconductor refrigeration piece can carry the heat of transfer to exothermic end department and discharge through the radiator fan to realize cooling down to the coolant liquid, can prevent effectively that the coolant liquid temperature is too high in circulation system maintenance process, guarantee the normal work of server.
Description
Technical Field
The utility model relates to the technical field of server heat dissipation, in particular to a water-cooling heat dissipation device of a full-immersion server.
Background
With the rapid development of the emerging fields such as mobile internet, cloud computing, big data, artificial intelligence and the like, particularly after the special chips such as GPU, TPU and the like are deployed, the power of a server is greatly improved, and the energy consumption of a data center is increasingly remarkable. However, the conventional cooling technology cannot solve the problem of cooling chips in increasingly large servers, and has high PUE and high energy consumption. The indirectly cooled data center adopting cold plate direct contact has complex structure, higher cost and safety which is not verified by wide practical application, in order to overcome the technical problems, a server immersed heat dissipation system is developed in the prior art, and the existing server immersed heat dissipation system is generally divided into two types: one single phase submerged and the other two phase submerged. The immersion liquids used in both modes are organic inert liquids-fluorinated liquids.
The single-phase liquid cooling requires the boiling point of the cooling liquid to be high, so that the volatilization loss control of the cooling liquid is relatively simple, the compatibility with components of IT equipment is relatively good, and the cooling liquid does not need to be frequently supplemented; but has low heat dissipation efficiency relative to two-phase liquid cooling.
The existing full-immersion type server water-cooling heat dissipation device is used circularly by pumping cooling liquid through circulating equipment, but in the using process, the server is in an uninterrupted working state, the circulating equipment needs to be overhauled regularly, and the server cannot be stopped in the overhauling process, so that the temperature of the cooling liquid is increased continuously, and the use is inconvenient.
Disclosure of Invention
The utility model mainly aims to provide a water-cooling heat dissipation device of a full-immersion server.
The aim of the utility model can be achieved by adopting the following technical scheme:
the utility model provides a full immersion type server water cooling heat abstractor, includes bears the case, bear the case and be the upper shed, it installs the processing case to bear case one side below, processing case one side is fixed with the heat conduction post, just the heat conduction post runs through processing case with bear case one lateral wall, processing incasement middle part is fixed with the semiconductor refrigeration piece, the heat absorption end of semiconductor refrigeration piece is towards the heat conduction post, processing on the case keep away from bear and be fixed with the radiator fan on the case one lateral wall, the radiator fan with the heat release end of semiconductor refrigeration piece links to each other.
Preferably, a bottom plate is fixed below the bearing box, and through holes are uniformly formed in the bottom plate.
Preferably, a water distributor is arranged below the bottom plate, one end of the water distributor is connected with a water inlet pipe, and the water inlet pipe penetrates through one side wall of the bearing box.
Preferably, a circulating box is arranged on one side of the bearing box, and a pumping pump is fixed below one side in the circulating box.
Preferably, a pumping pipe is installed at one side of the pumping pump, and the pumping pump is connected with the bearing box through the pumping pipe.
Preferably, the other side of the pump is connected with a radiator through a pipeline, an exhaust fan is arranged on one side of the radiating fan, and a dust screen is arranged on the outer side of the exhaust fan.
Preferably, a circulating pump is installed on one side of the circulating box relative to the pumping pump, one end of the circulating pump is connected with the radiator through a pipeline, and the other side of the circulating pump is connected with the water inlet pipe.
The beneficial technical effects of the utility model are as follows:
according to the utility model, the treatment box, the heat-conducting column, the semiconductor refrigerating sheet and the heat-radiating fan are arranged, so that when the circulation system is maintained, the heat-conducting column on the treatment box can absorb heat in the cooling liquid and transfer the heat into the treatment box, and the semiconductor refrigerating sheet can convey the transferred heat to the heat-radiating end and discharge the heat through the heat-radiating fan, thereby realizing cooling of the cooling liquid, effectively preventing the temperature of the cooling liquid from being too high in the maintenance process of the circulation system, and ensuring the normal operation of the server.
Drawings
FIG. 1 is a schematic diagram of a water-cooled heat sink for a fully submerged server according to a preferred embodiment of the present utility model;
FIG. 2 is a cross-sectional view of a load tank, process tank and circulation tank in a preferred embodiment of a fully submerged server water cooling apparatus according to the present utility model;
fig. 3 is a schematic view showing the positions of a processing box, a heat conducting column, a semiconductor cooling fin and a cooling fan in a preferred embodiment of a water cooling device for a full immersion server according to the present utility model.
The reference numerals are explained as follows:
1. a carrying case; 2. a treatment box; 3. a heat conducting column; 4. a semiconductor refrigeration sheet; 5. a heat dissipation fan; 6. a bottom plate; 7. a through hole; 8. a water distributor; 9. a circulation box; 10. pumping; 11. a water pumping pipe; 12. a heat sink; 13. a circulation pump; 14. a water inlet pipe; 15. an exhaust fan; 16. a dust-proof net.
Detailed Description
In order to make the technical solution of the present utility model more clear and obvious to those skilled in the art, the present utility model will be described in further detail with reference to examples and drawings, but the embodiments of the present utility model are not limited thereto.
As shown in fig. 1-3, the water-cooling heat dissipation device of a full-immersion server provided in this embodiment includes a carrying case 1, the carrying case 1 is an upper opening, a processing case 2 is installed below one side of the carrying case 1, a heat conducting column 3 is fixed on one side of the processing case 2, and the heat conducting column 3 penetrates through the processing case 2 and one side wall of the carrying case 1, a semiconductor refrigerating sheet 4 is fixed in the middle part of the processing case 2, a heat absorbing end face of the semiconductor refrigerating sheet 4 guides the heat conducting column 3, a heat dissipating fan 5 is fixed on one side wall of the processing case 2 far away from the carrying case 1, the heat dissipating fan 5 is connected with a heat dissipating end of the semiconductor refrigerating sheet 4, and when the circulation system is maintained, the heat conducting column 3 on the processing case 2 can absorb heat in the cooling liquid and transfer the heat into the processing case 2, and the semiconductor refrigerating sheet 4 can transfer the transferred heat to the heat dissipating end and discharge the heat through the heat dissipating fan 5, so that the cooling liquid can be effectively prevented from being cooled in the circulation system maintenance process, and normal work of the server can be ensured.
The bottom plate 6 is fixed below the bearing box 1, through holes 7 are uniformly formed in the bottom plate 6, and cooling liquid subjected to cooling conveniently moves to the upper side of the bottom plate 6 through the through holes 7 to absorb heat generated by a server.
A water distributor 8 is arranged below the bottom plate 6, one end of the water distributor 8 is connected with a water inlet pipe 14, the water inlet pipe 14 penetrates through one side wall of the bearing box 1, cooled cooling liquid can enter the water distributor 8 through the water inlet pipe 14, and the cooling liquid is uniformly conveyed into the bearing box 1 through the water distributor 8.
The bearing box 1 is provided with a circulation box 9 on one side, a pump 10 is fixed below one side in the circulation box 9, and the circulation of the cooling liquid can be realized through the circulation box 9.
A water pumping pipe 11 is arranged on one side of the pump 10, and the pump 10 is connected with the bearing box 1 through the water pumping pipe 11, so that the pump 10 can conveniently pump high-temperature cooling liquid in the bearing box 1 through the water pumping pipe 11.
The radiator 12 is connected to the other side of the pump 10 through a pipeline, the exhaust fan 15 is arranged on one side of the radiating fan 5, the dust screen 16 is arranged on the outer side of the exhaust fan 15, high-temperature cooling liquid pumped by the pump 10 can be conveyed into the radiator 12 for cooling, heat generated in the cooling process is discharged through the radiating fan 5, and the dust screen 16 can prevent external dust from being attached to the radiator 12.
A circulating pump 13 is arranged on one side of the circulating box 9 relative to the pumping pump 10, one end of the circulating pump 13 is connected with the radiator 12 through a pipeline, the other side of the circulating pump 13 is connected with the water inlet pipe 14, and cooled cooling liquid enters the water distributor 8 along the water inlet pipe 14 through the pumping of the circulating pump 13.
The working principle of the device is as follows: when the device is specifically used, a worker fixes a server on a bottom plate 6 in a bearing box 1 according to requirements, then tilts cooling liquid in the bearing box 1, heat generated during operation of the server is absorbed through the cooling liquid, when the device is used, a pump 10 in a circulation box 9 pumps high-temperature cooling liquid in the bearing box 1 through a water pumping pipe 11, the high-temperature cooling liquid pumped by the pump 10 is conveyed into a radiator 12 for cooling, heat generated in the cooling process is discharged through a cooling fan 5, dust-proof nets 16 can prevent external dust from adhering to the radiator 12, the cooled cooling liquid enters a water distributor 8 along a water inlet pipe 14 through the pumping of a circulation pump 13, the water distributor 8 can evenly convey the cooling liquid into the bearing box 1, heat generated by the server is absorbed above the bottom plate 6 for circulation, when a circulation system is maintained in the use process, a heat conducting column 3 on a processing box 2 can absorb the heat in the cooling liquid and transfer the cooling liquid into the processing box 2, and the semiconductor cooling sheet 4 can convey the heat to the cooling liquid to the cooling end for cooling fan 5 for cooling, and the cooling end is discharged through the cooling fan for cooling.
The above is merely a further embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto, and any person skilled in the art will be able to apply equivalents and modifications according to the technical solution and the concept of the present utility model within the scope of the present utility model disclosed in the present utility model.
Claims (7)
1. The utility model provides a full immersion type server water-cooling heat abstractor which characterized in that: including bearing case (1), bear case (1) and be the upper shed, bear case (1) one side below and install processing case (2), processing case (2) one side is fixed with heat conduction post (3), just heat conduction post (3) run through processing case (2) with bear case (1) a lateral wall, processing case (2) in-middle part is fixed with semiconductor refrigeration piece (4), the heat absorption end of semiconductor refrigeration piece (4) is towards heat conduction post (3), be away from on processing case (2) be fixed with radiator fan (5) on bearing case (1) a lateral wall, radiator fan (5) with the exothermic end of semiconductor refrigeration piece (4) links to each other.
2. The water-cooled heat sink of a fully submerged server of claim 1, wherein: a bottom plate (6) is fixed below the bearing box (1), and through holes (7) are uniformly formed in the bottom plate (6).
3. The water-cooled heat sink of a fully submerged server of claim 2, wherein: a water distributor (8) is arranged below the bottom plate (6), one end of the water distributor (8) is connected with a water inlet pipe (14), and the water inlet pipe (14) penetrates through one side wall of the bearing box (1).
4. A fully submerged server water cooling heat sink according to claim 3, wherein: one side of the bearing box (1) is provided with a circulating box (9), and a pumping pump (10) is fixed below one side in the circulating box (9).
5. The water-cooled heat sink of a fully submerged server of claim 4, wherein: a water pumping pipe (11) is arranged on one side of the pump (10), and the pump (10) is connected with the bearing box (1) through the water pumping pipe (11).
6. The water-cooled heat sink of a fully submerged server of claim 5, wherein: the other side of the pump (10) is connected with a radiator (12) through a pipeline, one side of the radiating fan (5) is provided with an exhaust fan (15), and the outer side of the exhaust fan (15) is provided with a dust screen (16).
7. The water-cooled heat sink of a fully submerged server of claim 6, wherein: and a circulating pump (13) is arranged on one side of the circulating box (9) relative to the pumping pump (10), one end of the circulating pump (13) is connected with the radiator (12) through a pipeline, and the other side of the circulating pump (13) is connected with the water inlet pipe (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322204107.5U CN220629902U (en) | 2023-08-16 | 2023-08-16 | Water-cooling heat dissipation device of full-immersion type server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322204107.5U CN220629902U (en) | 2023-08-16 | 2023-08-16 | Water-cooling heat dissipation device of full-immersion type server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220629902U true CN220629902U (en) | 2024-03-19 |
Family
ID=90213414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322204107.5U Active CN220629902U (en) | 2023-08-16 | 2023-08-16 | Water-cooling heat dissipation device of full-immersion type server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220629902U (en) |
-
2023
- 2023-08-16 CN CN202322204107.5U patent/CN220629902U/en active Active
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